1 - PGA Image Sensor Sockets Series
I#####-##-E##-####95##
E-tec Interconnect Image Sensor Sockets provide higher reliability thanks the precision machined pins with incorporate a BeCu contact clip to ensure security of the imager while maintaining its pluggability.
The sensors can easily be plugged-in and unplugged to upgrade process.
We offer any pin-out, configuration and grid side down to 0.80mm pitch.
The E-tec Interconnect Image Sensor Sockets can be fix to your PCB by the follow soldering technologies :
Through-hole (THT)
Standard Surface mount (SMT)
Solderball Surface mount (SMT)
This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..
E-tec Interconnect can provide you a largest line of Image Sensor Sockets for Imaging industry. Our sockets are created for:
Sony, Teledyne, Kodak, Motorola, and all other manufacturer, please send us your request.
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2 - BGA Image Sensor Adapter Series
ISD###-##-E##-####95##
E-tec Interconnect BGA Image Sensor Adapters Series mounting solution is composed from :
One BGA Adapter and One Image Sensor Socket
BGA Adapter:
Your BGA Image Sensor must first be solder on the top of the E-tec Interconnect BGA Adapter (this operation converting your BGA Image Sensor to a PGA component and you can plugged it into the Image Sensor Socket.
Image Sensor Socket:
The E-tec Interconnect Image sensor Socket provide higher reliability thanks the precision machined pins with incorporate a BeCu contact clip to ensure security of the imager while maintaining its pluggability.
The sensors can easily be plugged-in and unplugged to upgrade process.
The E-tec Interconnect Image Sensor Sockets can be fix to your PCB by the follow soldering technologies :
Through-hole (THT)
Standard Surface mount (SMT)
Solderball Surface mount (SMT)
This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..
E-tec Interconnect can provide you a largest line of Image Sensor Sockets for Imaging industry. Our sockets are created for:
Sony, Teledyne, Kodak, Motorola, and all other manufacturer, please send us your request.
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3 - LGA Image Sensor Adapter Series
IS####-##-E##-####95##
E-tec Interconnect LGA Image Sensor Adapters Series mounting solution is composed from :
One LGA Adapter and One Image Sensor Socket
LGA Adapter:
Your LGA Image Sensor must first be solder on the top of the E-tec Interconnect LGA Adapter (this operation converting your LGA Image Sensor to a PGA component and you can plugged it into the Image Sensor Socket.
Image Sensor Socket:
The E-tec Interconnect Image sensor Socket provide higher reliability thanks the precision machined pins with incorporate a BeCu contact clip to ensure security of the imager while maintaining its pluggability.
The sensors can easily be plugged-in and unplugged to upgrade process.
We offer any pin-out, configuration and grid side down to 0.80mm pitch.
The E-tec Interconnect Image Sensor Sockets can be fix to your PCB by the follow soldering technologies :
Through-hole (THT)
Standard Surface mount (SMT)
Solderball Surface mount (SMT)
This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..
E-tec Interconnect can provide you a largest line of Image Sensor Sockets for Imaging industry. Our sockets are created for:
Sony, Teledyne, Kodak, Motorola, and all other manufacturer, please send us your request.
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4 - BGA - LGA Image Sensor Sockets Series
ISB###-##-E##-####95##
E-tec Interconnect BGA / LGA Image Sensor Sockets provide higher reliability thanks the precision machined contacts ensure security of the imager while maintaining in contact.
The sensors can easily be placed into the socket and take away easly, to upgrade process, thanks the special closing system.
We offer any pin-out, configuration and grid side down to 0.40mm pitch
The E-tec Interconnect BGA / LGA Image Sensor Sockets can be fix to your PCB by the follow technologies :
Through-hole (THT) soldering
Standard Surface mount (SMT) soldering
Solderball Surface mount (SMT) soldering
Solderless Compression Technology
This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..
E-tec Interconnect can provide you a largest line of Image Sensor Sockets for Imaging industry. Our sockets are created for:
Sony, Teledyne, Kodak, Motorola, and all other manufacturer, please send us your request.
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5 - BGA - LGA Image Sensor Embeded Series
Imaging Embeded
E-tec Interconnect BGA / LGA Image Sensor Embeded Sockets provide higher reliability at reduced price thanks the injected body and closing system. The Embeded socket are also equiped with precision machined contacts to ensure security of the imager while maintaining in contact.
The sensors can easily be placed into the socket and take away easly, to upgrade process, thanks the special closing system.
We offer any pin-out, configuration and grid side down to 0.40mm pitch
The E-tec Interconnect BGA / LGA Image Sensor Embeded Sockets can be fix to your PCB by the follow technologies :
Through-hole (THT) soldering
Standard Surface mount (SMT) soldering
Solderball Surface mount (SMT) soldering
Solderless Compression Technology
This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..
E-tec Interconnect BGA / LGA Image Sensor Embeded Sockets are full custom designs, please send us your request.
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6 - ZIF-Pro PGA - BGA Image Sensor Series
#SA###-####-####55L
E-tec Interconnect ZIF-Pro BGA Image Sensor Sockets provide higher reliability thanks the special contacts ensure security of the imager while maintaining in contact.
The sensors can easily be placed into the socket and take away easly, to upgrade process, thanks the special Zero Insertion force system.
We offer any pin-out, configuration and grid side down to 0.50mm pitch
The E-tec Interconnect ZIF-Pro BGA Image Sensor Sockets can be fix to your PCB by the follow technologies :
Through-hole (THT) soldering
Standard Surface mount (SMT) soldering
Solderball Surface mount (SMT) soldering
Solderless Compression Technology
This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..
E-tec Interconnect can provide you a largest line of Image Sensor Sockets for Imaging industry. Our sockets are created for:
Sony, Teledyne, Kodak, Motorola, and all other manufacturer, please send us your request.
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Low Cost Stamped DIP IC-Socket
LOC-xxx-T051-99
LOC Low cost DIP sockets with stamped contacts, Open insulator 6 to 48 pin versions in pitch 2.54 mm and DIP spacing 7.62 mm (.300"), 10.16 (.400") 15.24 mm (.600"). Plating Tin
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Precision Cystral Oscillator Socket THT
COS-xxx-S001-95
DIP IC-Socket Cystral Oscillator Socket THT Through hole precision turned contacts, DIP spacing 7.62 mm (.300") 8 , 14 or 16 pin configuration. Plating Tin/Gold
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Precision DIP Board Spacer Adapter THT Through hole
Pxx-xxx-Sxxx-xx
DIP IC-Socket THT Through hole Board Stacker precision turned contacts, supplied with our without bars in the center for open insulators. Closed insulators also available. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets SMD Capacitors
QIT-xxx-S001-95
QIT IC-Socket THT Through hole precision turned contacts, supplied with SMD capacitor, closed insulators. 8 to 40 pin versions in pitch 2.54 mm and DIP spacing 7.62 mm (.300"), 15.24 mm (.600"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets THT Through hole Board Stacker
Pxx-Sxxx-xx
DIP IC-Socket THT Through hole precision turned contacts, supplied with our without bars in the center for open insulators. Closed insulators also available. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). For raised component requirements and stacking of PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets THT Through hole Low profile
LOP-xxx-S083-xx
DIP IC-Socket THT Through hole precision turned contacts siting 2.41 mm above the PCB, supplied with open insulators. Closed insulators, Open insulator on request. DIP spacing 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600"). Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets THT Through hole Standard profile
Pxx-Sxxx-xx
DIP IC-Socket THT Through hole precision turned contacts, supplied with our without bars in the center for open insulators. Closed insulators also available. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets THT Through hole Super low profile
DSP-xxx-Exxx-xx
DIP IC-Socket THT Through hole precision turned contacts siting 0.60 mm above the PCB, supplied with Epoxy insulators. Closed insulators only on request available. DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets THT Through hole for Automatic Insertion
POA-xxx-Sxxx-xx
DIP IC-Socket THT Through hole precision turned contacts, supplied with Open frame socket with rails under the plastic for auto-insert machines, 8 to 40 pin versions in pitch 2.54 mm and DIP spacing , 7.62 mm (.300"), 15.24 mm (.600"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin.
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Precision DIP IC-Sockets Wired Capacitors
QIT-xxx-W001-95
QIT IC-Socket THT Through hole precision turned contacts, supplied with Wired capacitor, open insulators. 8 to 40 pin versions in pitch 2.54 mm and DIP spacing 7.62 mm (.300"), 15.24 mm (.600"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision Quad-in-line Sockets THT
QIL-764-S001-95
DIP IC-Socket Quad-in-line Socket THT Through hole precision turned contacts, for Rockwell & NEC Chip, 64 pin configuration. Plating Tin/Gold
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Precision Shrink DIP Sockets THT Through hole
SDx-xxx-Xxxx-xx
DIP IC-Socket THT Through hole precision turned contacts, supplied with open or closed insulators. 24 to 64 pin versions in pitch 1.778 mm and DIP spacing 10.16 mm (.400"), 15.24 mm (.600") and 19.05 mm (.750"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision Shrink SIP Sockets THT Through hole
SDS-xxx-Xxxx-xx
SIP Strips Socket THT Through hole precision turned contacts, supplied with breakable insulators. 32 pin versions in pitch 1.778 mm. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision DIP IC-Sockets SMT Gullwing Style Terminal
PSx-xxx-H094-95
DIP IC-Socket SMT Gullwing bended precision turned contacts, supplied with our without bars in the center for open insulators. Closed insulators also available. Pick & Place pad option. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Platings Tin/Gold.
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Precision DIP IC-Sockets SMT Reversed Gullwing Style Terminal
PSx-xxx-HR94-95
DIP IC-Socket SMT Reversed Gullwing bended precision turned contacts, supplied with our without bars in the center for open insulators. Closed insulators also available. Pick & Place pad option. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Platings Tin/Gold.
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Precision DIP IC-Sockets SMT Staight Terminal
PSx-xxx-H093-95
DIP IC-Socket SMT Straight precision turned contacts, supplied with our without bars in the center for open insulators. Closed insulators also available. Pick & Place pad option. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Platings Tin/Gold.
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Precision Shrink DIP Sockets SMT
SDx-xxx-Xxxx-xx
DIP IC-Socket SMT precision turned contacts, supplied with open or closed insulators. 24 to 64 pin versions in pitch 1.778 mm and DIP spacing 10.16 mm (.400"), 15.24 mm (.600") and 19.05 mm (.750"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision Shrink SIP Sockets SMT
SDS-xxx-Xxxx-xx
SIP Strips Socket SMT precision turned contacts, supplied with breakable insulators. 32 pin versions in pitch 1.778 mm. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Aluminium Carriers Precision DIP IC-Sockets THT Through hole
DCA-xxx-Sxxx-95
DIP IC-Socket THT Through hole precision turned contacts, supplied with Aluminium carrier body. Convenient way to load loose receptacles on a PCB board. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Carrier Socket Strips THT Through hole Single Row
SCP-1xx-Sxxx-95
Socket Strips THT Through hole precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm, Convenient way to load loose receptacles on a PCB board. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Carrier Socket Strips THT Through hole Dual Rows
SCP-2xx-Sxxx-95
Socket Strips THT Through hole precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, Convenient way to load loose receptacles on a PCB board. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Plastic Carriers Precision DIP IC-Sockets THT Through hole
DCP-xxx-Sxxx-95
DIP IC-Socket THT Through hole precision turned contacts, supplied with Plastic insulators. Convenient way to load loose receptacles on a PCB board. 6 to 64 pin versions in pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600") and 22.86 mm (.900"). Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Precision Horizontal LED-LCD Display sockets THT
LEH-xxx-Sxxx-95
Horizontal Display IC-Socket THT Through hole precision turned contacts designed to hold many different IC's, Displays and DIP Switches. Supplied with closed insulators and contact pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600"). Each pin pole number can be supplied according to your needs. Platings Tin/Gold.
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Precision DIP Vertical LED-LCD DisplayDisplay sockets THT
LEH-xxx-Sxxx-95
Vertical Display IC-Socket THT Through hole precision turned contacts designed to hold many different IC's, Displays and DIP Switches. Supplied with closed insulators and contact pitch 2.54 mm and DIP spacing 5.08 mm (.200"), 7.62 mm (.300"), 10.16 mm (.400"), 15.24 mm (.600"). Each pin pole number can be supplied according to your needs. Platings Tin/Gold.
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Socket Strips THT Through hole Standard profile SIB
SIB-1xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm, breakable and solid insulator and with terminal head flush or above from plastic. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Standard profile DIS
DIS-2xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, breakable and solid insulator and with terminal head flush or above from plastic. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Standard profile TIS
TIS-3xx-Exxx-xx
Socket Strips THT Through hole precision turned contacts, available in 3-rows in pitch and row spacing 2.54 mm, breakable and solid insulator and with terminal head flush or above from plastic. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Board Stacker SIB
SIB-1xx-Xxxx-95
Socket Strips THT Through hole precision Board Stacker turned contacts, available in 1-row in pitch and row spacing 2.54 mm, go higher that the normal height of 4.45mm, to be able to build over top componets on your PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Board Stacker DIS
DIS-2xx-Xxxx-95
Socket Strips THT Through hole precision Board Stacker turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, go higher that the normal height of 4.45mm, to be able to build over top componets on your PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Board Stacker TIS
TIS-3xx-Exxx-95
Socket Strips THT Through hole precision Board Stacker turned contacts, available in 3-rows in pitch and row spacing 2.54 mm, go higher that the normal height of 4.45 mm, to be able to build over top componets on your PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Low profile
SLP-xxx-Xxxx-xx
Socket Strips THT Through hole precision Low turned contacts, available in 1 -2 or 3 row in pitch and row spacing 2.54 mm and 2.41 mm max hight and 0.60 mm minimum height. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Super low profile
SLP-xxx-Xxxx-xx
Socket Strips THT Through hole precision Super low turned contacts, available in 1 -2 or 3 row in pitch and row spacing 2.54 mm and 2.41 mm max hight and 0.60 mm minimum height. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole 90 degrees horizontal SIB
SIB-1xx-R900-95
Socket Strips THT Through hole 90° bended precision turned contacts, 1-row in pitch and row spacing 2.54 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole 90 degrees horizontal DIS
DIS-2xx-R900-95
Socket Strips THT Through hole 90° bended precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole vertical SIB
SIB-1xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm, Different predefined terminals heights are available. Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole vertical DIS
DIS-2xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, Different predefined terminals heights are available. Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole vertical TIS
TIS-3xx-Exxx-xx
Socket Strips THT Through hole precision turned contacts, available in 3-rows in pitch and row spacing 2.54 mm, Different predefined terminals heights are available. Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole 90 degrees horizontal SIB
SIB-1xx-R921-xx
Socket Strips THT Through hole 90° bended precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm . Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole 90 degrees horizontal DIS
DIS-2xx-R921-xx
Socket Strips THT Through hole 90° bended precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm . Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips SMT Super low profile
SSP-xxx-E144-xx
Socket Strips SMT precision turned contacts, available in 1 , 2 or 3-rows in pitch and row spacing 2.54 mm with a height above PCB 0.60 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips SMT Standard profile Dual Row
DSS-2xx-H094-xx
Socket Strips SMT precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm with a height of 5.60 mm . Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips SMT Standard profile Single Row
SSB-1xx-H094-xx
Socket Strips SMT precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm with a height of 5.60 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Jumbo Adapter Strips THT Through hole 90 degrees horizontal
SLx-xxx-A379-xx
Socket Strips THT Through hole 90° bended adapter precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm. Fit to the Jumbo Socket Strips . Platings Tin or Gold.
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Jumbo Adapter Strips THT Through hole vertical
SLx-xxx-G379-xx
Socket Strips THT Through hole adapter precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm. Fit to the Jumbo Socket Strips . Platings Tin or Gold.
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Jumbo Socket Strips SMT Low profile
BSx-xxx-G560-95
Socket Strips SMT low profile precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 5.60 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips SMT Standard profile
BSx-xxx-G860-95
Socket Strips SMT precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 8.60 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole 90 degrees horizontal
BLx-xxx-A700-95
Socket Strips THT Through hole 90° bended precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 2.54 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Clinched type
BLx-xxx-G799-95
Socket Strips THT Through hole precision turned contacts, available in 1 row in pitch and row spacing 2.54 mm with plastic height above PCB 7.00 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Low 4.50 mm profile
BLx-xxx-G109-95
Socket Strips THT Through hole precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 4.50 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Press fit type
BLx-xxx-G065P-95
Socket Strips THT Through hole precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 7.00 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Standard 7.00 mm profile
BLx-xxx-G700-95
Socket Strips THT Through hole precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 7.00 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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LCC Sockets SMT JEDEC Type C
LCC-xxx-H200-55
LCC Sockets SMT production sockets for JEDEC Type "C" LCC chips. Socket design for automatic assembly and vacuum pick and place machines. In order to ensure compatibility with newer generation 44-pin LCC chip packages we have replaced the previous H200 contact style by new style H403. The previous generation 44-pin chip packages are also adapted to this new contact style. The SMT terminals extend beyond the side of the socket body, which permits direct access of the infrared heat to the terminal, thus preventing an undesired heat exposure of the insulator. Optional retention clips are available, which can be mounted and demounted without any tools. Chips can be easily removed with the Universal extraction tool PUL-200.
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LCC Sockets THT Through hole JEDEC Type C
LCC-xxx-H210-55
LCC Sockets THT Through hole production sockets for JEDEC Type "C" LCC chips. Socket design for automatic assembly and vacuum pick and place machines. Optional retention clips are available, which can be mounted and demounted without any tools. Chips can be easily removed with the Universal extraction tool PUL-200.
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Special Customer LCC Sockets SMT
LCC-044-H403-55
Special Customer LCC Sockets SMT production sockets. Socket special design for custom packages, adpated to the special dimensions. The SMT terminals extend beyond the side of the socket body, which permits direct access of the infrared heat to the terminal, thus preventing an undesired heat exposure of the insulator. Optional retention clips are available, which can be mounted and demounted without any tools. Chips can be easily removed with the Universal extraction tool PUL-200.
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MGS MiniGrid Array Adapter terminal THT from Pitch 2.00mm down to 1.27mm
MGSxxx-E774-xxX55xx
MGS MiniGrid Socket THT Through hole adapter precision turned contacts, High temp Insulator Epoxy. Pitch 1.27 to 2.00 mm available, other on request. Possibility to have any pin-out, configuration and grid size adapted to the chip and customer requirements. Open frame socket bodies are also available on request. Special terminal designs are possible on request also. Platings Tin or Gold.
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MGS MiniGrid Array Sockets SMT, from Pitch 2.00mm down to 0.80mm
MGSxxx-Exxx-xxX95xx
MGS MiniGrid Socket SMT hole precision turned contacts, High temp Insulator Epoxy. Pitch 0.80 to 2.00 mm available, other on request. Possibility to have any pin-out, configuration and grid size adapted to the chip and customer requirements. Open frame socket bodies are also available on request. Special terminal designs are possible on request also. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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MGS MiniGrid Array Sockets THT, from Pitch 2.00mm down to 0.80mm
MGSxxx-Exxx-xxX95xx
MGS MiniGrid Socket THT Through hole precision turned contacts, High temp Insulator Epoxy. Pitch 0.80 to 2.00 mm available, other on request. Possibility to have any pin-out, configuration and grid size adapted to the chip and customer requirements. Open frame socket bodies are also available on request. Special terminal designs are possible on request also. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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PGA Pin Grid Array Adapter terminal THT Through hole
PGA-xxx-Xxxx-xxX-xx
PGA Sockets THT Through hole Adapter precision turned contacts with Insulator code “S” will be supplied either in plastic or with Insulator code “E” FR4 Epoxy depending on material availability and contact pitch 2.54 mm. Any configuration is possible from customer specific to predefined configuration. You may choose between open frame and closed frame socket bodies. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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PGA Pin Grid Array Sockets THT Through hole and SMT
PGA-xxx-Xxxx-xxX-xx
PGA Sockets THT Through hole & SMT precision turned contacts with Insulator code “S” will be supplied either in plastic or with Insulator code “E” FR4 Epoxy depending on material availability and contact pitch 2.54 mm. Any configuration is possible from customer specific to predefined configuration. You may choose between open frame and closed frame socket bodies. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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PGA Pin Grid Array Super Low Profile
PGS-xxx-Exxx-xxX-xx
PGA Sockets THT Super Low Profile precision turned contacts contacts siting 0.60mm above the PCB with Insulator code “E” FR4 Epoxy and contact pitch 2.54 mm. Any configuration is possible from customer specific to predefined configuration. You may choose between open frame and closed frame socket bodies. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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PGI Interstitial Pin Grid Array Adapter terminal THT Through hole
PGI-xxx-Xxxx-xxX-xx
PGI Sockets THT Through hole Adapter precision turned contacts with with Insulator code “E” FR4 Epoxy and contact pitch 2.54 mm x 1.27 mm. Any configuration is possible from customer specific to predefined configuration. You may choose between open frame and closed frame socket bodies. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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PGI Interstitial Pin Grid Array Sockets THT Through hole and SMT
PGI-xxx-Xxxx-xxX-xx
PGI Sockets THT Through hole & SMT precision turned contacts with Insulator code “E” FR4 Epoxy and contact pitch 2.54 mm x 1.27 mm. Any configuration is possible from customer specific to predefined configuration. You may choose between open frame and closed frame socket bodies. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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1 - Special Customer PLS Series PLCC Socket Low profile SMT
PLU-044-H901-99
Special Customer PLCC Socket SMT Designed for special packages, only 4.60mm height above board. Identical PCB layout for socket and chip. Solder terminals visible for post solder checks. Diagonal slots for easy extraction of the chip with the Universal extraction tool PUL-200.
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2 - Standard PLS Series PLCC Socket Low profile SMT JEDEC Standards
PLS-xxx-H105-99
Standard PLS Series PLCC Socket SMT JEDEC Standards, only 4.60mm height above board. Identical PCB layout for socket and chip. Solder terminals visible for post solder checks. Available with index pins under the insulator for correct orientation of the sockets. Diagonal slots for easy extraction of the chip with the Universal extraction tool PUL-200. Also available in reel packaging.
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3 - Hi-rel PLP Series PLCC Socket SMT JEDEC Standards
PLP-xxx-H100-99
E-tec „hi-rel“ SMT PLCC sockets correspond to JEDEC Norms. Precision stamped contact design provides special „push-down effect“onto the leads of the chip. For very high shock and vibration applications a chip retention clip can be obtained on request. Inside polarisation corner prevents wrong insertion of the chips. Stand-off under the base prevents solder shorts. Chips can be easily removed with the Universal extraction tool PUL-200.
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Commercial PLE Series PLCC Socket THT Through hole JEDEC Standards
PLE-xxx-N115-99
The „commercial“ PLE sockets have very solid solder legs for safe assembly to PCB. The sockets are designed to accept PLCC Chips according to JEDEC standards. The sockets are correctly oriented in the tubes for automatic pick and place. Chips can be easily removed with the Universal extraction tool PUL-200.
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Hi-rel PLP Series PLCC Socket THT Through hole JEDEC Standards
PLP-xxx-N110-99
E-tec „hi-rel“ soldertail PLCC sockets correspond to JEDEC Norms. Precision stamped contact design provides special „push-down effect“onto the leads of the chip. Optional retention clips for very high shock and vibration applications. Inside polarisation corner prevents wrong insertion of the chips. Stand-off under the base prevents solder shorts. Chips can be easily removed with the Universal extraction tool PUL-200.
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Precision Fuse Holders Sockets
TOS-202-S001-95
Fuse Holders Sockets THT Through precision turned contacts designed for TR-5 Fuse Holders. Others on request. Embedded terminal prevent shortings. High contact reliability. Platings Tin/Gold.
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Precision Transistor and TO-Sockets
TOS-xxx-S118-95
Transistor & TO-Sockets THT Through or SMT precision turned contacts designed for TO-5 and TO18 packages. 3-pole for transistors. Embedded terminal prevent shortings. High contact reliability. Platings Tin/Gold.
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Special F-Contact Strip 90 degrees Board-to-board
PCB-xxx-Rxxx-99/x
Special F-Contact 90 degrees Board-to-board 2,50 mm / 5,00 mm / 7,50 mm pitch connector for 90° board-to-board connections. Compatible with ITT Cannon G09 connectors. Ultra low profile with only 1.80 mm above board. Used in consumer as well as industrial applications. Any pincount available between 1 and 27. Plastic can be easily broken to desired size. Tin Plated
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2.54mm pitch - SMT - 1, 2-row Strips. 3.00mm profile. Contact live 100K cycles
PPS-xxx-H3xx-67 X
Spring-Loaded Contact Connectors, 2.54mm pitch, single and double row contacts strip, gold plated precision machined contacts. Sourface mount (SMT) soldering technology. Plastic insulator height 3.00mm.
Number of contacs availability:
Single row : 2 to 10 contacts
Double row : 4 to 20 contacts.
The contacts have 1.15mm to 1.40mm stroke with the option from 4.50mm to 5.50mm contact height. Location options.
Contact live 100K cycles
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2.54mm pitch - SMT - 1, 2-row Strips. 4.00mm profile. Contact live 100K cycles
PPS-xxx-H4xx-67 X
Spring-Loaded Contact Connectors, 2.54mm pitch, single and double row contacts strip, gold plated precision machined contacts. Sourface mount (SMT) soldering technology. Plastic insulator height 4.00mm.
Number of contacs availability:
Single row : 2 to 10 contacts
Double row : 4 to 20 contacts.
The contacts have 1.40mm stroke with the option from 6.00mm to 7.50mm contact height. Location options.
Contact live 100K cycles
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2.54mm pitch - SMT - 1, 2-row Strips. 4.00mm profile. Contact live 50K cycles
PPS-xxx-M4xx-67
Spring-Loaded Contact Connectors, 2.54mm pitch, single and double row contacts strip, gold plated precision machined contacts. Sourface mount (SMT) soldering technology. Plastic insulator height 4.00mm
Number of contacs availability:
Single row : 2 to 10 contacts
Double row : 4 to 20 contacts..
The contacts have 1.40mm stroke with the option from 6.00mm to 7.50mm contact height.
Contact live 50K cycles
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2.54mm pitch - THT - 1, 2-row Strips. 4.00mm profile. Contact live 50K cycles
PPT-xxx-M4xx-67 X
Spring-Loaded Contact Connectors, 2.54mm pitch, single and double row contacts strip, gold plated precision machined contacts. Sourface mount (SMT) soldering technology. Plastic insulator height 4.00mm.
Number of contacs availability:
Single row : 2 to 64 contacts
Double row : 4 to 72 contacts.
The contacts have 1.40mm stroke with the option from 6.00mm to 7.50mm contact height. Location options.
Contact live 50K cycles
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Spring-Loaded Contact Pins
APP-xxx-xxxx
Spring loaded contacts can be found in numerous environments for consumer and professional electronic applications in fixed or mobile equipments for communications, automotive, loading stations, SIM card connectors, docking stations, test & measurement instruments, cameras (picture & film), medical apparatus and many more. The probe pin and connector designs are generally specifically adapted to customer requirements.
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Lose Precision Contacts terminals with and without Clip
PIN-Sxxx-xx
E-tec offer you a lot of different types of Terminals ready to use. Special design on request.
See the full liste here down:
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DIMM Sockets DM Series 100 pins
DM1-100-VCA9-95/1L
DIMM Sockets -THT - vertical for for UD-RAM modules 3,3V. DM Series 100 pins are only available as long latch type (Module locking extractors). Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature for long contact life. Selective Gold/Tin plated. Gold only in contact area.
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DIMM Sockets DM Series 168 pins 25 degrees slanted
DM1-168-SxA8-95/1L
DIMM Sockets - THT - 168-pin slanted 25° for D-RAM, SD-RAM and UD-RAM modules in 3,3V version. Are only available as long latch type (Module locking extractors). Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature for long contact life. Selective Gold/Tin plated. Gold only in contact area.
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DIMM Sockets DM Series 168 pins 90 degrees right angle
DM1-168-RCA9-95/1L
DIMM Sockets - THT - 168-pin horizontal 90° for UD-RAM modules in 3,3V version. Are only available as long latch type (Module locking extractors). Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature for long contact life. Selective Gold/Tin plated. Gold only in contact area.
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DIMM Sockets DM Series 168 pins vertical
DM1-168-VAB9-95/1L
DIMM Sockets - THT - vertical, 168-pin for D-RAM, SD-RAM and UD-RAM modules 3,3V and 5,0V. DM Series 168 pins vertical are only available as long latch type (Module locking extractors). Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature for long contact life. Selective Gold/Tin plated. Gold only in contact area.
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DIMM Sockets DR Series for DDR III Module 240 pins vertical
DR1-240-VAZ9-95/0LX
DIMM Sockets - THT - 240-pin DDR-III for DDR III modules in 1,5V version. Are only available as long latch type (Module locking extractors). Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. 1.00 mm pitch contacts are designed with an anti-overstress feature for long contact life. Selective Gold/Tin plated. Gold only in contact area.
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DIMM Sockets DR Series for DDR Module 184 pins vertical
DR1-184-VBZ9-95/1L
DIMM Sockets - THT - 184-pin vertical DDR for DDR modules in 2.5V version. Are only available as long latch type (Module locking extractors). Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature for long contact life. Selective Gold/Tin plated. Gold only in contact area.
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SIMM Sockets SM Series 26 degress slanted
SM1-xxx-TS99-99/1M
1.27 mm pitch SIMM sockets -THT- made in hi-temp resistant LCP. 72- and 80-pin single row types in slanted version ( 26°). Easy insertion of the SIM modules, secure hold by the side "metal latch". Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature.
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SIMM Sockets SM Series Vertical
SM1-xxx-TV99-99/1Mx
1.27 mm pitch SIMM Sockets - THT - vertical version 72- and 80-pin single row. Easy insertion of the SIM modules, secure hold by the side "metal latch". Insertion & extraction of the module can be made without any tools. Positive polarization prevents wrong insertion of the module. Contacts are designed with an anti-overstress feature.
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SO-DIMM sockets - SMT - horizontal for DDR modules 260-pin
DMD-260-RLG9-55/TR
SO-DIMM sockets 260-pin horizontal for SD-RAM types 1.2V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets - SMT - 5.20mm height for DDR modules 204-pin
DMD-204-RSF9-55/TR
SO-DIMM sockets 204-pin 5.20mm height for SD-RAM types 1.5V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets - SMT - for D-RAM modules 144-pin
DMD-144-RSA9-55
EOL
SO-DIMM sockets 144-pin available in different heights, also as "Piggyback". Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module.
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SO-DIMM sockets - SMT - for DDR modules 200-pin
DMD-200-RXX9-55
SO-DIMM sockets 200-pin for SD-RAM types 1.8V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets - SMT - vertical for DDR modules 204-pin
DMD-204-VLF9-55
SO-DIMM sockets 204-pin for SD-RAM types 1.5V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets - SMT - vertical for DDR modules 260-pin
DMD-260-VLG9-5x/DT
SO-DIMM sockets 260-pin vertical for SD-RAM types 1.2V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module.
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SO-DIMM sockets - SMT - vertical for DDR modules 288-pin
DMD-288-VF49-9x/8L
SO-DIMM sockets 288-pin vertical for SD-RAM types 1.2V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module.
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Special and Customer design precision Sockets
Special Sockets and customer specific design
E-tec can offer a variety of special sockets but there are also possibilities to follow your special needs. Please contact us.
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PGA Extraction Tools
PUL-2300-x
For extraction of PIN-GRID-ARRAYS from sockets with high extraction force, the four side grip claw type is recommended in order to prevent damaging the Array. The multi-range tools have spindle actuation and a lifting mechanism with movable support jaws. Solid aluminium crossbars ensure even load distribution during the extraction operation. Their relatively large lift of approx. 15mm also permits safe extraction of arrays with bonded-on heat sinks.
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PLCC - SOJ - LCC Extraction Tools
PUL-200
It only requires ONE tool for extracting PLCC & SOJ chips of all pin configurations and LCC 32- and 44-pin chips (E-PROM's). The plastic arms sit on the side, thus avoiding an extraction force on the socket itself. This is most important for SMD sockets, which would otherwise be torn off the board. The same tool can be used for all sockets built according to JEDEC standards and having diagonal entry slots.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEJ####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEF####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEM####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEH####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEL####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEQ####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BED####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BER####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BES####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BET####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEB####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BEW####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUJ####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUF####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUM####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUH####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (>200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUL####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUQ####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUD####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUR####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUS####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUT####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUB####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
BUW####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEJ####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEF####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEM####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEH####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEL####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEQ####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BED####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BER####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BES####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BET####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEB####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BEW####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUJ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package Test Socket 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUF####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUM####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUH####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUL####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUQ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUD####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUR####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUS####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUT####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUB####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package Test Socket 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BUW####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEJ####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEF####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEM####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEH####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEL####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEQ####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BED####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BER####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BES####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BET####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEB####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BEW####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUJ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUF####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUM####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUH####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUL####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUQ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUD####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUR####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUS####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUT####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUB####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUW####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUJ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUF####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUM####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUH####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUL####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUQ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUD####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUR####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUS####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUT####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUB####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUW####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUJ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUF####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUM####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUH####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUL####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUQ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUD####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUR####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLockStandard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUS####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUT####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUB####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUW####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUJ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUF####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUM####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts)Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUH####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUL####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)3
BUQ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUD####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUR####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUS####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUT####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUB####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BUW####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEJ####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEF####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEM####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEH####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEL####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEQ####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BED####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BER####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BES####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BET####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEB####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BEW####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUJ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUF####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUM####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUH####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUL####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUQ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUD####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUR####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUS####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUT####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUB####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUW####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUJ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUF####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUM####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUH####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUL####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUQ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUD####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUR####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUS####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUT####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUB####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUW####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUJ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUF####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUM####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUH####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUL####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUQ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUD####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUR####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUS####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUT####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUB####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUW####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUJ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUF####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUM####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts)Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUH####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUL####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUQ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUD####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUR####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUS####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUT####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUB####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BUW####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEJ####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEF####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEM####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEH####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEL####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEQ####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BED####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BER####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BES####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BET####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEB####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BEW####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUJ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUF####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUM####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUH####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUL####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package pitch (from 1.00 mm to 1.26 mm)
BUQ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUD####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUR####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUS####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUT####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUB####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUW####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUJ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUF####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUM####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUH####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUL####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUQ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUD####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUR####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUS####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUT####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUB####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUW####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUJ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUF####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUM####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUH####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUL####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUQ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUD####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUR####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUS####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUT####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUB####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUW####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUJ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUF####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUM####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts)Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUH####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUL####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUQ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUD####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUR####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUS####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUT####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUB####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BUW####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEJ####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEF####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEM####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEH####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEL####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEQ####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BED####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BER####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BES####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BET####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEB####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BEW####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUJ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUF####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUM####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUH####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUL####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUQ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUD####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUR####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUS####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUT####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUB####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUW####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUJ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUF####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUM####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUH####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUL####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUQ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUD####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUR####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUS####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUT####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUB####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUW####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUJ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUF####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUM####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUH####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUL####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUQ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUD####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUR####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUS####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUT####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUB####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUW####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUJ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUF####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUM####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts)Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUH####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUL####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUQ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUD####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUR####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUS####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUT####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUB####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)
BUW####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEJ####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEF####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEM####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEH####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEL####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEQ####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LED####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LER####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LES####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LET####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEB####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LEW####-03E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPJ####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPF####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPM####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPH####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPL####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPQ####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPD####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPR####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPS####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPT####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPB####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
LPW####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEJ####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEF####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEM####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEH####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEL####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEQ####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LED####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LER####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LES####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LET####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEB####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LEW####-04E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPJ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPF####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPM####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPH####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPL####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPQ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPD####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPR####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPS####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPT####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPB####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
LPW####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEJ####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEF####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEM####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
See more ...
Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEH####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
See more ...
Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEL####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEQ####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LED####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LER####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
See more ...
ScrewLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LES####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
See more ...
SlimLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LET####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEB####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LEW####-05E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPJ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPF####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPM####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPH####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPL####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPQ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPD####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPR####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPS####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPT####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPB####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPW####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPJ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPF####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPM####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPH####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPL####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPQ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPD####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPR####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPS####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPT####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPB####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPW####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPJ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPF####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch
LPM####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPH####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPL####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPQ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPD####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPR####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPS####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPT####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPB####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPW####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPJ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPF####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPM####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPH####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPL####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPQ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPD####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPR####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPS####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPT####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPB####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
LPW####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEJ####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEF####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEM####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEH####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEL####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEQ####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LED####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LER####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LES####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LET####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEB###-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LEW####-08E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPJ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPF####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPM####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPH####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPL####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPQ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPD####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPR####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPS####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPT####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPB####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPW####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPJ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPF####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPM####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPH####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPL####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPQ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPD####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPR####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPS####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPT####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPB####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPW####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPJ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPF####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPM####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPH####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPL####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPQ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPD####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPR####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPS####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPT####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPB####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPW####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPJ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPF####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPM####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPH####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPL####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPQ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPD####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPR####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPS####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPT####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPB####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
LPW####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEJ####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEF####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEM####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEH####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEL####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEQ####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LED####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LER####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LES####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LET####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEB####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LEW####-10E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPJ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPF####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPM####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPH####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPL####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPQ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPD####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPR####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPS####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPT####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPB####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPW####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPJ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPF####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPM####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPH####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPL####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPQ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPD####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPR####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPS####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPT####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPB####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPW####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPJ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPF####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPM####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPH####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPL####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPQ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPD####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPR####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPS####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPT####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPB####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPW####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPJ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPF####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPM####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPH####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPL####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPQ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPD####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPR####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPS####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPT####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPB####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
LPW####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEJ####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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FastLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEF####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Injection Molded Clamshell Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEM####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Clamshell Alu (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEH####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEL####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Open QuickLock (< 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEQ####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LED####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ReverseLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LER####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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ScrewLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LES####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SlimLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LET####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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SpringLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEB####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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TwistLock Elastomer Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LEW####-12E#-######55L#
The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPJ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPF####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPM####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPH####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPL####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPQ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPD####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPR####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPS####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPT####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPB####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPW####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPJ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPF####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPM####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPH####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPL####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPQ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPD####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPR####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPS####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPT####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPB####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPW####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPJ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPF####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPM####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPH####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPL####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPQ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPD####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPR####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPS####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPT####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPB####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPW####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPJ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPF####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPM####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPH####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPL####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPQ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPD####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPR####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPS####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPT####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPB####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
LPW####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPJ####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPF####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPM####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPH####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPL####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPQ####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPD####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPR####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPS####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPT####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPB####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
CPW####-0398-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPJ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPF####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPM####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPH####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPL####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPQ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPD####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPR####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPS####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPT####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPB####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
CPW####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUJ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUF####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUM####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUH####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUL####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUQ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUD####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUR####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUS####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUT####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUB####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUW####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUJ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUF####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUM####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUH####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUL####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUQ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUD####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Probe Pin Solderless Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUR####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUS####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUT####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUB####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUW####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUJ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUF####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUM####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUH####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUL####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUQ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUD####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUR####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUS####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUT####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUB####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUW####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUJ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUF####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUM####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUH####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUL####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUQ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUD####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUR####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUS####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUT####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUB####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
CUW####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUJ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUF####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUM####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUH####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUL####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUQ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUD####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUR####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUS####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUT####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUB####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUW####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUJ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUF####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUM####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUH####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUL####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUQ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUD####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Probe Pin Solderless Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUR####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUS####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUT####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUB####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUW####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUJ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUF####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUM####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUH####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUL####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUQ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUD####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUR####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUS####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUT####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUB####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUW####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUJ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUF####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUM####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUH####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUL####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUQ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUD####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUR####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUS####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUT####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUB####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
CUW####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUJ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUF####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUM####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUH####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUL####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUQ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUD####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUR####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUS####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUT####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUB####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUW####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUJ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUF####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUM####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUH####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUL####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUQ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUD####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Probe Pin Solderless Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUR####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUS####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUT####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUB####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUW####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUJ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUF####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUM####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUH####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUL####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUQ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUD####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUR####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUS####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUT####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUB####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUW####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUJ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUF####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUM####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUH####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUL####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUQ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUD####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUR####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUS####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUT####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUB####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
CUW####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUJ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUF####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUM####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUH####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUL####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUQ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUD####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUR####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUS####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUT####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUB####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Probe Pin Solderless Compression Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUW####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUJ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUF####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUM####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUH####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUL####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUQ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUD####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Probe Pin Solderless Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUR####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUS####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUT####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUB####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Raised SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUW####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUJ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUF####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUM####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUH####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUL####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUQ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUD####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ReverseLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUR####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUS####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SlimLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUT####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUB####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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TwistLock Standard SMT soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUW####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUJ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package (from 1.27 mm upwards)
CUF####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUM####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUH####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUL####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUQ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUD####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ReverseLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUR####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUS####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SlimLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUT####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUB####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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TwistLock Through-hole (THT) soldering Test Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm upwards)
CUW####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUJ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUF####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUM####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUH####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUL####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUQ####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUD####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUS####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QUB####-049#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUJ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUF####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUM####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUH####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUL####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUQ####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUD####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUS####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUB####-059#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUJ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUF####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUM####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUH####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUL####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUQ####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUD####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUS####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUB####-0529-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUJ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUF####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUM####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUH####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUL####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUQ####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUD####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUS####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUB####-0530-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUJ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUF####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUM####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUH####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUL####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUQ####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUD####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUS####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QUB####-0570-######95#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUJ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUF####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUM####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUH####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUL####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUQ####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUD####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUS####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUB####-089#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUJ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUF####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUM####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUH####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUL####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUQ####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUD####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUS####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUB####-082#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUJ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUF####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUM####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUH####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUL####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUQ####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUD####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUS####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUB####-0830-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUJ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUF####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUM####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUH####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUL####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUQ####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUD####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUS####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QUB####-087#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUJ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUF####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUM####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUH####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUL####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUQ####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUD####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUS####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUB####-109#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUJ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUF####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUM####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUH####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUL####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUQ####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUD####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUS####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUB####-102#-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUJ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUF####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUM####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUH####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUL####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUQ####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUD####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUS####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUB####-1030-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUJ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUF####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUM####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUH####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUL####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUQ####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUD####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUS####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QUB####-107#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUJ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUF####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUM####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUH####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUL####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUQ####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUD####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUS####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Probe Pin Solderless Compression Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUB####-129#-######55L#
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUJ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUF####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUM####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUH####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUL####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUQ####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUD####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUS####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Raised SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUB####-1229-######95A#
The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUJ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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FastLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUF####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Injection Molded Clamshell Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUM####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Clamshell Alu (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUH####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open Lever Clamshell Alu (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUL####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Open QuickLock (< 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUQ####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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QuickLock (> 200 contacts) Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUD####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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ScrewLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUS####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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SpringLock Standard SMT soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUB####-1230-######95#
The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.
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Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUJ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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FastLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUF####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUM####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Clamshell Alu (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUH####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open Lever Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUL####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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Open QuickLock (< 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUQ####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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QuickLock (> 200 contacts) Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUD####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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ScrewLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUS####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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SpringLock Through-hole (THT) soldering Test Socket for SOP - DSO - SOIC - QFP - xQFP Package 1.27 mm pitch (from 1.27 mm upwards)
QUB####-127#-#######5#
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
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BGA Package Solder Adapters ABG and MGS SMT Solderball
ABG####-####-####5## + MGS####-SB01-####5##
The E-tec Interconnect BGA Package Solder Adapter ABG & MGS system was develop for low cost test of BGA packages or to use it in embedded systems with the flexibility of exchange the package for future updates, replacement or reparations. Thus, this system has only slightly larger external dimensions than the BGA device, and thus takes much less space on your PC board to complete.
This adapter system gives your BGA device legs and make it pluggable. Steps:
- First: Solder the BGA device to our adapter (ABG Series)
- Second: Solder MGS adapter on your PCB. As emulates the package dimension and footprint, is easily installed using standard flux and reflow techniques.
- Third: You can plug the ABG adapter (with your already soldered BGA Package) into our MGS adapter and start using it.
We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request
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BGA Package Solder Adapter ABG and MGS SMT Standard
ABG####-####-####5## + MGS####-E###-####5##
The E-tec Interconnect BGA Package Solder Adapter ABG & MGS system was develop for low cost test of BGA packages or to use it in embedded systems with the flexibility of exchange the package for future updates, replacement or reparations. Thus, this system has only slightly larger external dimensions than the BGA device, and thus takes much less space on your PC board to complete.
This adapter system gives your BGA device legs and make it pluggable. Steps:
- First: Solder the BGA device to our adapter (ABG Series)
- Second: Solder MGS adapter on your PCB. As emulates the package dimension and footprint, is easily installed using standard flux and reflow techniques.
- Third: You can plug the ABG adapter (with your already soldered BGA Package) into our MGS adapter and start using it.
We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request
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BGA Package Solder Adapter ABG and MGS THT
ABG####-####-####5## + MGS####-E###-####5##
The E-tec Interconnect BGA Package Solder Adapter ABG & MGS system was develop for low cost test of BGA packages or to use it in embedded systems with the flexibility of exchange the package for future updates, replacement or reparations. Thus, this system has only slightly larger external dimensions than the BGA device, and thus takes much less space on your PC board to complete.
This adapter system gives your BGA device legs and make it pluggable. Steps:
- First: Solder the BGA device to our adapter (ABG Series)
- Second: Solder MGS adapter on your PCB. As emulates the package dimension and footprint, is easily installed using standard flux and reflow techniques.
- Third: You can plug the ABG adapter (with your already soldered BGA Package) into our MGS adapter and start using it.
We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request
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ABG Male contact Raised SMT Solderball Adapter to screw on top a Test Socket
ABG####-SB437-####5##
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter. The solderball adapters have the same solderball types as the package’s they are emulating.
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ABG Male contact Raised SMT Standard Adapter to screw on top a Test Socket
ABG####-E437-####5##
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter.
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ABG Male contact SMT Solderball Adapter to screw on top a Test Socket
ABG####-SB406-####5##
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter. The solderball adapters have the same solderball types as the package’s they are emulating.
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ABG Male contact SMT Standard Adapter to screw on top a Test Socket
ABG####-E406-####5##
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter.
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ABG Male contact Through-hole (THT) Adapter, Pitch 0.60mm to screw on top a Test Socket
ABG####-E420-####506
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter.
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ABG Male contact Through-hole (THT) Adapter, Pitch from 0.80mm to 0.99mm screw on top a Test Socket
ABG####-E175-####508
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter.
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ABG Male contact Through-hole (THT) Adapter, Pitch 1.00mm to screw on top a Test Socket
ABG####-E168-####510
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter.
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ABG Male contact Through-hole (THT) Adapter, Pitch 1.27mm to screw on top a Test Socket
ABG####-E1##-####512
The E-tec Interconnect ABG male contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The ABG Male contact Adapter System emulates the package footprint and is easily installed, using standard flux and reflow techniques, on your actual PCB and the Test Socket can be screw on top of this adapter.
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MGS Female contact SMT Solderball Adapter to Plug-in a Test Socket
MGS####-E###-####5##
The E-tec Interconnect MGS female contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The MGS Female contact Adapter System emulates the package dimension and footprint, is easily installed using standard flux and reflow techniques. The solderball adapters have the same solderball types as the package’s they are emulating. You can combine the adapter footprint with any of the E-tec Test socket styles shown in the Test Socket catalogue. The Test Socket is plugged into this adapter, which will be delivered with gold plated through hole pin and alignment plate for easy insertion. We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request
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MGS Female contact SMT Standard Adapter to Plug-in a Test Socket
MGS####-E###-####5##
The E-tec Interconnect MGS female contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The MGS Female contact Adapter System emulates the package dimensions and footprint, is easily installed using standard flux and reflow techniques. You can combine the adapter footprint with any of the E-tec Test socket styles shown in the Test Socket catalogue. The Test Socket is plugged into this adapter, which will be delivered with gold plated through hole pin and alignment plate for easy insertion. We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request
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MGS Female contact Through-hole (THT) Adapter to Plug-in a Test Socket
MGS####-E###-####5##
The E-tec Interconnect female contact system was develop as in certain cases, you are not able to place any test socket on your board because:
- Its density is too high
- It was not designed to accommodate a Test Socket
- The package dimension or layout have changed
The MGS Female contact Adapter System emulates the package dimensions and footprint, is easily installed using standard flux and reflow techniques. You can combine the adapter footprint with any of the E-tec Test socket styles shown in the Test Socket catalogue. The Test Socket is plugged into this adapter, which will be delivered with gold plated through hole pin and alignment plate for easy insertion. We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request
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ZIF Test Socket, for Flex Cables, Displays and Membrane Keyboards to place outside your board. Pitch 0.40mm to 2.54mm pitch
Fxx-xxx-Xxxx-xx
The ZIF test Socket are used for functional and reliability high cycle testing for Flex Cables, Displays and Membrane keyboards.
The FCP and FTU Series are to be placed outside your board and connected with a falt cable to your actual board. From 0.40mm to 2.54mm pitch.
*Pitch 0.40mm only available on Solderless Compression type
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ZIF Test Socket, for Flex Cables, Displays and Membrane Keyboards to place on your board. Pitch 0.40mm to 2.54mm pitch
FCT-xxx-Xxxx-xx
The ZIF test Socket are used for functional and reliability high cycle testing for Flex Cables, Displays and Membrane keyboards.
The FCT Series are to be place on your board, you can choose to fix the socket directly on your PCB with our different mounting options as Solderless / SMT / THT depend on pitch and application.
*Pitch 0.40mm only available on Solderless Compression type
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1.00mm pitch Pin Header - THT - Straight, Dual row
SL2 - xxx - S xxx/x - 55/00
PIN HEADER - THT Straight 1.00mm pitch, double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Pin Header - THT - Straight, Single and Dual rows
SLx - xxx - Sxxx/x - 55/1
PIN HEADER - THT Straight 1.27mm pitch Pin Header, single and dual row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Pin Header - THT - Straight, Single row
SL1 - xxx - B083/x - 55/11
PIN HEADER - THT Straight 1.27mm pitch, single row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Pin Header - THT - Straight Single and dual rows
SL x - xxx - X xxx/xx - 55/2
PIN HEADER - THT Straight 2.00mm pitch, single and double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Pin Header - THT - Straight Single, dual or triple rows
SLx-xxx-X xxx/xx-55
PIN HEADER - THT Straight 2.54mm pitch, single, dual or three rowswith a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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5.08mm pitch Pin Header - THT - Straight single row
SLx-xxx-X xxx/xx-55
PIN HEADER - THT Straight 5.08mm pitch, single row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Pin Header - THT - Right angle (horizontal) Single and dual row
SLx -xxx-R071/x-55/11
PIN HEADER - THT Right Angle (horizontal) 1.27mm pitch. Single and double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm x 2.54mm pitch Pin Header - THT - Right angle (horizontal) Dual row
SL2 -xxx-R xxx/x-55/1
PIN HEADER - THT Right Angle (horizontal) 1.27mm x 2.54mm pitch. Double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Pin Header - THT - Right angle (horizontal) Single and dual row
SL x - xxx - X xxx/xx - 55/2
PIN HEADER - THT Right Angle (horizontal) 2.00mm pitch. Single and double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Pin Header - THT - Right angle (horizontal) Single, dual and triple row
SL x - xxx - X xxx/xx - 55
PIN HEADER - THT Right Angle (horizontal) 2.54mm pitch. Single, double and triple row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Double Plastic Board Spacer - THT - Straight Single and dual row
SP x - xxx - S xxx/x - 55/11
PIN HEADER - Double Plastic Board Spacer - THT Straight 1.27mm pitch, single and dual row with a variety of standard dimensions of the soldering, plug side and insulator spacing. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Double Plastic Board Spacer - THT - Straight Single and dual row (1.27mm x 2.54mm)
SP x - xxx - S xxx/x - 55/1
PIN HEADER - Double Plastic Board Spacer - THT Straight 1.27mm pitch, single and dual row (1.27mm x 2.54mm) with a variety of standard dimensions of the soldering, plug side and insulator spacing. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Double Plastic Board Spacer - THT - Straight Single and dual row
SPx-xxx-X xxx/xx-55/2
PIN HEADER - Double Plastic Board Spacer - THT Straight 2.00mm pitch, single and dual row with a variety of standard dimensions of the soldering, plug side and insulator spacing. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Double Plastic Board Spacer - THT - Straight Single, dual and triple row
SPx-xxx-S xxx/xx-xx
PIN HEADER - Double Plastic Board Spacer - THT Straight 2.54mm pitch, single, dual and three row with a variety of standard dimensions of the soldering, plug side and insulator spacing. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Pin Header - THT - Straight, PC 104+ Type, Quad row
SL4 - xxx - S xxx/x - 55/2
PIN HEADER - PC 104 Type 2.00mm pitch - THT- Straight. Designed for “board to board” small spacing interconnection. Variable terminal length available. With standoff’s for post solder cleaning. Mate with Female Header BL4-xxx-–S630/x-xx/2
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2.00mm pitch Pin Header - THT - Straight and Right angle High plastic base, height 4.00mm , Dual row
SE2 - xxx - X xxx - xx/2
PIN HEADER - High Base Board To Board 2.00mm pitch- THT - Straight & Right angle dual row. 4.00mm or 4.20mm High Base Insulator standoff's facilitate post solder cleaning. Side stackable. Mate with 2.00mm pitch Female and Shunt Connector
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2.54mm pitch Pin Header - THT - Straight and Right angle High plastic base, height 7.40mm , Dual row
SE2 - xxx - Xxxx - 55
PIN HEADER - High Base Board To Board 2.54mm pitch- THT - Straight & Right angle dual row. 6.35mm or 7.40mm High Base Insulator standoff's facilitate post solder cleaning. Side stackable. Mate with 2.00mm pitch Female and Shunt Connector
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1.00mm pitch Pin Header - SMT - Straight Low profile Dual rows
SS2 - xxx - H 18/x - 55/00 X
PIN HEADER - SMT Straight 1.00mm pitch, Low profile, double row with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Pin Header - SMT - Straight Low profile Dual rows
SS2 - xxx - H xx/x - 55/11 X
PIN HEADER - SMT straight 1.27mm pitch, Low profile, double row with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Pin Header - SMT - Straight Low profile Single and dual rows (1.27mm x 2.54mm)
SS x - xxx - H 38x/x - 55/1 X
PIN HEADER - SMT straight 1.27mm pitch, Low profile, single and double row (1.27mm x 2.54mm) with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Pin Header - SMT - Straight Low profile Dual rows
SS2 - xxx - Hx 064 / x - 55/2 X
PIN HEADER - SMT straight 2.00mm pitch, Low profile, double row with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Pin Header - SMT - Straight Low profile Single and dual rows
SS x - xxx - H x85 / x - 55/2 X
PIN HEADER - SMT straight 2.00mm pitch, Low profile, single and double row with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Pin Header - SMT - Straight Low profile Single and dual rows
SS x - xxx - X 14x / xx - 55 X
PIN HEADER - SMT straight 2.54mm pitch, Low profile, single and double row with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.00mm pitch Double Plastic Board Spacer - SMT - Dual row
SP2 - xxx - H 51/x - 55/00 X
PIN HEADER - SMT Double Plastic Board Spacer 1.00mm pitch, double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Double Plastic Board Spacer - SMT - Dual row
SP2 - xxx - H 2x/x - 55/11 X
PIN HEADER - SMT Double Plastic Board Spacer 1.27mm pitch, double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm x 2.54mm pitch Double Plastic Board Spacer - SMT - Dual row
SP2 - xxx - H 220/x - 55/1 X
PIN HEADER - SMT Double Plastic Board Spacer 1.27mm x 2.54mm pitch, double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Double Plastic Board Spacer- SMT - Dual row
S X 2 - xxx - HX 06x/x - 55/2 X
PIN HEADER - SMT Double Plastic Board Spacer 2.00mm pitch, double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Double Plastic Board Spacer - SMT - Single and dual row
SP x - xxx - H xxx / xx - 55 X
PIN HEADER - SMT Double Plastic Board Spacer 2.54mm pitch, single and double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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1.27mm pitch Pin Header - Slanted SMT - (horizontal) Double row
SR2 - xxx - H 12/xx - xx/11 X
PIN HEADER - SMT Slanted (horizontal) 1.27mm pitch, double row with a variety of standard dimensions of the soldering and plug side. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.00mm pitch Pin Header - Slanted SMT - (horizontal) Single and dual row
SR x - xxx - H xxx/x - 55/2 X
PIN HEADER - SMT Slanted (horizontal) 2.00mm pitch, single and double row with a variety of standard dimensions of the soldering and plug side. Location peg options (only for Dual row). Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Pin Header - Slanted SMT - (horizontal) Single and dual row
SRx - xxx-H135/xx-xx X
PIN HEADER - SMT Slanted (horizontal) 2.54mm pitch, single and double row with a variety of standard dimensions of the soldering and plug side. Location peg options. Special customer-specific dimensions are possible. Details and dimensions applied can be find on the "View technical datas"
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2.54mm pitch Press-Fit Pin Header Single row
SLx-xxx-SHP xxx/xx-xx
PIN HEADER - Press Fit Pin Header 2.54mm pitch, single row. Special designed for schock and vibration application connections. Possibilty to assembled it in solderless method. Details and dimensions applied can be find on the "View technical datas"
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Adapter Strips THT Through hole 90 degrees horizontal DIS
DIS-2xx-R921-xx
Socket Strips THT Through hole 90° bended precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm . Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole 90 degrees horizontal SIB
SIB-1xx-R921-xx
Socket Strips THT Through hole 90° bended precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm . Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole vertical DIS
DIS-2xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, Different predefined terminals heights are available. Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole vertical SIB
SIB-1xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm, Different predefined terminals heights are available. Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Adapter Strips THT Through hole vertical TIS
TIS-3xx-Exxx-xx
Socket Strips THT Through hole precision turned contacts, available in 3-rows in pitch and row spacing 2.54 mm, Different predefined terminals heights are available. Suitable as a soldering or plug connection. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole 90 degrees horizontal DIS
DIS-2xx-R900-95
Socket Strips THT Through hole 90° bended precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole 90 degrees horizontal SIB
SIB-1xx-R900-95
Socket Strips THT Through hole 90° bended precision turned contacts, 1-row in pitch and row spacing 2.54 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Board Stacker DIS
DIS-2xx-Xxxx-95
Socket Strips THT Through hole precision Board Stacker turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, go higher that the normal height of 4.45mm, to be able to build over top componets on your PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Board Stacker SIB
SIB-1xx-Xxxx-95
Socket Strips THT Through hole precision Board Stacker turned contacts, available in 1-row in pitch and row spacing 2.54 mm, go higher that the normal height of 4.45mm, to be able to build over top componets on your PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Board Stacker TIS
TIS-3xx-Exxx-95
Socket Strips THT Through hole precision Board Stacker turned contacts, available in 3-rows in pitch and row spacing 2.54 mm, go higher that the normal height of 4.45 mm, to be able to build over top componets on your PCB. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Low profile
SLP-xxx-Xxxx-xx
Socket Strips THT Through hole precision Low and Super low turned contacts, available in 1 -2 or 3 row in pitch and row spacing 2.54 mm and 2.41 mm max hight and 0.60 mm minimum height. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Standard profile DIS
DIS-2xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, breakable and solid insulator and with terminal head flush or above from plastic. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Standard profile SIB
SIB-1xx-Xxxx-xx
Socket Strips THT Through hole precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm, breakable and solid insulator and with terminal head flush or above from plastic. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Standard profile TIS
TIS-3xx-Exxx-xx
Socket Strips THT Through hole precision turned contacts, available in 3-rows in pitch and row spacing 2.54 mm, breakable and solid insulator and with terminal head flush or above from plastic. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips THT Through hole Super low profile
SLP-xxx-Xxxx-xx
Socket Strips THT Through hole precision Low and Super low turned contacts, available in 1 -2 or 3 row in pitch and row spacing 2.54 mm and 2.41 mm max hight and 0.60 mm minimum height. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips SMT Standard Super low profile
SSP-xxx-E144-xx
Socket Strips SMT precision turned contacts, available in 1 , 2 or 3-rows in pitch and row spacing 2.54 mm with a height above PCB 0.60 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips SMT Standard profile Dual Row
DSS-2xx-H094-xx
Socket Strips SMT precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm with a height of 5.60 mm . Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Socket Strips SMT Standard profile Single Row
SSB-1xx-H094-xx
Socket Strips SMT precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm with a height of 5.60 mm. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Jumbo Adapter Strips THT Through hole 90 degrees horizontal
SLx-xxx-A379-xx
Socket Strips THT Through hole 90° bended adapter precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm. Fit to the Jumbo Socket Strips . Platings Tin or Gold.
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Jumbo Adapter Strips THT Through hole vertical
SLx-xxx-G379-xx
Socket Strips THT Through hole adapter precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm. Fit to the Jumbo Socket Strips . Platings Tin or Gold.
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Jumbo Socket Strips SMT Standard low profile
BSx-xxx-G560-95
Socket Strips SMT low profile precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 5.60 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips SMT Standard profile
BSx-xxx-G860-95
Socket Strips SMT precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 8.60 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole 90 degrees horizontal
BLx-xxx-A700-95
Socket Strips THT Through hole 90° bended precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 2.54 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Clinched type
BLx-xxx-G799-95
Socket Strips THT Through hole precision turned contacts, available in 1 row in pitch and row spacing 2.54 mm with plastic height above PCB 7.00 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Low 4.50 mm profile
BLx-xxx-G109-95
Socket Strips THT Through hole precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 4.50 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Press fit type
BLx-xxx-G065P-95
Socket Strips THT Through hole precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 7.00 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Jumbo Socket Strips THT Through hole Standard 7.00 mm profile
BLx-xxx-G700-95
Socket Strips THT Through hole precision turned contacts, available in 1 or 2 row in pitch and row spacing 2.54 mm with plastic height above PCB 7.00 mm . Accepts square pin 0.65 x 0.65 mm as well as round pins dia. 0.65 to 0.85 mm. Platings Tin/Gold, Others on request.
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Carrier Socket Strips THT Through hole Dual Rows
SCP-2xx-Sxxx-95
Socket Strips THT Through hole precision turned contacts, available in 2-rows in pitch and row spacing 2.54 mm, Convenient way to load loose receptacles on a PCB board. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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Carrier Socket Strips THT Through hole Single Row
SCP-1xx-Sxxx-95
Socket Strips THT Through hole precision turned contacts, available in 1-row in pitch and row spacing 2.54 mm, Convenient way to load loose receptacles on a PCB board. Different predefined terminals variants according to your needs. Platings Tin/Gold, Tin/Tin or Gold/Gold.
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1.27mm pitch Mini-Jumper
JPC-127-BL-55
Jumper and Shorting Links - Jumper and Shorting Links 1.27mm pitch
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2.00mm pitch Mini-Jumper
JPx-200-XX-55
Jumper and Shorting Links - Jumper and Shorting Links 2.00mm pitch
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2.54mm pitch Mini-Jumper
JPx-254-XX-55
Jumper and Shorting Links - Jumper and Shorting Links 2.54mm pitch
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5.08mm pitch Mini-Jumper
JPC-508-BL-55
Jumper and Shorting Links - Jumper and Shorting Links 5.08mm pitch
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2.54mm pitch - Non Insulated Wire Shorting Links
JPW-254-55
Non Insulated Wire Shorting Links 2.54mm pitch, Gold Plated
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5.08mm pitch - Non Insulated Wire Shorting Links
JPW-508-55
Non Insulated Wire Shorting Links 5.08mm pitch, Gold Plated
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7.62mm pitch - Non Insulated Wire Shorting Links
JPW-762-55
Non Insulated Wire Shorting Links 7.62mm pitch, Gold Plated
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10.16mm pitch - Non Insulated Wire Shorting Links
JPW-102-55
Non Insulated Wire Shorting Links 10.16mm pitch, Gold Plated
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0.50mm pitch Plug-Board Connector – SMT
PBS-xxx-xxxx-xx
Fine Pitch Plug-Board Connectors - Fine Pitch Plug-Board Connectors 0.50mm pitch
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0.60mm pitch Plug-Board Connector – SMT
PBS-xxx-xxxx-xx
Fine Pitch Plug-Board Connectors - Fine Pitch Plug-Board Connectors 0.60mm pitch
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0.80mm pitch Plug-Board Connector – SMT
PBS-xxx-xxxx-xx
Fine Pitch Plug-Board Connectors - Fine Pitch Plug-Board Connectors 0.80mm pitch
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1.27mm pitch Box Header - THT Straight
SLS - xxx - S510 - 55/11X
BOX HEADER - Box Header double row 1.27mm pitch, THT Straight soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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1.27mm pitch Box Header - THT Straight - Variable Pin length PCB Side
SLS - xxx - S535 - 55/11
BOX HEADER - Box Header double row 1.27mm pitch, THT Straight soldering technology, Variable Pin length PCB side option. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.00mm pitch Box Header - THT Straight
SLS - xxx - S562 - 55/2
BOX HEADER - Box Header double row 2.00mm pitch, THT Straight soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.54mm pitch Box Header - THT Straight
SLS - xxx - S920 - 55
BOX HEADER - Box Header double row 2.54mm pitch, THT Straight soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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1.27mm pitch Box Header - THT Raised Straight
SLS - xxx - P535 - 55/11
BOX HEADER - Box Header double row 1.27mm pitch, THT Raised Straight soldering technology. Differents height options. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.00mm pitch Box Header - THT Raised Straight
SLS - xxx - D762/xx - 55/2
BOX HEADER - Box Header double row 2.00mm pitch, THT Raised Straight soldering technology. Differents height options. Suitable for "Board to Board" connections and also for IDC cable connecto
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2.54mm pitch Box Header - THT Raised Straight
SLS - xxx - Dxxx - 55
BOX HEADER - Box Header double row 2.54mm pitch, THT Raised Straight soldering technology. Differents height options. Suitable for "Board to Board" connections and also for IDC cable connecto
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1.27mm pitch Box Header - THT 90° right angle
SLS - xxx - R510 - 55/11x
BOX HEADER - Box Header double row 1.27mm pitch, THT 90° right angle soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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1.27mm pitch Box Header - THT 90° right angle - Variable Pin length option
SLS - xxx - R565/x - 55/11
BOX HEADER - Box Header double row 1.27mm pitch, THT 90° right angle soldering technology, Variable Pin length option. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.00mm pitch Box Header - THT 90° right angle
SLS - xxx - R562 - 55/2
BOX HEADER - Box Header double row 2.00mm pitch, THT 90° right angle soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.54mm pitch Box Header - THT 90° right angle
SLS - xxx - R920 - 55
BOX HEADER - Box Header double row 2.54mm pitch, THT 90° right angle soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.54mm pitch Box Header - THT 90° - with metal ejection latches
SLS - xxx - R103 - 55 / X
BOX HEADER - Box Header 2.54mm pitch, THT 90° horizontal soldering technology with metal ejection latches.
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2.54mm pitch Box Header - THT Straight - with metal ejection latches
SLS - xxx - S103 - 55 / X
BOX HEADER - Box Header 2.54mm pitch, THT Straight soldering technology with metal ejection latches.
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2.54mm pitch Box Header DIN 41651 - THT 90° - with plastic ejection latches.
DHX - xxx - R100 - 55
BOX HEADER - Box Header DIN 41 651, 2.54mm pitch, THT 90° horizontal soldering technology with plastic ejection latches.
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2.54mm pitch Box Header DIN 41651 - THT Straight- with plastic ejection latches.
DHX - xxx - S100 - 55
BOX HEADER - Box Header DIN 41 651, 2.54mm pitch, THT Straight soldering technology with plastic ejection latches.
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1.27mm pitch - Box Header - SMT
SLS - xxx - H510 - 55/11X
BOX HEADER - Box Header double row 1.27mm pitch, SMT soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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1.27mm pitch - Box Header - SMT with Locating pegs
SLS - xxx - H610 - 55/11X
BOX HEADER - Box Header double row 1.27mm pitch, SMT soldering technology and locating pegs. Suitable for "Board to Board" connections and also for IDC cable connectors
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2.00mm pitch - Box Header - SMT
SLS - xxx - H562 - 55/2X
BOX HEADER - Box Header double row 2.00mm pitch, SMT soldering technology. Optional locating pegs Suitable for "Board to Board" connections and also for IDC cable connectors
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2.54mm pitch - Box Header - SMT
SLS - xxx - H885 - 55/X
BOX HEADER - Box Header double row 2.54mm pitch, SMT soldering technology. Suitable for "Board to Board" connections and also for IDC cable connectors
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1.27mm pitch - Box Header - SMT Raised with Locating pegs
SLS - xxx - HPxx - 55/11X
BOX HEADER - Box Header double row 1.27mm pitch, SMT Raised soldering technology and locating pegs. Suitable for "Board to Board" connections and also for IDC cable connectors
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Mini - Flex Connector IDC pitch 1.27mm shrouded male
MFM - xxx - DC50 - 99
These Mini-Flex™ IDC connectors are designed for the use of standard 1.27mm flat ribbon cables (UL Std. 2651). They provide a highly reliable "wire-to-board" connection using a Mini-Mate™ connector.
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Mini - Flex Connector IDC pitch 1.27mm THT
MFP - xxx - DC50 - 99
These Mini-Flex™ IDC connectors are for the use of standard 1.27mm flat ribbon cable (UL Std. 2651) and THT soldering to the PC board. They provide an extremely reliable "wire-to-board" connection.
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1.27mm pitch Female Header - THT - Straight Double row
BL2 - xxx - S xxx - 55/11
FEMALE HEADERS - Double row, 1.27mm pitch THT Straight soldering technology. Height of 3.40mm or 4.40mm above PCB. Reliable contact thanks to Hi-rel dual beam contact design.
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1.27mm x 2.54mm pitch Female Header - THT - Straight Single and Double row
BL2 - xxx - S xxx - 55/1
FEMALE HEADERS - Single and Double row, 1.27mm x 2.54mm pitch THT Straight soldering technology. Height of 4.60mm or 8.50mm above PCB. Reliable contact thanks to Hi-rel fork contact design.
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2.00mm pitch Female Header - THT - Straight Single and Double row low profile
BL x - xxx - S xxx - 55/2
FEMALE HEADERS - Single and Double row, 2.00mm pitch THT Straight soldering technology. Height of 4.00mm or 4.30mm above PCB. Reliable contact thanks to Hi-rel dual beam contact design.
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2.00mm pitch Female Header - THT - Straight Single, Dual or Three row, 6.35mm profile
BL x - xxx - SH635- 55/2
FEMALE HEADERS - Single, Double or Three row, 2.00mm pitch THT Straight soldering technology. Height of 6.35mm above PCB. Reliable contact thanks to Hi-rel fork contact design.
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2.54mm pitch Female Header - THT - Straight Single or Dual row, 5.00mm to 8.50mm profile
BF x - xxx - S xxx - 55
FEMALE HEADERS - Single row and double row, 2.54mm pitch. THT Straight soldering technology. Height of 5.00mm to 8.50mm above PCB.Folded contacts design.
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2.54mm pitch Female Header - THT - Straight Single or Dual row, 5.70mm profile
BL x - xxx - S570 - 55
FEMALE HEADERS - Single row and double row, 2.54mm pitch. THT Straight soldering technology. Height of 5.70mm above PCB. Hi-rel fork contacts design.
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2.54mm pitch Female Header - THT - Straight Single, Dual or Three row, 8.50mm profile
BL x - xxx - S842 - 55
FEMALE HEADERS - Single row, double row or three rows, 2.54mm pitch. THT Straight soldering technology. Height of 8.50mm above PCB. Hi-rel fork contacts design.
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2.00mm pitch Female Header - THT - Elevated
BE x - xxx - S xxx - 55/2
FEMALE HEADERS - Single row and double row, 2.00mm pitch with a height of 8.30mm to 19.30mm,Elevated Type. THT soldering technology. Customer specific dimension are available on request.
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2.54mm pitch Female Header - THT - Elevated
BE x - xxx - S xxx - 55
FEMALE HEADERS - Single row, double row or three rows, 2.54mm pitch with a height of 11.05mm to 18.67mm,Elevated Type. THT soldering technology. Customer specific dimension are available on request.
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2.54mm pitch Female Header - THT - dual entry type 8.50mm profile
BBx-x xx-B850-55
FEMALE HEADERS - Single row and double row, 2.54mm pitch with a height of 8.50mm, Type standard profile. THT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points and Hi-rel dual beam contact assures reliable PCB connections.
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2.00mm pitch Female Header - THT - dual entry type low profile
BBx-x xx-Sxxx-55/2
FEMALE HEADERS - Single row and double row, 2.00mm pitch with a height of 5.00mm, Type low profile. THT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points and Hi-rel dual beam contact assures reliable PCB connections.
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2.54mm pitch Female Header - THT - dual entry type low profile
BBx-x xx-Sxxx-55
FEMALE HEADERS - Single row and double row, 2.54mm pitch with a height of 5.00mm, Type low profile. THT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points and Hi-rel dual beam contact assures reliable PCB connections.
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2.00mm pitch Female Header - THT - PC 104+ Type
BL4 - xxx - S xxx/x - 55/2
FEMALE HEADERS - 4-row , 2.00mm pitch with a height of 6.35mm or 9.35mm, PC 104+ Type. THT soldering technology.
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1.27mm pitch Female Header - THT - Right angle
BL2 - xxx - R430 - 55/11
FEMALE HEADERS - Double row, 1.27mm pitch THT Right Angle soldering technology. Height of 3.40mm or 4.40mm above PCB.
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2.00mm pitch Female Header - THT - Right angle 6.35mm profile
BL x - xxx - RH635 - 55/2
FEMALE HEADERS - Single row, double row or three rows, 2.00mm pitch. THT Right Angle soldering technology. Single row Height of 2.00mm above PCB. Double row Height of 4.00mm above PCB. Three row Height of 6.00mm above PCB. Hi-rel fork contacts design.
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2.00mm pitch Female Header - THT - Right angle low profile
BL x - xxx - Rxxx - 55/2
FEMALE HEADERS - Single and Double row, 2.00mm pitch THT Right Angle soldering technology. Single row Height of 2.80mm above PCB. Double row Height of 4.85mm above PCB.
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2.54mm pitch Female Header - THT - Right angle 5.00mm profile
BF1 - xxx - R500 - 55
FEMALE HEADERS - Single row, 2.54mm pitch. THT Right Angle soldering technology. Single row Height of 2.50mm above PCB. Folded contacts design.
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2.54mm pitch Female Header - THT - Right angle 5.70mm profile
BL x - xxx - R570 - 55
FEMALE HEADERS - Single row and double row, 2.54mm pitch. THT Right Angle soldering technology. Single row Height of 2.50mm above PCB. Double row Height of 5.00mm above PCB. Hi-rel fork contacts design.
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2.54mm pitch Female Header - THT - Right angle 8.50mm profile
BL x - xxx - R842 - 55
FEMALE HEADERS - Single row, double row or three rows, 2.54mm pitch. THT Right Angle soldering technology. Single row Height of 2.50mm above PCB. Double row Height of 5.00mm above PCB. Three row Height of 7.50mm above PCB. Hi-rel fork contacts design.
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1.27mm pitch Female Header - SMT - Double row, Side Entry
BS2 - xxx - R345 - 55/11 X
FEMALE HEADERS - Double row, 1.27mm pitch, SMT soldering technology. Side Entry Types. With a height from 3.50mm above PCB. Reliable contact thanks to Hi-rel dual beam contact.
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2.00mm pitch Female Header - SMT - Double row, Side Entry
BS2 - xxx - R500 - 55/2 X
FEMALE HEADERS - Double row, 2.00mm pitch, SMT soldering technology. Side Entry Types. With a height from 5.00mm above PCB. Reliable contact thanks to Hi-rel dual beam contact with "Pin Stop"
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2.54mm pitch Female Header - SMT - Single and Double row, Side Entry
BS x - xxx - R390 - 55 /X
FEMALE HEADERS - Single and Double row, 2.54mm pitch, SMT soldering technology. Side Entry Types. With a height from 3.90mm and 6.10mm above PCB. Reliable contact thanks to Hi-rel dual beam contact with "Pin Stop"
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1.00mm pitch Female Header - SMT - Dual row low profile, Top and Bottom Entry
BS2-xxx-H222-55/00 X
FEMALE HEADERS - Double row, 1.00mm pitch with a height of 2.25mm, Type low profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points
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1.27mm pitch Female Header - SMT - Dual row 2.20mm profile, Top and Bottom Entry
BS2 - xxx - TB22 - 55/11 X
FEMALE HEADERS - Double row, 1.27mm pitch with a height of 2.20mm, Type low profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points.
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1.27mm pitch Female Header - SMT - Dual row 3.60mm profile, Top and Bottom Entry
BS2 - xxx - H36x - 55/11 X
FEMALE HEADERS - Double row, 1.27mm pitch with a height of 3.60mm, Type low profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points. Different locating pegs options.
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1.27mm pitch Female Header - SMT - Single row 2.20mm profile, Bottom Entry
BS1 - xxx - B21x - 55/11 XX
FEMALE HEADERS - Single row, 1.27mm pitch with a height of 2.10mm, Type low profile. SMT soldering technology. Bottom Entry design. Reliable contact thanks to folded contacts with three contact points.
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1.27mm pitch Female Header - SMT - Single row 2.20mm profile, Top Entry
BS1 - xxx - T22x - 55/11 XX
FEMALE HEADERS - Single row, 1.27mm pitch with a height of 2.20mm, Type low profile. SMT soldering technology. Top Entry design. Reliable contact thanks to folded contacts with three contact points.
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2.00mm pitch Female Header - SMT - Double row 2.20mm or 2.95mm profile, Top and Bottom Entry
BS2 - xxx - TB2X - 55/2 X
FEMALE HEADERS - Double row, 2.00mm pitch with a height of 2.20mm or 2.95mm, Type low profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points.
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2.00mm pitch Female Header - SMT - Single row 2.20mm profile, Top and Bottom Entry
BS1 - xxx - TB22 - 55/2 X
FEMALE HEADERS - Single row, 2.00mm pitch with a height of 2.20mm, Type low profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points.
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2.54mm pitch Female Header - SMT - Double row 3.65mm profile, Top and Bottom Entry
BS2 - xxx - TB365 - 55/ X
FEMALE HEADERS - Double row, 2.54mm pitch with a height of 3.65mm, Type low profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to folded contacts with three contact points.
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1.27mm pitch Female Header - SMT - Double row 4.50mm profile, Top Entry
BS2 - xxx - H45x - 55/11 X
FEMALE HEADERS - Double row, 1.27mm pitch with a height of 4.50mm, Type standard profile. SMT soldering technology. Top Entry design for board stacking. Reliable contact thanks to Hi-rel dual beam contact design. With Locating pegs and Polarization bump options
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1.27mm pitch Female Header - SMT - Single row 4.50mm profile, Top and Bottom Entry
BS1 - xxx - H45x - 55/11 XX
FEMALE HEADERS - Single row, 1.27mm pitch with a height of 4.50mm, Type standard profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to Hi-rel dual beam contact design.
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1.27mm x 2.54mm pitch Female Header - SMT - Dual row 6.00mm profile
BS2 - xxx - H600 - 55/1 X
FEMALE HEADERS - Double row, 1.27mm x 2.54mm pitch with a height of 6.00mm, Type standard profile. SMT soldering technology. Reliable contact thanks to Hi-rel inner contact design.
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2.00mm pitch Female Header - SMT - Single and Double row 4.30mm profile, Top and Bottom Entry
BS x - xxx - H43X - 55/2 X
FEMALE HEADERS - Single and Double row, 2.00mm pitch with a height of 4.30mm, Type standard profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to Hi-rel dual beam contact design.
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2.54mm pitch Female Header - SMT - Single and Double row 5.00mm or 7.50mm profile, Top and Bottom Entry
BS x - xxx - Hxxx - 55/ X
FEMALE HEADERS - Single and Double row, 2.54mm pitch with a option height of 5.00mm or 7.50mm, Type standard profile. SMT soldering technology. Dual Entry design for board stacking. Reliable contact thanks to Hi-rel dual beam contact design.
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1.27mm pitch Female Header - THT - Straight Double row, Side Entry
BH2 - xxx - R345 - 55/11
FEMALE HEADERS - Double row, 1.27mm pitch, THT Straight soldering technology. Side Entry Types. With a height from 3.45mm above PCB. Reliable contact thanks to Hi-rel dual beam contact with "Pin Stop"
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2.00mm pitch Female Header - THT - Straight Double row, Side Entry
BH2 - xxx - R450 - 55/2
FEMALE HEADERS - Double row, 2.00mm pitch, THT Straight soldering technology. Side Entry Types. With a height from 4.40mm above PCB. Reliable contact thanks to Hi-rel dual beam contact with "Pin Stop"
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2.54mm pitch Female Header - THT - Straight Single and Double row, Side Entry
BH x - xxx - R850 - 55
FEMALE HEADERS - Single and Double row, 2.54mm pitch, THT Straight soldering technology. Side Entry Types. With a height from 3.40mm and 5.90mm above PCB. Reliable contact thanks to Hi-rel dual beam contact with "Pin Stop"
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2.54mm pitch Female Header - THT - for Box Header mating Straight and Right Angle
BW2 - xxx - X 850 - 55/P
FEMALE HEADERS - Double row, Shrouded Mating Types for Box Hearder mating, 2.54mm pitch. Available in THT vertical and THT right angle (horizontal) soldering tecnology. To connect with E-tec "Box Headers series S920 and R920" . With polarization bump.
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Mini – Mate Connector - SMT - female Block Shape
MMF - xxx - HB50 - 99/X
Mini-Mate™ "female" connectors, pitch 1.27mm interstitial (offset) in SMT technology as "block shape" version. Reverse polarity / twist protection by means of a notch on one side. To accommodate the polarization nose of the "male" connector, an additional hole (Ø1.80mm) is required in the PCB.
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Mini – Mate Connector - SMT - female Latch Shape
MMF - xxx - HL50 - 99/X
Mini-Mate™ "female" connector, pitch 1.27mm interstitial (offset) in SMT technology as "Latch Shape" version with snap-in lugs. Reverse polarity / twist protection by means of a notch on one side. To accommodate the polarization nose of the "male" connector, an additional hole (Ø1.80mm) is required in the PCB.
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Mini – Mate Connector - THT - female Block Shape
MMF - xxx - SB50 - 99/X
Mini-Mate™ "female" connector, pitch 1.27mm interstitial (offset) in THT soldering technology as "block shape" version. Reverse polarity / twist protection by means of a notch on one side. To accommodate the polarization nose of the "male" connector, an additional hole (Ø1.80mm) is required in the PCB.
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Mini – Mate Connector - THT - female Latch Shape
MMF - xxx - SL50 - 99/X
Mini-Mate ™ "female" connector, pitch 1.27mm interstitial (offset) in THT soldering technology as "Latch Shape" version with snap-in lugs. Reverse polarity / twist protection by means of a notch on one side. To accommodate the polarization nose of the "male" connector, an additional hole (Ø1.80mm) is required in the PCB.
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Mini – Mate Connector - THT 90° - female Block Shape
MMF - xxx - RB50 - 99
Mini-Mate™ "female" connector, pitch 1.27mm interstitial (offset) in horizontal THT soldering technology as "block shape" version. Reverse polarity / twist protection by means of a notch on one side. To accommodate the polarization nose of the "male" connector, an additional hole (Ø1.80mm) is required in the PCB.
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Mini – Mate Connector - THT 90° - female Latch Shape
MMF - xxx - RL50 - 99
Mini-Mate™ "female" connector, pitch 1.27mm interstitial (offset) in horizontal THT soldering technology as "latch shape" version. Reverse polarity / twist protection by means of a notch on one side. To accommodate the polarization nose of the "male" connector, an additional hole (Ø1.80mm) is required in the PCB.
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Mini – Mate Connector - THT male Shrounded
MMM - xxx - SS50 - 99
Mini-Mate™ "male" connectors, pitch 1.27mm interstitial (offset) in vertical THT soldering technology. Ideal for connecting a Mini-Mate™ "female" connector to establish a board-to-board connection. A polarization nose is the polarity reversal protection.
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Mini – Mate Connector - SMT male Shrounded
MMM - xxx - HS50 - 99
Mini-Mate™ "male" connectors, pitch 1.27mm interstitial (offset) in vertical SMT soldering technology. Ideal for connecting a Mini-Mate™ "female" connector to establish a board-to-board connection. A polarization nose is the polarity reversal protection.
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IDC - Female Connector 1.27mm pitch
IDS - xxx - W050 - 55 /P
IDC CONNECTORS - IDC Female Headers 1.27mm pitch. A perfect solution to attach a AWG30 flat-ribbon cables with a pitch of 0.635mm pitch. Design to mate with the E-tec Box Header Series SLS - xxx - H510 - 55/11X. HIgh quality dual beam contacts.
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IDC - Female Connector 2.00mm pitch
IDS - xxx - X 200 - N5 ( /P )
IDC CONNECTORS - IDC Female Headers 2.00mm pitch. A perfect solution to attach a AWG26 & 28 flat-ribbon cables with a pitch of 1.00mm pitch. Design to mate with the E-tec Box Header Series SLS - xxx - H562 - 55/2X. HIgh quality dual beam contacts.
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IDC - Female Connector 2.54mm pitch
IDS - xxx - X 100 - N5 /P
IDC CONNECTORS - IDC Female Headers 2.54mm pitch. A perfect solution to attach a AWG28 & 30 flat-ribbon cables with a pitch of 1.27mm pitch. Design to mate with the E-tec Box Header Series SLS - xxx - x103 - 55 / X , SLS - xxx - x920 - 55, SLS - xxx - H885 - 55/X and the DHX - xxx - x100 - 55 (DIN 41 651) . HIgh quality dual beam contacts.
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IDC - DIP Plug 2.00mm x 2.00mm IDC pitch 1.00mm
IDP - xxx - S200 - N5
IDC CONNECTORS - DIP Plugs 2.00mm x 2.00mm IDC pitch 1.00mm. A perfect solution to attach a flat-ribbon cables with a pitch of 1.00mm with a PCB board. Low profile, only 5.08mm height with the cable. Design for direct soldering to a PCB or to plug into a DIP Socket.
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IDC - DIP Plugs 2.54mm IDC pitch 1.27mm
IDP - xxx - Sxxx - N5
IDC CONNECTORS - DIP Plugs 2.54mm pitch , IDC pitch 1.27mm. A perfect solution to attach a flat-ribbon cables with a pitch of 1.27mm with a PCB board. Low profile, only 6.00mm height with the cable. Design for direct soldering to a PCB or to plug into a DIP Socket.
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IDC Transition Connector - THT - IDC pitch 1.27mm
IDP - xxx - T050 - 99
IDC CONNECTORS - Transition Connectors 2.54mm pitch 1.27mm with THT vertical soldering technology. Designed for 1.27mm pitch center flat ribbon cable. Low profile with only 7.10mm above the PCB after assembly.
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IDC Box Header 2.54mm pitch (IDC Shrouded Header)
IDH - xxx - X 100 - N5
IDC CONNECTORS - IDC Box Headers 2.54mm pitch (IDC Shrouded Header). Designed to mate with 2.54mm IDC Female Headers. These headers, available with or without mounting flange, can be connected to the E-tec female header of the series BW2-xxx-X850-xx-55/P, but also the E-tec IDC connector strips of the series IDS-xxx-X100-N5/P. DIN Hearde type IDD is available with long & short eject latches. Standard insulator colour is grey, other colours on request.
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IDC DIN Header -DIN 41 651- 2.54mm pitch (IDC Shrouded Header)
ID X - xxx - X 100 - N5
IDC CONNECTORS - IDC DIN Headers DIN 41 651 2.54mm pitch (IDC Shrouded Header). Designed to mate with 2.54mm IDC Female Headers. These headers, available with or without mounting ears. Can be connected to the E-tec IDC-X100-N5P series, but also the E-tec IDC connector strips. DIN Hearde type IDD is available with long & short eject latches. Standard insulator colour is grey, other colours on request.
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IDC - Card Edge Connector 2.54mm pitch
IDC - xxx - X 100 - N5
IDC CONNECTORS - IDC Card Edge Connectors 2.54mm pitch for flat-ribbon cables with 1.27mm pitch, Reliable PCB contact thanks to Hi-rel dual beam contact. PCB thicknesses from 1.38mm to 1.78mm are supported.
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Card Edge Connector - THT Straight - 1.27mm pitch
ECC - xxx - S050 - 95 /X
CARD EDGE CONNECTORS - Card Edge 1.27mm pitch THT Straight,highly reliable double contact (X Contact Style) for secure PCB connections. PCB thicknesses of 1.57mm ± 0.18 are supported. Connectors plastic peg or metal peg are also available.
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Card Edge Connector - THT Straight - 2.54mm pitch with M Contact Style
ECC - xxx /X - SC100 - 95
CARD EDGE CONNECTORS - Card Edge 2.54mm pitch THT Straight, highly reliable double M contact style for secure PCB connections. PCB thicknesses of 1.37mm to 1.78mm are supported. Connectors with mounting flange or solder pads for manual soldering are also available.
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Card Edge Connector - THT Straight - 2.54mm pitch with X Contact Style
ECC - xxx /X - S100 - 95
CARD EDGE CONNECTORS - Card Edge 2.54mm pitch THT Straight, highly reliable double X contact style for secure PCB connections. PCB thicknesses of 1.37mm to 1.78mm are supported. Connectors with mounting flange or solder pads for manual soldering are also available.
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Card Edge Connector - THT 90° right angle - 2.54mm pitch with M Contact Style
ECC - xxx /X - RC100 - 95
CARD EDGE CONNECTORS - Card Edge 2.54mm pitch THT 90° right angle, highly reliable double M contact style for secure PCB connections. PCB thicknesses of 1.37mm to 1.78mm are supported. Connectors with mounting flange or solder pads for manual soldering are also available.
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Card Edge Connector - THT 90° right angle - 2.54mm pitch with X Contact Style
ECC - xxx /X - R100 - 95
CARD EDGE CONNECTORS - Card Edge 2.54mm pitch THT 90° right angle, highly reliable double X contact style for secure PCB connections. PCB thicknesses of 1.37mm to 1.78mm are supported. Connectors with mounting flange or solder pads for manual soldering are also available.
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PCI Card Edge Connector - THT - 1.27mm pitch
ECC-xxx-Pxxx- xx
PCI CARD EDGE CONNECTORS - PCI 1.27mm pitch. These connectors have a highly reliable two-way contact to provide secure PCB connections. PCB thicknesses of 1.57mm ± 0.18 are supported. There are 3 different versions:
PCI 32bit with 120 contacts
PCI 64bit 3.3V with 184 contacts
PCI 64bit 5V with 184 contacts
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M.2 (NGFF) connector 75 contacts, pitch 0.50mm, A-Key Model
MPE-075-RXA9-55/X
M.2 (NGFF) connector, A-Key Model, 75 contacts pitch 0.50mm.
2 height options 3.05mm and 4.05mm
M.2, formerly called Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports. Because of the smaller and more flexible dimensions associated with extended functions, M.2 is better suited for connecting e.g. SSDs - especially in compact devices such as ultrabooks or tablets.
The M.2 standard describes four PCI Express lanes and a SATA Revision 3.x (6 Gbps) port - all in one connector. At each port, both bus systems can also be used in parallel.
Support higher data rates in a dense form factor
Ensure a secure connection with different module cards
Connectors meet the PCI-SIG industry standard
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M.2 (NGFF) connector 75 contacts, pitch 0.50mm, B-Key Model
MPE-075-RXB9-55/X
M.2 (NGFF) connector, B-Key Model, 75 contacts pitch 0.50mm.
2 height options 3.05mm and 4.05mm
M.2, formerly called Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports. Because of the smaller and more flexible dimensions associated with extended functions, M.2 is better suited for connecting e.g. SSDs - especially in compact devices such as ultrabooks or tablets.
The M.2 standard describes four PCI Express lanes and a SATA Revision 3.x (6 Gbps) port - all in one connector. At each port, both bus systems can also be used in parallel.
Support higher data rates in a dense form factor
Ensure a secure connection with different module cards
Connectors meet the PCI-SIG industry standard
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M.2 (NGFF) connector 75 contacts, pitch 0.50mm, E-Key Model
MPE-075-RXE9-55/X
M.2 (NGFF) connector, E-Key Model, 75 contacts pitch 0.50mm.
2 height options 3.05mm and 4.05mm
M.2, formerly called Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports. Because of the smaller and more flexible dimensions associated with extended functions, M.2 is better suited for connecting e.g. SSDs - especially in compact devices such as ultrabooks or tablets.
The M.2 standard describes four PCI Express lanes and a SATA Revision 3.x (6 Gbps) port - all in one connector. At each port, both bus systems can also be used in parallel.
Support higher data rates in a dense form factor
Ensure a secure connection with different module cards
Connectors meet the PCI-SIG industry standard
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M.2 (NGFF) connector 75 contacts, pitch 0.50mm, M-Key Model
MPE-075-RXM9-55/X
M.2 (NGFF) connector, M-Key Model, 75 contacts pitch 0.50mm.
2 height options 3.05mm and 4.05mm
M.2, formerly called Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports. Because of the smaller and more flexible dimensions associated with extended functions, M.2 is better suited for connecting e.g. SSDs - especially in compact devices such as ultrabooks or tablets.
The M.2 standard describes four PCI Express lanes and a SATA Revision 3.x (6 Gbps) port - all in one connector. At each port, both bus systems can also be used in parallel.
Support higher data rates in a dense form factor
Ensure a secure connection with different module cards
Connectors meet the PCI-SIG industry standard
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M.2 (NGFF) connector 75 contacts, pitch 0.50mm, M-Key reverse Model
MPE-075-REM9-55/R
M.2 (NGFF) connector, M-Key reverse Model, 75 contacts pitch 0.50mm.
2 height options 3.05mm and 4.05mm
M.2, formerly called Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports. Because of the smaller and more flexible dimensions associated with extended functions, M.2 is better suited for connecting e.g. SSDs - especially in compact devices such as ultrabooks or tablets.
The M.2 standard describes four PCI Express lanes and a SATA Revision 3.x (6 Gbps) port - all in one connector. At each port, both bus systems can also be used in parallel.
Support higher data rates in a dense form factor
Ensure a secure connection with different module cards
Connectors meet the PCI-SIG industry standard
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Mini PCI-Express SMT 52 contacts
MPE-052-RXB9-55/X
Mini PCI-Express right-angle plug-in sockets in SM technology with 52 contacts (for mini PCI ExpressCard), Mini PCI-Express Card sockets with pitch 0.80mm and 52 contacts, 9 different height, from 4.00 to 9.90 mm, With mechanical impact tests up to 50 G, Ensure a secure connection with different module cards, Connectors meet the PCI-SIG industry standard.
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SO-DIMM sockets 144-pin - SMT
DMD-144-RSA9-55
SO-DIMM sockets 144-pin available in different heights, also as "Piggyback". Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module.
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SO-DIMM sockets 200-pin - SMT
DMD-200-RXX9-55
SO-DIMM sockets 200-pin for SD-RAM types 1.8V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets 204-pin - SMT 5.20mm height
DMD-204-RSF9-55/TR
SO-DIMM sockets 204-pin 5.20mm height for SD-RAM types 1.5V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets 204-pin - SMT vertical
DMD-204-VLF9-55
SO-DIMM sockets 204-pin for SD-RAM types 1.5V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets 260-pin - SMT horizontal
DMD-260-RLG9-55/TR
SO-DIMM sockets 260-pin horizontal for SD-RAM types 1.2V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module. Gold plated contacts.
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SO-DIMM sockets 260-pin - SMT vertical
DMD-260-VLG9-5x/DT
SO-DIMM sockets 260-pin vertical for SD-RAM types 1.2V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module.
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SO-DIMM sockets 288-pin - SMT vertical
DMD-288-VF49-9x/8L
SO-DIMM sockets 288-pin vertical for SD-RAM types 1.2V. Metal clamps in the guide and holding arms prevent breakage during assembly and removal of the module.
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SIMM Sockets - THT - vertical and 26° slanted version
SM1-0xx-TX99-99/1MX
SIMM Sockets - THT - vertical and 26° slanted version 72- and 80-pin single row. Easy insertion of the SIM modules, secure hold by the side "metal latch". Long life of tinned contacts with "anti overstress" feature. Please contact us if you need a different number of poles.
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DIMM Sockets - THT - 168-pin horizontal 90° socket type
DM1-168-RCA9-95/1L
DIMM Sockets - THT - 168-pin horizontal 90° for UD-RAM modules in 3,3V version. The socket with selective gold-plated contacts. Tin on soldering, and gold in contact area. Other versions on request.
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DIMM Sockets - THT - 168-pin slanted 25° socket type
DM1-168-SCA8-95/1L
DIMM Sockets - THT - 168-pin slanted 25° for D-RAM, SD-RAM and UD-RAM modules in 3,3V version. The socket with selective gold-plated contacts. Tin on soldering, and gold in contact area.
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DIMM Sockets - THT - 184-pin vertical DDR socket type
DR1-184-VBZ9-95/1L
DIMM Sockets - THT - 184-pin vertical DDR for DDR modules in 2.5V version. The socket with selective gold-plated contacts. Tin in soldering, and gold in contact area. Other versions on request.
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DIMM Sockets - THT - 240-pin DDR-III
DR1-240-VAZ9-95/0LX
DIMM Sockets - THT - 240-pin DDR-III for DDR III modules in 1,5V version. The socket in "pink", "green" or "black" with selective gold-plated contacts. Tin in soldering, and gold in contact ar
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DIMM Sockets - THT - vertical 100-pin and 168-pin
DM1-1xx-VXX9-95/L
DIMM Sockets - THT - vertical, 100-pin for UD-RAM modules 3,3V. 168-pin for D-RAM, SD-RAM and UD-RAM modules 3,3V and 5,0V. The sockets have selective gold-plated contacts. Tin in soldering, and gold in contact area.
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FPC-FFC Connector ZIF Type - SMT - Vertical 0.50mm pitch
FCZ - xxx - VC5x - 99/RT
FPC/FFC CONNECTORS - ZIF FPC/FFC 0.50mm pitch, SMT vertical soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low. You can choose between "upper" or "lower" contact type.
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FPC-FFC Connector ZIF Type - SMT - Vertical 0.50mm pitch Serie V050
FCZ - xxx - V050 - 99/RP
FPC/FFC CONNECTORS - ZIF FPC/FFC 0.50mm pitch, SMT vertical soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low. You can choose between "upper" or "lower" contact type.
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FPC-FFC Connector ZIF Type - SMT - Vertical 1.00mm pitch
FCZ - xxx - VZ100 - 99 / XX
FPC/FFC CONNECTORS - ZIF FPC/FFC 1.00mm pitch, SMT vertical soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low. You can choose between "upper" or "lower" contact type.
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FPC-FFC Connector ZIF Type - SMT - Horizontal 0.50mm pitch
FCZ - xxx - HC5x - 99 /R
FPC/FFC CONNECTORS - ZIF FPC/FFC 0.50mm pitch, SMT horizontal soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low. You can choose between "upper" or "lower" contact type.
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FPC-FFC Connector ZIF Type - SMT - Horizontal 0.50mm pitch H50 Series
FCZ - xxx - H050 - 99 /R
FPC/FFC CONNECTORS - ZIF FPC/FFC 0.50mm pitch, SMT horizontal soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low. You can choose between "upper" or "lower" contact type.
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FPC-FFC Connector ZIF Type - SMT - Horizontal 1.00mm pitch
FCZ - xxx - H10x - 99 /R
FPC/FFC CONNECTORS - ZIF FPC/FFC 1.00mm pitch, SMT horizontal soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low. You can choose between "upper" or "lower" contact type.
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FPC-FFC Connector ZIF -Easy-on- Type - SMT - Horizontal 0.50mm pitch
FCZ - xxx - H058- 99 /X
FPC/FFC CONNECTORS - ZIF "Easy-on" FPC/FFC 0.50mm pitch, SMT horizontal soldering technology. The "Easy-on" connector is easy to use because the "Flex Board" (FPC) or the "Flex Cable" (FFC) is only inserted and after clamped with the flap.
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FPC-FFC Connector ZIF Type - THT - Vertical 1.00mm pitch
FCZ - xxx - SL100 - 99
FPC/FFC CONNECTORS - ZIF FPC/FFC 1.00mm pitch, THT vertical soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low.
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FPC-FFC Connector ZIF Type - THT - Right angle 1.00mm pitch
FCZ - xxx - RL10x - 99
FPC/FFC CONNECTORS - ZIF FPC/FFC 1.00mm pitch, THT right angle soldering technology. With the ZIF (Zero Insertion Force) connector is no need to apply much force to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). The locking is done by hand. The force required for this manipulation is extremely low.
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FPC-FFC Connector LIF Type - SMT - Vertical 1.00mm pitch
FCL - xxx - V100 - 99 /X
FPC/FFC CONNECTORS - LIF FPC/FFC 1.00mm pitch, SMT vertical soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - SMT - Horizontal 1.00mm pitch
FCL - xxx - H100 - 99 /X
FPC/FFC CONNECTORS - LIF FPC/FFC 1.00mm pitch, SMT horizontal soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - SMT - Horizontal 1.25mm pitch
FCL - xxx - H125 - 99 /X
FPC/FFC CONNECTORS - LIF FPC/FFC 1.25mm pitch, SMT horizontal soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - THT - Vertical 1.00mm pitch
FCL - xxx - S100 - 99
FPC/FFC CONNECTORS - LIF FPC/FFC 1.00mm pitch, THT vertical soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - THT - Vertical 1.25mm pitch
FCL - xxx - S125 - 99
FPC/FFC CONNECTORS - LIF FPC/FFC 1.25mm pitch, THT vertical soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - THT - Vertical 2.54mm pitch
FPC - xxx - S254 - 99
FPC/FFC CONNECTORS - LIF FPC/FFC 2.54mm pitch, THT vertical soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). Suitable to contact flat ribbon cable (FRC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - THT - Right angle 1.00mm pitch
FCL - xxx - R100 - 99
FPC/FFC CONNECTORS - LIF FPC/FFC 1.00mm pitch, THT right angle soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - THT - Right angle 1.25mm pitch
FCL - xxx - R125 - 99
FPC/FFC CONNECTORS - LIF FPC/FFC 1.25mm pitch, THT right angle soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). There is no additional locking in this version.
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FPC-FFC Connector LIF Type - THT - Right angle 2.54mm pitch
FPC - xxx - R254 - 99
FPC/FFC CONNECTORS - LIF FPC/FFC 2.54mm pitch, THT right angle soldering technology. Low force is required to insert the "Flex Board" (FPC) or the "Flex Cable" (FFC). Suitable to contact flat ribbon cable (FRC). There is no additional locking in this version.
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Flex Cable 0.50mm to 2.54mm pitch
FCA - xxx - Xxxx - xxxx- x
FLEX CABLE - FLEX CABLE 0.50mm to 2.54mm pitch. The flexible ribbon cables from E-tec have up to 200 cores. The distance between the cores can be 0.50 mm for a maximum of 200 cores, up to 2.54 mm for a maximum of 38 cores. Standard is a light gray PVC material, with a red or black border marking the first wire. On request, there are also color-coded ribbon cables in which adjacent wires have ten different colors according to DIN IEC 62. The ribbon cables can also be provided with a shielding, made of aluminum or copper foil, upon customer request.
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Flat Flex Cable Jumper
FCJ - xxx - Xxxx - XX / xxxx - x
Flat Flex Cable Jumpers are soldered Board to Board connection and are used in places where electrical connections require a high flexibility and/or PCBs to be connected are subject to vibrations.
A simple but effective board to board solution allows flexible movement between PCBs without compromising performance in demanding environments. Simple and quick to assemble, once manually placed into PCB and flow soldered these jumper cables provide a robust connection.
Available in pitches between 1.0mm and 5.08mm to provide current rating per conductor from 1.0A to 4.0A (and common sizes in between).
Available with PET or highly durable Nomex(TM) insulators.
For further information, please contact our office.
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ZIF Test Sockets to place outside your board for Flex Cable 0.40mm to 2.54mm pitch
Fxx - x xx - X xxx - xx
The ZIF test Socket are used for functional and reliability high cycle testing for Flex Cables, Displays and Membrane keyboards.
The FCP and FTU Series are to be placed outside your board and connected with a falt cable to your actual board. From 0.40mm to 2.54mm pitch.
*Pitch 0.40mm only available on Solderless Compression type
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ZIF Test Sockets to place on your board for Flex Cable 0.40mm to 2.54mm pitch
FCT - x xx - X xxx - xx
The ZIF test Socket are used for functional and reliability high cycle testing for Flex Cables, Displays and Membrane keyboards.
The FCT Series are to be place on your board, you can choose to fix the socket directly on your PCB with our different mounting options as Solderless / SMT / THT depend on pitch and application.
*Pitch 0.40mm only available on Solderless Compression type
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ZIF Test Socket, for Flex Cables, Displays and Membrane Keyboards to place OUTSIDE your board. Pitch 0.40mm to 2.54mm pitch
Fxx-xxx-Xxxx-xx
The ZIF test Socket are used for functional and reliability high cycle testing for Flex Cables, Displays and Membrane keyboards.
The FCP and FTU Series are to be placed outside your board and connected with a falt cable to your actual board. From 0.40mm to 2.54mm pitch.
*Pitch 0.40mm only available on Solderless Compression type
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ZIF Test Socket, for Flex Cables, Displays and Membrane Keyboards to place ON YOUR board. Pitch 0.40mm to 2.54mm pitch
FCT-xxx-Xxxx-xx
The ZIF test Socket are used for functional and reliability high cycle testing for Flex Cables, Displays and Membrane keyboards.
The FCT Series are to be place on your board, you can choose to fix the socket directly on your PCB with our different mounting options as Solderless / SMT / THT depend on pitch and application.
*Pitch 0.40mm only available on Solderless Compression type
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1.27mm pitch SMC Multi BUS-Backplane connector to IDC - Height 13.70mm
MBC-xxx-BIC52-xx/11L
SMC Multi BUS/Backplane connector 1.27mm pitch, Female header to IDC, height (overall) - 13.70mm. Compatible ro ERNI INTERact® Series SMC Type. Available in 10, 12, 16, 20, 26, 30, 32, 40, 50, 68 and 80 poles
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1.27mm pitch SMC Multi BUS-Backplane connector Type Q - Height 3.85mm
MBC-xxx-QFH38-xx/11Q
SMC Multi BUS/Backplane connector 1.27mm pitch, Female header SMT horizontal soldering technology, height (unplugged) - 3.85mm. Available in 12, 20, 26, 32, 40, 50, 68, 80 and 100 poles
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SMC Multi BUS-Backplane connector Type B - Height 6.20mm - 1.27mm pitch
MBC-xxx-BFV62-xx/11E
SMC Multi BUS/Backplane connector 1.27mm pitch, Female header SMT vertical soldering technology, height (unplugged) - 6.20mm. Available in 12, 16, 20, 26, 30, 32, 40, 50, 68 and 80 poles
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SMC Multi BUS-Backplane connector Type B - Height 9.00mm - 1.27mm pitch
MBC-xxx-BFV90-xx/11E
SMC Multi BUS/Backplane connector 1.27mm pitch, Female header SMT vertical soldering technology, height (unplugged) - 9.00mm. Available in 12, 16, 20, 26, 30, 32, 40, 50, 68 and 80 poles
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SMC Multi BUS-Backplane connector Type B - Height 13.65mm - 1.27mm pitch
MBC-xxx-BFV136-xx/11E
SMC Multi BUS/Backplane connector 1.27mm pitch, Female header SMT vertical soldering technology, height (unplugged) - 13.65mm. Available in 12, 16, 20, 26, 30, 32, 40 and 50 poles
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1.27mm pitch SMC Multi BUS-Backplane connector Type B - Height 4.20mm
MBC-xxx-BMH42-xx/11G
SMC Multi BUS/Backplane connector 1.27mm pitch, Male header SMT horizontal soldering technology, height (unplugged) - 4.20mm. Available in 10, 12, 16, 20, 26, 30, 32, 40, 50, 68 and 80 poles
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SMC Multi BUS-Backplane connector Type Q - Height 6.70mm - 1.27mm pitch
MBC-xxx-QMV67-xx/11E
SMC Multi BUS/Backplane connector 1.27mm pitch, Male header SMT vertical soldering technology, height (unplugged) - 6.70mm. Available in 10, 12, 16, 20, 26, 30, 32, 40, 50, 68 and 80 poles
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SMC Multi BUS-Backplane connector Type Q - Height 8.20mm - 1.27mm pitch
MBC-xxx-QMV82-xx/11E
SMC Multi BUS/Backplane connector 1.27mm pitch, Male header SMT vertical soldering technology, height (unplugged) - 8.20mm. Available in 12, 16, 20, 26, 30, 32, 40, 50, 68, 80 and 100 poles
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SMC Multi BUS-Backplane connector Type Q - Height 9.90mm - 1.27mm pitch
MBC-xxx-QMV99-xx/11E
SMC Multi BUS/Backplane connector 1.27mm pitch, Male header SMT vertical soldering technology, height (unplugged) - 9.90mm. 40 poles
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Special F-Contact Strip 90 degrees Board-to-board
PCB-xxx-Rxxx-99/x
Special F-Contact 90 degrees Board-to-board 2,50 mm / 5,00 mm / 7,50 mm pitch connector for 90° board-to-board connections. Compatible with ITT Cannon G09 connectors. Ultra low profile with only 1.80 mm above board. Used in consumer as well as industrial applications. Any pincount available between 1 and 27. Plastic can be easily broken to desired size. Tin Plated
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2.00mm pitch Wire to Wire Waterproof Female connectors, Crimp contact
WWR-xxx-64-09-A/2
Wire to Wire Waterproof IPX7 connector 2.00mm pitch Femaile crimp contact. Compatible with the JST "JWPF" series. With 2 - 3 or 4-pin contacts for AWG22 to AWG24.
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2.00mm pitch Wire to Wire Waterproof Male connectors, Crimp contact
WWP-xxx-64-09-A/2
Wire to Wire Waterproof IPX7 connector 2.00mm pitch Male Plug crimp contact. Compatible with the JST "JWPF" series. With 2 - 3 or 4-pin contacts for AWG22 to AWG24.
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1.00mm Wire to Board Crimp Contact Connectors
CRX-x xx-X100-99/X
Crimp contact Female and Male 1.00mm pitch, 1-row and 2-row versions are available. The E-tec L-Type 1-row compatible with the JST "SH series". The male header, in surface mount SMT technology, vertical and horizontal. Matching the plug with crimp contacts for AWG28 to AWG32 cable. Other 1.00mm versions on request.
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1.25mm Wire to Board Crimp Contact Connectors
CRX-x xx-X125-99/X
Crimp contact Female and Male 1-row 1.25mm pitch, the S-Type, THT soldering technology, vertical and horizontal, as well as the SS-Type SMTsurface mount technology , vertical and horizontal. For both versions the matching plug with crimp contacts for AWG28 to AWG32. Other 1.25mm pitch versions on request.
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1.50mm Wire to Board Crimp Contact Connectors
CRX-x xx-X150-99/X
Crimp contact Female and Male 1-row 1.50mm pitch, the K-Type, THT soldering technology, vertical and horizontal, as well as the SK-Type SMTsurface mount technology , vertical and horizontal. For both versions the matching plug with crimp contacts for AWG28 to AWG32. Other 1.25mm pitch versions on request.
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2.00mm Wire to Board Crimp Contact Connectors
CRX-x xx-X200-99
Crimp contact Female and Male 1-row and 2-row versions, 2.00mm pitch, Compatible to the JST "PH-series", E-tec offers the O-type 1-row, and the H-type 2-row compatible to the JST "PHD-series". Both types only in THT (soldering technique), vertical and horizontal. For this purpose the matching plugs with crimp contacts, 1-row for AWG26 to AWG30, and 2-row for AWG22 to AWG28 cable. The E-tec C-type, 1-row THT (soldering technique) vertical and horizontal, as well as SMT (Surface Mount Technology), is compatible with the Tyco "CT-series". Other 2.00mm pitch versions on request.
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2.50mm Wire to Board Crimp Contact Connectors
CRX-x xx-X250-99
Crimp contact Female and Male 1-row 2.50mm pitch, the S-Type, THT soldering technology, vertical and horizontal. Different versions the matching plug with crimp contacts for AWG22 to AWG30. Other 2.50mm pitch versions on request.
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2.54mm Wire to Board Crimp Contact Connectors
CRX-x xx-X254-99
Crimp contact Female and Male 1-row and 2-row versions 2.54mm pitch, the F-type, 1-row vertical and horizontal in THT (Through-hole technique) as "Friction Lock". For this purpose the plug with crimp contacts for AWG22 to AWG28 cable. The H-types, 1 and 2-row plugs with crimp contacts for AWG22 to AWG28 cables, can be plugged on pin headers, or box headers with coding. The pins should have a dimension of 0.64mmx0.64mm. Other 2.54mm versions on request.
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3.00mm Wire to Board Power Connectors Crimp Contact
PCX-x xx-X300-99/X
WIRE TO BOARD POWER CONNECTORS - 3.00mm pitch Compatible with the Molex series Micro Fit 3.0™, E-tec offers the W-type in THT (soldering technique), vertical and horizontal. SMT (surface mount technology) has the vertical SC-type with solder clips and the SW-type with solder tabs. For this purpose the matching plug with crimp contacts for AWG20 to AWG24.
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3.96mm Wire to Board Power Connectors Crimp Contact and IDC Connectors
XXX-x xx-X396-99
WIRE TO BOARD POWER CONNECTORS - 3.96mm pitch. "Friction Lock", F-type in THT (single-soldering), vertical and horizontal 1-row, and the matching plug with crimp contacts for AWG18 to AWG24 cable. "Latch Lock", L-type in THT (single soldering), vertical 1-row, and the matching plug with crimp contacts for AWG18 to AWG24 cables. "Quick Lock", Q-type in THT (single-soldering), vertical and horizontal 1-row, and the matching plug with crimp contacts for AWG18 to AWG22 cable. Other 3.96mm pitch versions on request.
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4.20mm Wire to Board Power Connectors Crimp Contact
PCX-x xx-X420-99
WIRE TO BOARD POWER CONNECTORS - 4.20mm pitch. Whether A-type, P-type or W-type, 1-row, 2-row in THT (soldering technique) and the matching plugs with crimp contacts for AWG16 to AWG24 are 100% compatible with the Molex Series Mini-Fit RTC™. Other coupling options, PCB clip lock, on request.
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5.08mm Wire to Board Power Connectors Crimp Contact and IDC Connectors
PCX-x xx-X508-99
WIRE TO BOARD POWER CONNECTORS - 5.08mm pitch. This classic power connectors are available as : "Friction Lock", F-type in THT (single-soldering), vertical and horizontal 1-row, and the matching plug with crimp contacts for AWG18 to AWG24 cable. "Box", T-type in THT (soldering technique), vertical 1-row, and the matching plug P-type with crimp contacts for AWG18 to AWG20 cables. "Wire to wire", P-type / C-type with crimp contacts for AWG18 to AWG22 cables, and as IDC I-type, for AWG18 to AWG20 cables. Other 5.08mm pitch versions on request.
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6.35mm Wire to Board Power Connectors Crimp Contact
PCX-x xx-X635-99/X
WIRE TO BOARD POWER CONNECTORS - 6.35mm pitch. The P-type is compatible with the Molex series MLX™. The male or female header, THT (soldering technique), vertical and horizontal, to match the plugs, optionally available with male or female crimp contacts for AWG16 to AWG20 cables. Also available is a wire to wire connector with crimp contacts for AWG16 to AWG20 cables. More 6.35mm pitch versions on request.
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MCX - Crimp Jack
RFJ–MCS–C1N502–58
These MCX miniature snap-on connectors with 50Ω impedance operate in a frequency range up to 6 GHz.
The MCX series is an ideal solution for GPS, wireless communications and testmeasurement applications.
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MMCX - Crimp Jack
RFJ–MMS–C1N502–58
MMCX series with 50Ω impedance offer the smallest dimensions for high density applications.
The MMCX connectors work a frequency range up to 6 GHz and they can be offered in thru-hole and surface mount technology for flexible and semi-rigid coaxial cable interconnection systems.
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SMA - Crimp Jack
RFJ–SAS–C1N502–58
SMA connectors with 50Ω impedance are high precision subminiature devices designed for microwave applications up to 18 GHz.
These connectors are produced with brass or high quality stainless steel, whichoffer excellent durability and mechanical strength.
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SMA Reverse - Crimp Jack
RFJ–SRS–C1N502–58
SMA Reverse connectors with 50Ω impedance are designed for using in spread spectrumwireless applications which a non-standard interface is needed.
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SMB - Crimp Jack
RFJ–SBS–C1N502–58
SMB connectors with 50Ω impedance are subminiature devices designed for repeatable electrical performance up to 4 GHz.
These SMB connectors offer a simple open/close snap-on coupling feature and which have become very popular in telecommunications, test equipments and instrumentation
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1.6-5.6 - Crimp Plug
RFP–16S–C1N733–N5
1.6/5.6 coaxial connectors with 75Ω impedance are generally designed for radio and digital signal transmissions.
These 1.6/5.6 connectors have become popular in modern telecommunication equipments
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MCX - Crimp Plug
RFP–MCS–C1N502–58
These MCX miniature snap-on connectors with 50Ω impedance operate in a frequency range up to 6 GHz.
The MCX series is an ideal solution for GPS, wireless communications and testmeasurement applications.
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SMA - Crimp Plug
RFP–SAS–C1N502–58
SMA connectors with 50Ω impedance are high precision subminiature devices designed for microwave applications up to 18 GHz.
These connectors are produced with brass or high quality stainless steel, whichoffer excellent durability and mechanical strength.
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SMA Reverse - Crimp Plug
RFP–SRS–C1N502–58
SMA Reverse connectors with 50Ω impedance are designed for using in spread spectrumwireless applications which a non-standard interface is needed.
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SMB - Crimp Plug
RFP–SBS–C1N502–58
SMB connectors with 50Ω impedance are subminiature devices designed for repeatable electrical performance up to 4 GHz.
These SMB connectors offer a simple open/close snap-on coupling feature and which have become very popular in telecommunications, test equipments and instrumentation
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1.6-5.6 - Right Angle Crimp Jack
RFJ–16R–C1B733–N5
1.6/5.6 coaxial connectors with 75Ω impedance are generally designed for radio and digital signal transmissions.
These 1.6/5.6 connectors have become popular in modern telecommunication equipments
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MCX - Right Angle Crimp Plug
RFP–MCR–C1N502–58
These MCX miniature snap-on connectors with 50Ω impedance operate in a frequency range up to 6 GHz.
The MCX series is an ideal solution for GPS, wireless communications and testmeasurement applications.
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MMCX - Right Angle Crimp Plug
RFP–MMR–C1N502–58
MMCX series with 50Ω impedance offer the smallest dimensions for high density applications.
The MMCX connectors work a frequency range up to 6 GHz and they can be offered in thru-hole and surface mount technology for flexible and semi-rigid coaxial cable interconnection systems.
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SMA Reverse - Right Angle Crimp Plug
RFP–SRR–C1N502–58
SMA Reverse connectors with 50Ω impedance are designed for using in spread spectrumwireless applications which a non-standard interface is needed.
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1.6-5.6 - Right Angle Clamp Plug
RFP–16R–C2N733–N5
1.6/5.6 coaxial connectors with 75Ω impedance are generally designed for radio and digital signal transmissions.
These 1.6/5.6 connectors have become popular in modern telecommunication equipments
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1.6-5.6 - Right Angle THT Jack
RFJ–16R–B1B792–N5
1.6/5.6 coaxial connectors with 75Ω impedance are generally designed for radio and digital signal transmissions.
These 1.6/5.6 connectors have become popular in modern telecommunication equipments
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MCX - Right Angle THT Jack
RFJ–MCR–B1N592–58
These MCX miniature snap-on connectors with 50Ω impedance operate in a frequency range up to 6 GHz.
The MCX series is an ideal solution for GPS, wireless communications and testmeasurement applications.
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SMA - Right Angle THT Jack
RFJ–SAR–B1N592–58
SMA connectors with 50Ω impedance are high precision subminiature devices designed for microwave applications up to 18 GHz.
These connectors are produced with brass or high quality stainless steel, whichoffer excellent durability and mechanical strength.
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SMA Reverse - Right Angle THT Jack
RFJ–SRR–B1N592–58
SMA Reverse connectors with 50Ω impedance are designed for using in spread spectrumwireless applications which a non-standard interface is needed.
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SMB - Right Angle THT Plug
RFP–SBR–B1N592–58
SMB connectors with 50Ω impedance are subminiature devices designed for repeatable electrical performance up to 4 GHz.
These SMB connectors offer a simple open/close snap-on coupling feature and which have become very popular in telecommunications, test equipments and instrumentation
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SMA - Straight End Launch Jack
RFJ–SAS–B3L592–58
SMA connectors with 50Ω impedance are high precision subminiature devices designed for microwave applications up to 18 GHz.
These connectors are produced with brass or high quality stainless steel, whichoffer excellent durability and mechanical strength.
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MCX - Straight THT Jack
RFJ–MCS–B1N592–58
These MCX miniature snap-on connectors with 50Ω impedance operate in a frequency range up to 6 GHz.
The MCX series is an ideal solution for GPS, wireless communications and testmeasurement applications.
See more ...
MMCX - Straight THT Jack
RFJ–MMS–B1N592–58
MMCX series with 50Ω impedance offer the smallest dimensions for high density applications.
The MMCX connectors work a frequency range up to 6 GHz and they can be offered in thru-hole and surface mount technology for flexible and semi-rigid coaxial cable interconnection systems.
See more ...
SMA Reverse - Straight THT Jack
RFJ–SRS–B1N592–58
SMA Reverse connectors with 50Ω impedance are designed for using in spread spectrumwireless applications which a non-standard interface is needed.
See more ...
SMB - Straight THT Jack
RFJ–SBS–B1N592–58
SMB connectors with 50Ω impedance are subminiature devices designed for repeatable electrical performance up to 4 GHz.
These SMB connectors offer a simple open/close snap-on coupling feature and which have become very popular in telecommunications, test equipments and instrumentation
See more ...
MMCX - Straight SMT Jack
RFJ–MMS–B2L592–58
MMCX series with 50Ω impedance offer the smallest dimensions for high density applications.
The MMCX connectors work a frequency range up to 6 GHz and they can be offered in thru-hole and surface mount technology for flexible and semi-rigid coaxial cable interconnection systems.
See more ...
MMCX - Straight THT Plug
RFP–MMS–B1N592–58
MMCX series with 50Ω impedance offer the smallest dimensions for high density applications.
The MMCX connectors work a frequency range up to 6 GHz and they can be offered in thru-hole and surface mount technology for flexible and semi-rigid coaxial cable interconnection systems.
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SMA - Panel Jack
RFJ–SAS–P1A591–58
SMA connectors with 50Ω impedance are high precision subminiature devices designed for microwave applications up to 18 GHz.
These connectors are produced with brass or high quality stainless steel, whichoffer excellent durability and mechanical strength.
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SMB - Panel Jack
RFJ–SBS–P1B591–58
SMB connectors with 50Ω impedance are subminiature devices designed for repeatable electrical performance up to 4 GHz.
These SMB connectors offer a simple open/close snap-on coupling feature and which have become very popular in telecommunications, test equipments and instrumentation
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M8 Cable Assembly A-Coding 3-Contacts Female - Female
MCC-M08FA03/M08FA03-xxxx-00
M8 Cable Assembly A-Coding 3-Contacts Female / Female. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M8 Cable Assembly A-Coding 3-Contacts Male - Male
MCC-M08MA03/M08MA03-xxxx-00
M8 Cable Assembly A-Coding 3-Contacts Male / Male. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M8 Cable Assembly A-Coding 4-Contacts Female - Female
MCC-M08FA04/M08FA04-xxxx-00
M8 Cable Assembly A-Coding 4-Contacts Female / Female. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M8 Cable Assembly A-Coding 4-Contacts Male - Male
MCC-M08MA04/M08MA04-xxxx-00
M8 Cable Assembly A-Coding 4-Contacts Male / Male. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M8 Cable Assembly B-Coding 5-Contacts Female - Female
MCC-M08FB05/M08FB05-xxxx-00
M8 Cable Assembly B-Coding 5-Contacts Female / Female. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M8 Cable Assembly B-Coding 5-Contacts Male - Male 4-pin
MCC-M08MB05/M08MB05-xxxx-00
M8 Cable Assembly B-Coding 5-Contacts Male / Male. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M8 Circular Connector A-Coding Solder Cup Female
M08-FA03-CVRP-55/00
M8 Circular Connector A-Coding 3-pin Female, Solder Cup for hand soldering on panel rear PCB. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
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M8 Circular Connector A-Coding Solder Cup Male
M08-MA03-CVFP-55/00
M8 Circular Connector A-Coding 3-pin Male, Solder Cup for hand soldering on panel rear PCB. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards.
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M8 Circular Connector B-Coding Solder Cup Female
M08-FB05-CVRP-55/00
M8 Circular Connector B-Coding 5-pin Female, Solder Cup for hand soldering on panel rear PCB. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
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M8 Circular Connector B-Coding Solder Cup Male
M08-MB05-CVFP-55/00
M8 Circular Connector B-Coding 5-pin Male, Solder Cup for hand soldering on panel rear PCB. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
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M8 Circular Connector A-Coding THT Vertical Female
M08-FA04-TVRP-55/00
M8 Circular Connector A-Coding 4-pin Female, THT PCB Panel Rear Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
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M8 Circular Connector A-Coding THT Vertical Male
M08-MA04-TVFP-55/00
M8 Circular Connector A-Coding 4-pin Male, THT PCB Panel Rear Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
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M8 Circular Connector B-Coding THT Vertical Male
M08-MB05-TVFP-55/00
M8 Circular Connector B-Coding 5-pin Male, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-104:2014 standards. Others contacts counts on request.
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M12 Cable Assembly A-Coding 4-Contacts Female - Female
MCC-M12FA04/M12FA04-xxxx-00
M12 Cable Assembly A-Coding 4-Contacts Female / Female. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M12 Cable Assembly A-Coding 4-Contacts Male - Male
MCC-M12MA04/M12MA04-xxxx-00
M12 Cable Assembly A-Coding 4-Contacts Male / Male. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M12 Cable Assembly A-Coding 5-Contacts Female - Female
MCC-M12FA05/M12FA05-xxxx-00
M12 Cable Assembly A-Coding 5-Contacts Female / Female. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M12 Cable Assembly A-Coding 5-Contacts Male - Male
MCC-M12MA05/M12MA05-xxxx-00
M12 Cable Assembly A-Coding 5-Contacts Male / Male. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M12 Cable Assembly A-Coding 8-Contacts Female - Female
MCC-M12FA08/M12FA08-xxxx-00
M12 Cable Assembly A-Coding 8-Contacts Female / Female. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M12 Cable Assembly A-Coding 8-Contacts Male - Male
MCC-M12MA08/M12MA08-xxxx-00
M12 Cable Assembly A-Coding 8-Contacts Male / Male. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
E-tec offer you others M8 Cable assembly configurations as per your needs. Standard are Female / Female extension cable but also available as Female / Female or Female / Male.
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M12 Circular Connector A-Coding Female Field Assembly
M12-FA05-CVFA-55/00
M12 Circular Connector A-Coding "Field Assembly Version" 5-pin Female, Solder Cup for hand soldering. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding Female Field Assembly
M12-FD04-CVFA-55/00
M12 Circular Connector D-Coding "Field Assembly Version" 4-pin Female, Solder Cup for hand soldering. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding Male Field Assembly
M12-MD04-CVFA-55/00
M12 Circular Connector D-Coding "Field Assembly Version" 4-pin Male, Solder Cup for hand soldering. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding Solder Cup Female 5-pin
M12-FA05-CVFP-55/00
M12 Circular Connector A-Coding 5-pin Female, Solder Cup for hand soldering on PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding Solder Cup Female 8-pin
M12-FA08-CVFP-55/00
M12 Circular Connector A-Coding 8-pin Female, Solder Cup for hand soldering on PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding Solder Cup Male 5-pin
M12-MA05-CVFP-55/00
M12 Circular Connector A-Coding 5-pin Male, Solder Cup for hand soldering on PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding Solder Cup Male 5-pin Rear panel mont
M12-MA05-CVRP-55/00
M12 Circular Connector A-Coding 5-pin Male, Solder Cup for hand soldering on PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding Solder Cup Male 8-pin
M12-MA08-CVFP-55/00
M12 Circular Connector A-Coding 8-pin Male, Solder Cup for hand soldering on PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding Solder Cup Female
M12-FD04-CVFP-55/00
M12 Circular Connector D-Coding 4-pin Female, Solder Cup for hand soldering on PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding Solder Cup Female Rear panel mont
M12-FD04-CVRP-55/00
M12 Circular Connector D-Coding 4-pin Female, Solder Cup for hand soldering on PCB Panel Rear Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding THT Right Angle Female
M12-FA05-THFP-55/X00
M12 Circular Connector A-Coding 5-pin Female, THT Right Angle, PCB Panel Front Mount. Waterproof IP67. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding THT Right Angle Female
M12-FD04-THFP-55/00
M12 Circular Connector D-Coding 4-pin Female, THT Right Angle, PCB Panel Front Mount. Waterproof IP67. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding THT Vertical Female 4-pin
M12-FA04-TVFP-55/00
M12 Circular Connector A-Coding 4-pin Female, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding THT Vertical Female 5-pin
M12-FA05-TVFP-55/00
M12 Circular Connector A-Coding 5-pin Female, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding THT Vertical Male 4-pin
M12-MA04-TVFP-55/00
M12 Circular Connector A-Coding 4-pin Male, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding THT Vertical Male 5-pin
M12-MA05-TVFP-55/00
M12 Circular Connector A-Coding 5-pin Male, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector A-Coding THT Vertical Male 8-pin
M12-MA08-TVFP-55/00
M12 Circular Connector A-Coding 8-pin Male, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding THT Vertical Female
M12-FD04-TVFP-55/00
M12 Circular Connector D-Coding 4-pin Female, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding THT Vertical Female Rear panel mont
M12-FD04-TVRP-55/00
M12 Circular Connector D-Coding 4-pin Female, THT PCB Panel Rear Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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M12 Circular Connector D-Coding THT Vertical Male
M12-MD04-TVFP-55/00
M12 Circular Connector D-Coding 4-pin Male, THT PCB Panel Front Mount. Waterproof IP68. Coding in accordance with IEC 61076-2-101:2012 standards. Others contacts counts on request.
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D-Sub Ultra Slim 15-Pin Female- SMT 90°
SSF-015-HU98-95/x
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
15-Pin Female SMT 90 degrees with a depth of only 4.30m, Available with "Fork board lock" or "Round board lock" option. Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 25-Pin Female- SMT 90°
SSF-025-U908-95/x
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
25-Pin Female SMT 90 degrees with a depth of only 4.30m, Available with "Fork board lock" or "Round board lock" option. Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 25-Pin Male- SMT 90°
SSM-025-U908-95/x
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
25-Pin Male SMT 90 degrees with a depth of only 4.30m, Available with "Fork board lock" or "Round board lock" option. Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 9-Pin Female- SMT 90°
SSF-009-U908-95/x
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
9-Pin Female SMT 90 degrees with a depth of only 4.30m, Available with "Fork board lock" or "Round board lock" option. Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 9-Pin Male- SMT 90°
SSM-009-U908-95/x
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
9-Pin Male SMT 90 degrees with a depth of only 4.30m, Available with "Fork board lock" or "Round board lock" option. Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 15-Pin Female - THT 90°
SDF-015-US91-95/xN
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
15-Pin Female THT 90 degrees with a depth of only 4.40m, with Wave Solder or Pin-in-paste soldering technology option. Available with "Fork board lock" or "Round board lock". Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 15-Pin Female High Density- THT 90°
SHF-015-US98-95/VxN
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
High Density 15-Pin Female THT 90 degrees with a depth of only 4.40m, with Wave Solder or Pin-in-paste soldering technology option. Available with "Fork board lock" or "Round board lock". Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 25-Pin Female - THT 90°
SDF-025-US91F-95/xN
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
25-Pin Female THT 90 degrees with a depth of only 4.40m, with Wave Solder or Pin-in-paste soldering technology option. Available with "Fork board lock" or "Round board lock". Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 9-Pin Female - THT 90°
SDF-009-US91-95/xN
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
9-Pin Female THT 90 degrees with a depth of only 4.40m, with Wave Solder or Pin-in-paste soldering technology option. Available with "Fork board lock" or "Round board lock". Jack Screw has to be ordered separately.
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D-Sub Ultra Slim 9-Pin Male - THT 90°
SDM-009-US91F-95/xN
Ultra Slim Profile D-Sub connectors are used wherever you need space on your PC board.
9-Pin Male THT 90 degrees with a depth of only 4.40m, with Wave Solder or Pin-in-paste soldering technology option. Available with "Fork board lock" or "Round board lock". Jack Screw has to be ordered separately.
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Micro D-Sub Connector Female Cable crimp kit
MSF-xxx-CS07-AK
Micro D-Sub Connector Female Cable crimp assembly kit for self-assembly. Available in 9-, 15- and 25-contacts.
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Micro D-Sub Dual port Connector 15-Pin - 15-Pin Male THT 90°
MSD-1515-0-97-MNx
Micro D-Sub Dual port Connector 15-Pin / 15-Pin Male, THT 90° with assembly brackets and optional Jack Screw
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Micro D-Sub Dual port Connector 9-Pin - 9-Pin Male THT 90°
MSD-0909-0-97-MNx
Micro D-Sub Dual port Connector 9-Pin / 9-Pin Male, THT 90° with assembly brackets and optional Jack Screw
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Micro D-Sub Single port Connector 15-Pin Male THT 90°
MSM-015-SS97-97/Nx
Micro D-Sub Single port Connector 15-Pin Male THT 90° with assembly brackets and optional Jack Screw
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Micro D-Sub Single port Connector 25-Pin Male THT 90°
MSM-025-SS97-97/Nx
Micro D-Sub Single port Connector 25-Pin Male THT 90° with assembly brackets and optional Jack Screw
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Micro D-Sub Single port Connector 9-Pin Male THT 90°
MSM-009-SS97-97/Nx
Micro D-Sub Single port Connector 9-Pin Male THT 90° with assembly brackets and optional Jack Screw
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Waterproof High Density D-Sub Solder Cup Vertical Female
SHF-xxx-SIP01-55/Tx
Waterproof High Density D-Sub Solder Cup for hand soldering, Vertical Female available in 15-, 26- and 44-contacts. Differnts Jack Screws options. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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Waterproof High Density D-Sub Solder Cup Vertical Male
SHM-xxx-SIP01-55/Tx
Waterproof High Density D-Sub Solder Cup for hand soldering, Vertical Male available in 15-, 26- and 44-contacts. Differnts Jack Screws options. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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Waterproof High Density D-Sub THT 90° Female w-o mounting bracket
SHF-xxx-FIP7-55/L1Txx
Waterproof High Density D-Sub THT 90° Right angle Female, available in 15-, 26- and 44-contacts without mounting brackets. Differnts Jack Screws options.
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Waterproof High Density D-Sub THT 90° Female with mounting bracket
SHF-xxx-FIP7-55/B1Txx
Waterproof High Density D-Sub THT 90° Right angle Female, available in 15-, 26- and 44-contacts with mounting brackets. Differnts Jack Screws options.
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Waterproof High Density D-Sub THT 90° Male w-o mounting bracket
SHM-xxx-FIP7-55/L1Txx
Waterproof High Density D-Sub THT 90° Right angle Male, available in 15-, 26- and 44-contacts without mounting brackets. Differnts Jack Screws options.
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Waterproof High Density D-Sub THT 90° Male with mounting bracket
SHM-xxx-FIP7-55/B1Txx
Waterproof High Density D-Sub THT 90° Right angle Male, available in 15-, 26- and 44-contacts with mounting brackets. Differnts Jack Screws options.
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Waterproof High Density D-Sub THT Vertical Female
SHF-xxx-SIP11-55/Tx
Waterproof High Density D-Sub THT Vertical Straight Female, available in 15-, 26- and 44-contacts. Differnts Jack Screws options.
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Waterproof High Density D-Sub THT Vertical Male
SHM-xxx-SIP11-55/Tx
Waterproof High Density D-Sub THT Vertical Straight Male, available in 15-, 26- and 44-contacts. Differnts Jack Screws options.
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Waterproof D-Sub Solder Cup Vertical Female
SDF-xxx-SIP01-55/Txx
Waterproof D-Sub Solder Cup for hand soldering, Vertical Female available in 9-, 15 and 25-contacts. Differnts Jack Screws options. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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Waterproof D-Sub Solder Cup Vertical Male
SDM-xxx-SIP01-55/Txx
Waterproof D-Sub Solder Cup for hand soldering, Vertical Male available in 9-, 15 and 25-contacts. Differnts Jack Screws options. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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Waterproof D-Sub THT 90° Female w-o mounting bracket
SDF-xxx-NIP7-55/L2Txx
Waterproof D-Sub THT 90° Right angle Female, available in 9-, 15 and 25-contacts without mounting brackets. Differnts Jack Screws options.
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Waterproof D-Sub THT 90° Female with mounting bracket
SDF-xxx-NIP7-55/B2Txx
Waterproof D-Sub THT 90° Right angle Female, available in 9-, 15 and 25-contacts with mounting brackets. Differnts Jack Screws options.
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Waterproof D-Sub THT 90° Male w-o mounting bracket
SDM-xxx-NIP7-55/L2Tx
Waterproof D-Sub THT 90° Right angle Male, available in 9-, 15 and 25-contacts without mounting brackets. Differnts Jack Screws options.
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Waterproof D-Sub THT 90° Male with mounting bracket
SDM-xxx-NIP7-55/B2Txx
Waterproof D-Sub THT 90° Right angle Male, available in 9-, 15 and 25-contacts with mounting brackets. Differnts Jack Screws options.
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Waterproof D-Sub THT Vertical Female w-o Board lock
SDF-xxx-SIP11-55/Txx
Waterproof D-Sub THT Vertical Straight Female, available in 9-, 15 and 25-contacts without Board lock. Differnts Jack Screws options.
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Waterproof D-Sub THT Vertical Female with Board lock
SDF-xxx-SIP11-55/BRTx
Waterproof D-Sub THT Vertical Straight Female, available in 9-, 15 and 25-contacts with Board lock. Differnts Jack Screws options.
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Waterproof D-Sub THT Vertical Male w-o Board lock
SDM-xxx-SIP11-55/Txx
Waterproof D-Sub THT Vertical Straight Male, available in 9-, 15 and 25-contacts without Board lock. Differnts Jack Screws options.
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Waterproof D-Sub THT Vertical Male with Board lock
SDM-xxx-SIP11-55/BRTxx
Waterproof D-Sub THT Vertical Straight Male, available in 9-, 15 and 25-contacts with Board lock. Differnts Jack Screws options.
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D-Sub IDC metal shell version, Female and Male
SKF-xxx-S201-95/xx | SKM-xxx-S201-95/xx
IDC D-Sub metal shell type are used to attach a flat-ribbon cable by yourself. Available in Female or Male version and with 9-, 15- 25- and 37-pin. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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D-Sub IDC plastic shell version, Female and Male
SKF-xxx-S202-95/xx | SKM-xxx-S202-95/xx
IDC D-Sub plastic shell type are used to attach a flat-ribbon cable by yourself. Available in Female or Male version and with 9-, 15- 25- and 37-pin. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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D-Sub Press-fit, Female version
SDF-xxx-P150-xx/P
Press-fit D-Sub Female version, available in 9-, 15- 25- and 37-pin. No soldering required, saving the cost of an additional wave soldering. Assembly by pressure on the connector into the board . For drill diameters for press-fit contacts requirements see technical data.
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D-Sub Press-fit, Male version
SDM-xxx-P150-xx/P
Press-fit D-Sub Male version, available in 9-, 15- 25- and 37-pin. No soldering required, saving the cost of an additional wave soldering. Assembly by pressure on the connector into the board . For drill diameters for press-fit contacts requirements see technical data.
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D-Sub Raised THT Vertical, Female
SDF-xxx-B111-95/xxx
Raised THT Straight soldertail Female D-Sub with a board spacing option of 11.00mm, 12.70mm, 13.50mm or 14.50mm up to the mounting collar (Only available with distance bolts assembly option). Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet.
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D-Sub Raised THT Vertical, Male
SDM-xxx-B111-95/xxx
Raised THT Straight soldertail Malle D-Sub with a board spacing option of 11.00mm, 12.70mm, 13.50mm or 14.50mm up to the mounting collar (Only available with distance bolts assembly option). Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet.
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D-Sub Solder Cup - Female
SDF-xxx-S101-95/Tx
D-Sub Solder Cup - Female, design for hand soldering of your cable by yourself. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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D-Sub Solder Cup - Male
SDM-xxx-S101-95/Tx
D-Sub Solder Cup - Male, design for hand soldering of your cable by yourself. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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D-Sub Closed body 15.00mm Long Style footprint, Female THT 90°
SDF-xxx-L900-55/xx
THT 90° Right angle Female D-Sub closed body 15.00mm Long Style footprint with 9-, 15- 25- and 37-pin. Available with "grounding board lock clip" or "grounding strap" and different mounting options as Jack screw or thread rivet.
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D-Sub Closed body 15.00mm Long Style footprint, Male THT 90°
SDM-xxx-L900-55/xx
THT 90° Right angle Male D-Sub closed body 15.00mm Long Style footprint with 9-, 15- 25- and 37-pin. Available with "grounding board lock clip" or "grounding strap" and different mounting options as Jack screw or thread rivet.
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D-Sub Closed body 8.08mm US Style footprint, Female THT 90°
SDF-xxx-N900-xx/xx
THT 90° Right angle Female D-Sub closed body 8.08mm US Style footprint with 9-, 15- 25- and 37-pin . Also according to PC99 specification. Available with flat or round "grounding board lock clip", or "grounding strap" with mounting hole. Different mounting options as mounting hole, thread rivet, etc...
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D-Sub Closed body 8.08mm US Style footprint, Male THT 90°
SDM-xxx-N900-xx/xx
THT 90° Right angle Male D-Sub closed body 8.08mm US Style footprint with 9-, 15- 25- and 37-pin. Also according to PC99 specification. Available with flat or round "grounding board lock clip", or "grounding strap" with mounting hole. Different mounting options as mounting hole, thread rivet, etc...
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D-Sub Closed body 9.40mm Euro Style footprint, Female THT 90°
SDF-xxx-M900-55/Nx
THT 90° Right angle Female D-Sub closed body 9.40mm Euro Style footprint with 9-, 15- 25- and 37-pin. Available with "grounding board lock clip" and different mounting options as Jack screw or thread rivet.
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D-Sub Closed body 9.40mm Euro Style footprint, Male THT 90°
SDM-xxx-M900-55/Nx
THT 90° Right angle Male D-Sub closed body 9.40mm Euro Style footprint with 9-, 15- 25- and 37-pin. Available with "grounding board lock clip" and different mounting options as Jack screw or thread rivet.
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D-Sub Open body 6.30mm, Female Precision contacts, THT 90° with Mounting brackets
SDF-xxx-N901-55/HxNx
THT 90° Right angle Female Precision Contacts, D-Sub open body 6.30mm center style with Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet.
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D-Sub Open body 6.30mm, Male Precision contacts, THT 90° with Mounting brackets
SDM-xxx-N901-55/HxNx
THT 90° Right angle Male Precision Contacts, D-Sub open body 6.30mm center style with Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet.
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D-Sub Open body 6.30mm, Male THT 90° with Mounting brackets
SDM-xxx-N900-95/HxNx
THT 90° Right angle Male D-Sub open body 6.30mm center style with Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet.
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D-Sub Open body 7.30mm, Female THT 90° with Mounting brackets
SDF-xxx-T970-55/HxNx
THT 90° Right angle Female, D-Sub open body 7.30mm center style with Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet.
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D-Sub Open body 7.30mm, Male THT 90° with Mounting brackets
SDM-xxx-T970-55/HxNx
THT 90° Right angle Male, D-Sub open body 7.30mm center style with Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole or thread rivet.
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D-Sub Open body Female Precision contact THT 90° without Mounting brackets
SDF-xxx-x901-55/xxxx
THT 90° Right angle Female , D-Sub open body without Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole, thread rivet, etc...
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D-Sub Open body Male Precision contact THT 90° without Mounting brackets
SDM-xxx-x901-55/xxxx
THT 90° Right angle Male, D-Sub open body without Mounting brackets. Available in 9-, 15- 25- and 37-pin. Different mounting options as mounting hole, thread rivet, etc...
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D-Sub THT Vertical, Female
SDF-xxx-S111-95/xxx
THT Straight soldertail Female D-Sub standard profile. Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub THT Vertical, Male
SDM-xxx-S111-95/xxx
THT Straight soldertail Male D-Sub standard profile. Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub High Density Raised THT Vertical, Female
SHF-xxx-B111-95/xxx
Raised THT Vertical High density Female D-Sub, Available in 15-, 26-, 44- and 62-pin with a board spacing option of 9.60mm, 11.00mm, 12.70mm or 13.50mm up to the mounting collar (Only available with distance bolts assembly option). Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub High Density Raised THT Vertical, Male
SHM-xxx-B111-95/xxx
Raised THT Vertical High density Male D-Sub, Available in 15-, 26-, 44- and 62-pin with a board spacing option of 9.60mm, 11.00mm, 12.70mm or 13.50mm up to the mounting collar (Only available with distance bolts assembly option). Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub High Density Solder cup Female
SHF-xxx-S101-95/xx
High density D-Sub Solder Cup - Female, design for hand soldering of your cable by yourself. Available in 15-, 26-, 44- and 62-pin. Different mounting options as mounting hole or thread rivet. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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D-Sub High Density Solder cup Male
SHM-xxx-S101-95/xx
High density D-Sub Solder Cup - Male, design for hand soldering of your cable by yourself. Available in 15-, 26-, 44- and 62-pin. Different mounting options as mounting hole or thread rivet. On request E-tec offer your the possiblity to provide you assembled terminated cables at your requirements.
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D-Sub High Density closed body THT 90°, Female
SHF-xxx-F900-xx/xx
THT 90° Right angle High density right angle Female D-Sub closed body style. Available in 15-, 26-, 44- and 62-pin. TESA type option available with blue colour insulator and contact nr. 9 recessed. Available with flat or round "grounding board lock clip", or "grounding strap" with mounting hole.
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D-Sub High Density closed body THT 90°, Male
SHM-xxx-F900-xx/xx
THT 90° Right angle High density right angle Male D-Sub closed body style. Available in 15-, 26-, 44- and 62-pin with flat or round "grounding board lock clip", or "grounding strap" with mounting hole.
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D-Sub High Density THT Vertical, Female
SHF-xxx-S111-95/xxx
THT Vertical High density Female D-Sub, Available in 15-, 26-, 44- and 62-pin with a board distance of 6.00mm up to the mounting collar. Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub High Density THT Vertical, Male
SHM-xxx-S111-95/xxx
THT Vertical High density Male D-Sub, Available in 15-, 26-, 44- and 62-pin with a board distance of 6.00mm up to the mounting collar. Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub High Density Raised THT Vertical, Female with Ferrite filter
SHF-xxx-B111-95/Fxxx
Raised THT Vertical High density Female D-Sub with Ferrite filter. Available in 15-, 26-, 44- and 62-pin with a board spacing option of 9.60mm, 11.00mm, 12.70mm or 13.50mm up to the mounting collar (Only available with distance bolts assembly option). Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub High Density Raised THT Vertical, Male with Ferrite filter
SHM-xxx-B111-95/Fxxx
Raised THT Vertical High density Male D-Sub with Ferrite filter. Available in 15-, 26-, 44- and 62-pin with a board spacing option of 9.60mm, 11.00mm, 12.70mm or 13.50mm up to the mounting collar (Only available with distance bolts assembly option). Different mounting options as Jack screws, Thread rivet , Grounding Bracket, etc.
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D-Sub Raised THT Vertical Female with Ferrite filter
SDF-xxx-B111-95/Fxxx
Raised THT Straight soldertail Female D-Sub with Ferrite filter with a board spacing of 12.70mm and 14.50mm up to the mounting collar (Available with and without spacing bolts). Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet , mounting hole, etc.
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D-Sub Raised THT Vertical Male with Ferrite filter
SDM-xxx-B111-95/Fxxx
Raised THT Straight soldertail Male D-Sub with Ferrite filter with a board spacing of 12.70mm and 14.50mm up to the mounting collar (Available with and without spacing bolts). Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet , mounting hole, etc.
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D-Sub Closed body 15.00mm Long Style footprint, Female THT 90° with Ferrite filter - OBSOLETE
SFF-xxx-L900-95/xx
THT 90° Right angle Female D-Sub closed body 15.00mm Long Style footprint with Ferrite filter and 9-, 15- 25- and 37-pin. Available with "grounding board lock clip" or "grounding strap" and different mounting options as Jack screw or thread rivet.
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D-Sub Closed body 15.00mm Long Style footprint, Male THT 90° with Ferrite filter - OBSOLETE
SFM-xxx-L900-55/xx
THT 90° Right angle Male D-Sub closed body 15.00mm Long Style footprint with Ferrite filter and 9-, 15- 25- and 37-pin. Available with "grounding board lock clip" or "grounding strap" and different mounting options as Jack screw or thread rivet.
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D-Sub Closed body 8.08mm US Style footprint, Female THT 90° with Ferrite filter
SFF-xxx-N900-95/xx
THT 90° Right angle Female D-Sub closed body 8.08mm US Style footprint with Ferrite filter. Available in 9-, 15- 25- and 37-pin . Also according to PC99 specification. Available with flat or round "grounding board lock clip", or "grounding strap" with mounting hole. Different mounting options as mounting hole, thread rivet, etc...
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D-Sub Closed body 8.08mm US Style footprint, Male THT 90° with Ferrite filter
SFM-xxx-N900-95/xx
THT 90° Right angle Male D-Sub closed body 8.08mm US Style footprint with Ferrite filter. Available in 9-, 15- 25- and 37-pin . Also according to PC99 specification. Available with flat or round "grounding board lock clip", or "grounding strap" with mounting hole. Different mounting options as mounting hole, thread rivet, etc...
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D-Sub THT Vertical Female with Ferrite filter
SDF-xxx-S111-95/Fxxx
THT Straight soldertail Female D-Sub with Ferrite filter with a board spacing of 6.30mm or 7.00mm (with distance bolts). Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet , mounting hol, etc.
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D-Sub THT Vertical Male with Ferrite filter
SDM-xxx-S111-95/Fxxx
THT Straight soldertail Male D-Sub with Ferrite filter with a board spacing of 6.30mm or 7.00mm (with distance bolts). Available in 9-, 15- 25- and 37-pin. Different mounting options as Jack screws, Thread rivet , mounting hol, etc.
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Elevated D-SUB THT 90° , 25-Pin Female
SDD-2500-2-95-FNx
Elevated D-Sub THT 90° Right angle, 25-pin Female. Designed for over-top other connectors on the board to offers a huge space saving.
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Elevated D-SUB THT 90° , 25-Pin Male
SDD-2500-2-95-MNx
Elevated D-Sub THT 90° Right angle, 25-pin Male. Designed for over-top other connectors on the board to offers a huge space saving.
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Elevated D-SUB THT 90° , 9-Pin Female
SDD-0900-2-95-FNx
Elevated D-Sub THT 90° Right angle, 9-pin Female. Designed for over-top other connectors on the board to offers a huge space saving.
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Elevated D-SUB THT 90° , 9-Pin Male
SDD-0900-2-95-MNx
Elevated D-Sub THT 90° Right angle, 9-pin Male. Designed for over-top other connectors on the board to offers a huge space saving.
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Elevated High Density D-SUB THT 90°,15-Pin Female
SDD-H1500-2-95-FNx
Elevated High Density D-Sub THT 90° Right angle, 15-pin Female. Designed for over-top other connectors on the board to offers a huge space saving.
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D-Sub Dual Port THT 90°, 15-pin Female | 15-pin Female
SDD-1515-x-xx-Fxxx
D-Sub Dual Port THT 90°, 15-pin female / 15-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 15-pin Female | 15-pin Male
SDD-1515-x-xx-FMxx
D-Sub Dual Port THT 90°, 15-pin female / 15-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 15-pin Male | 15-pin Female
SDD-1515-x-xx-MFxx
D-Sub Dual Port THT 90°, 15-pin male / 15-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 15-pin Male | 15-pin Male
SDD-1515-x-xx-Mxxx
D-Sub Dual Port THT 90°, 15-pin male / 15-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 15-pin Female | 25-pin Female
SDD-L1525-x-xx-Fxx
D-Sub Dual Port THT 90°, 15-pin female / 25-pin female. The 15-pin connector is on the top left. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Dual Port THT 90°, 25-pin Female | 15-pin Female
SDD-25L15-x-xx-Fxx
D-Sub Dual Port THT 90°, 25-pin female / 15-pin female. The 15-pin connector is on the bottom left. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Dual Port THT 90°, 25-pin Female | 25-pin Female
SDD-2525-x-xx-Fxxx
D-Sub Dual Port THT 90°, 25-pin female / 25-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Female | 25-pin Male
SDD-2525-x-xx-FMxx
D-Sub Dual Port THT 90°, 25-pin female / 25-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Male | 25-pin Female
SDD-2525-x-xx-MFxx
D-Sub Dual Port THT 90°, 25-pin male / 25-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Male | 25-pin Male
SDD-2525-x-xx-Mxxx
D-Sub Dual Port THT 90°, 25-pin male / 25-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Female | 9-pin Female
SDD-2509-x-xx-Fxx
D-Sub Dual Port THT 90°, 25-pin female / 9-pin female. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Female | 9-pin Male
SDD-2509-x-xx-FMxx
D-Sub Dual Port THT 90°, 25-pin female / 9-pin male. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Male | 9-pin Female
SDD-2509-x-xx-MFxx
D-Sub Dual Port THT 90°, 25-pin male / 9-pin female. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 25-pin Male | 9-pin Male
SDD-2509-x-xx-Mxx
D-Sub Dual Port THT 90°, 25-pin male / 9-pin male. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 37-pin Female | 37-pin Female
SDD-3737-x-xx-Fxxx
D-Sub Dual Port THT 90°, 37-pin female / 37-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 37-pin Female | 37-pin Male
SDD-3737-x-xx-FMxx
D-Sub Dual Port THT 90°, 37-pin female / 37-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 37-pin Male | 37-pin Female
SDD-3737-x-xx-MFxx
D-Sub Dual Port THT 90°, 37-pin male / 37-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 37-pin Male | 37-pin Male
SDD-3737-x-xx-Mxxx
D-Sub Dual Port THT 90°, 37-pin male / 37-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 9-pin Female | 25-pin Female
SDD-0925-x-xx-Fxx
D-Sub Dual Port THT 90°, 9-pin female / 25-pin female. With the distance of 15.87mm. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 9-pin Female | 9-pin Female
SDD-0909-x-xx-Fxxx
D-Sub Dual Port THT 90°, 9-pin female / 9-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 9-pin Female | 9-pin Male
SDD-0909-x-xx-FMxx
D-Sub Dual Port THT 90°, 9-pin female / 9-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 9-pin Male | 9-pin Female
SDD-0909-x-xx-MFxx
D-Sub Dual Port THT 90°, 9-pin male / 9-pin female. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Dual Port THT 90°, 9-pin Male | 9-pin Male
SDD-0909-x-xx-Mxxx
D-Sub Dual Port THT 90°, 9-pin male / 9-pin male. With the distances options of 15.87mm, 19.05mm and 22.86mm possible. Available with built-in ferrite filter. Different mounting options as mounting hole, Jack screws, etc. Special customized variants on request.
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D-Sub Mix Dual Port THT 90°, 15-pin HD Female | 15-pin HD Female
SDD-H15H15-4-xx-Fxx
D-Sub Mix Dual HD Port THT 90°, 15-pin High Density female / 15-pin High Density female. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 15-pin HD Female | 15-pin HD Male
SDD-H15H15-x-xx-FMxx
D-Sub Mix Dual HD Port THT 90°, 15-pin High Density female / 15-pin High Density male. With the distance of 15.88mm and 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 15-pin HD Female | 9-pin Female
SDD-H1509-6-xx-Fxx
D-Sub Mix Dual HD Port THT 90°, 15-pin High Density female / 9-pin female. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 15-pin HD Male | 9-pin Female
SDD-H1509-7-xx-MFxx
D-Sub Mix Dual HD Port THT 90°, 15-pin High Density male / 9-pin female. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 25-pin Female | 15-pin HD Female
SDD-25H15-4-xx-Fxx
D-Sub Mix Dual HD Port THT 90°, 25-pin female / 15-pin High Density female. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 26-pin HD Female | 26-pin HD Female
SDD-H26H26-x-xx-Fxx
D-Sub Mix Dual HD Port THT 90°, 26-pin High Density female / 26-pin High Density female. With the distance of 15.88mm and 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 26-pin HD Female | 26-pin HD Male
SDD-H26H26-x-xx-FMxx
D-Sub Mix Dual HD Port THT 90°, 26-pin High Density female / 26-pin High Density male. With the distance of 15.88mm and 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 44-pin HD Female | 44-pin HD Female
SDD-H44H44-x-xx-Fxx
D-Sub Mix Dual HD Port THT 90°, 44-pin High Density female / 44-pin High Density female. With the distance of 15.88mm and 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 9-pin Female | 15-pin HD Female
SDD-09H15-x-xx-Fxx
D-Sub Mix Dual HD Port THT 90°, 9-pin female / 15-pin High Density female. With the distance of 15.88mm and 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 9-pin Female | 15-pin HD Male
SDD-09H15-4-xx-FMxx
D-Sub Mix Dual HD Port THT 90°, 9-pin female / 15-pin High Density male. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Mix Dual Port THT 90°, 9-pin Male | 15-pin HD Female
SDD-09H15-x-xx-MFxx
D-Sub Mix Dual HD Port THT 90°, 9-pin male / 15-pin High Density female. With the distance of 15.88mm and 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Triple Port THT 90°, 25-pin Female | 9-pin Male | 15-pin HD Female
SDx-259H15-4-xx-FMFxx
D-Sub Triple Port THT 90°, 25-pin Female | 9-pin Male | 15-pin High Density Female. All versions also according to PC99 specification. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Triple Port THT 90°, 25-pin Female | 9-pin Male | 9-pin Male
SDx-2599-2-xx-FMMxx
D-Sub Triple Port THT 90°, 25-pin Female | 9-pin Male | 9-pin Male. All versions also according to PC99 specification. With the distance of 19.05mm. Different mounting options as mounting hole, Jack screws, etc.
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D-Sub Plastic or Metal Hoods
HSM-xxx-Sxxx-xxx | HSB-xxx-Sxxx-xxx | HSG-xxx-Sxxx-xxx | HSC-xxx-Sxxx-xxx
D-Sub Hoods made in:
Plastic colored or chromated or Metal zinc chromated or untreated. Available in:
9-pin Standard / 15-pin High Density
15-pin Standard / 26-pin High Density
25-pin Standard / 44-pin High Density
37-pin Standard / 62-pin High Density
50-pin Standard / 78-pin High Density
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D-Sub Jack Screws - Slide Lock and Locking post
JSR-xxx-Txxx-xx | SLO-xxx-T106-xx | JLP-xxx-T106-xx
D-Sub Mouting & Locking Accessories:
Jack Screws with different lenghts and head heights in metric or Inch thread.
Slide Locking kit and Locking post
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DVI Dual Port THT 90° Digital Type 24-pin
DVD-2424-NDD9-xx/xSx
DVI Connector Dual Port THT 90° Right Angle, Digital Type 24-pin fully shielded. Different Gold plating thickness and Jack Screws options.
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DVI Dual Port THT 90° Analog and Digital Type 24+5-pin
DVD-2929-NAD9-xx/xSx
DVI Connector Dual Port THT 90° Right Angle, Analog & Digital Type 24+5-pin fully shielded. Different Gold plating thickness and Jack Screws options.
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DVI THT 90° Analog and Digital Type 24+5-pin
DVF-029-NAD9-xx/xPx
DVI Connector THT 90° Right Angle, Analog & Digital Type 24+5-pin, with plastic locating pegs. Different Gold plating thickness and Jack Screws options.
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DVI THT 90° Digital Type 24-pin
DVF-024-NDD9-xx/xPx
DVI Connector THT 90° Right Angle, Digital Type 24-pin, with plastic locating pegs. Different Gold plating thickness and Jack Screws options.
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DVI THT Vertical Analog and Digital Type 24+5-pin
DVF-029-SAD1-xx/xBx
DVI Connector THT Vertical Straight, Analog & Digital Type 24+5-pin, with plastic locating pegs. Different Gold plating thickness and Jack Screws options.
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DVI THT Vertical Digital Type 24-pin
DVF-024-SDD1-xx/xBx
DVI Connector THT Vertical Straight, Digital Type 24-pin, with plastic locating pegs. Different Gold plating thickness and Jack Screws options.
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HDMI Socket Connector SMT Horizontal WITH mounting flange
HMR-B19-SSL1-xx/x
HDMI Socket Connector SMT Horizontal with straight grounding tabs and WITH mounting flange. Different Gold plating thickness and packaging options.
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HDMI Socket Connector SMT Horizontal WITHOUT mounting flange
HMR-B19-SSK1-xx/x
HDMI Socket Connector SMT Horizontal with straight grounding tabs and WITHOUT mounting flange. Different Gold plating thickness and packaging options.
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IEEE 1394 Mini version connector, 4 contact type
IES-B04-xI01-98
IEEE 1394 Mini version connector, 4 contact type. Available in right angle SMT / THT and reversed type
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IEEE 1394 Standard version connector, 6 contact type
IES-x06-xIF1-98
IEEE 1394 Standard version connector, 6 contact type. Available in right angle SMT / THT and Horizontal or Vertical application. Shielded.
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USB 1.x-2.0 Plug Type Mini-B SMT 90°
UMP-B05-SCB1x-xx/x
USB 1.x/2.0 Plug Type Mini-B SMT 90°
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USB 1.x-2.0 Plug Type A SMT 90°
USP-B04-SAxx-9x
USB 1.x/2.0 Plug Type A SMT 90°.
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USB 1.x-2.0 Connector Type Mini-B Single port Top entry, THT
UMS-B05-TBx1-9x
USB 1.x/2.0 Connector Type Mini-B Single port Top entry, THT. 5-pin
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USB 2.0 Connector Type Mini-B Single port Side entry, SMT 90°
UMS-B05-SBx1-98
USB 2.0 Connector Type Mini-B Single port Side entry, SMT 90° right angle. 5-pin.
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USB 1.x-2.0 Combi Multi por 2xUSB - 1xRJ45, THT 90°
MJS-3U88-S0L0-96/ExCS
USB 1.x/2.0 Combi Multi por 2xUSB / 1xRJ45, THT 90°. Fully Shielded with 2 Leds and without Filter.
Other Models and version "Please go to Modular Jack Product Family"
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USB 1.x-2.0 Connector Type A Dual port THT 90°
USS-W08-RAx2-9x
USB 1.x/2.0 Connector Type A Dual port THT 90° right angle, side entry. Shielded.
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USB 1.x-2.0 Connector Type A Dual port Low profile, THT 90°
ULS-W08-RAx2-9x
USB 1.x/2.0 Connector Type A Dual port "Low profile" THT 90° right angle, side entry. Shielded.
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USB 1.x-2.0 Connector Type A Dual port top entry THT Vertical
USS-W08-TAx2-9x
USB 1.x/2.0 Connector Type A Dual port THT Vertical straight, Top entry. Shielded.
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USB 1.x-2.0 Connector Type A Quad port THT 90°
USS-B16-RAx4-9x
USB 1.x/2.0 Connector Type A Quad port THT 90° right angle, side entry. Shielded.
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USB 1.x-2.0 Connector Type A Triple port THT 90°
USS-B12-RAx3-9x
USB 1.x/2.0 Connector Type A Triple port THT 90° right angle, side entry. Shielded.
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USB 1.x-2.0 Connector Type A Single port Low profile THT 90°
ULS-W04-RASx-9x
USB 1.x/2.0 Connector Type A Single port "Low Profile" THT 90° right angle.
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USB 1.x-2.0 Connector Type A Single port THT 90°
USS-W04-RAx1-9x
USB 1.x/2.0 Connector Type A Single port THT 90° right angle. Shielded.
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USB 1.x-2.0 Connector Type A Single port Embedded SMT 90°
ULS-W04-SASx-9x
USB 1.x/2.0 Connector Type A Single port Embedded SMT 90° right angle.
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USB 1.x-2.0 Connector Type A Single port SMT 90°
USS-W04-SASx-9x
USB 1.x/2.0 Connector Type A Single port SMT 90° right angle.
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USB 1.x-2.0 Connector Type A Single port Top entry, THT Vertical
USS-W04-TAx1-9x
USB 1.x/2.0 Connector Type A Single port Top entry, THT Vertical Straight. Shielded.
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USB 1.x-2.0 Connector Type A Single port Upright THT 90°
USS-W04-VAx1-9x
USB 1.x/2.0 Connector Type A Single port Upright THR 90° right angle.
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USB 1.x-2.0 Connector Type B Single port Low profile THT 90°
USS-W04-RBSx-9x
USB 1.x/2.0 Connector Type B Single port "Low Profile" THT 90° right angle. Shielded.
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USB 1.x-2.0 Connector Type B Single port THT 90°
USS-W04-RBx1-9x
USB 1.x/2.0 Connector Type B Single port THT 90° right angle. Shielded.
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USB 1.x-2.0 Connector Type B Single port SMT 90°
USS-W04-SBSx-9x
USB 1.x/2.0 Connector Type B Single port SMT 90° right angle. Semi-Shielded.
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USB 1.x-2.0 Connector Type B Single port Top entry, SMT Vertical
USS-W04-UBx1-9x
USB 1.x/2.0 Connector Type B Single port Top entry, SMT Vertical Straight. Shielded.
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USB 1.x-2.0 Connector Type B Single port Top entry, THT Vertical
USS-W04-TBx1-9x
USB 1.x/2.0 Connector Type B Single port Top entry, THT Vertical Straight. Shielded.
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USB 1.x-2.0 and IEEE Cable
USC-xxxx-xxxxx-xx/G
USB 1.x/2.0 and IEEE Cable in many different plug combinations and leghts. We can manufacture cables according to your specifications, please send your request.
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Micro USB 2.0 Connector Type A + B Single port, SMT 90°
UNS-B05-SK0AB21-58/R
Micro USB 2.0 Connector Type A & B in one housing Single port, SMT 90° right angle. 5-pin with Wing ground tabs and without locating pegs. Shielded.
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Micro USB 2.0 Connector Type A + B Single port, SMT 90° Locating pegs
UNS-B05-SKAB21-58/R
Micro USB 2.0 Connector Type A & B in one housing Single port, SMT 90° right angle. 5-pin with Wing ground tabs and half round locating pegs. Shielded.
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Micro USB 2.0 Connector Type B Single port, SMT 90°
UNS-B05-SKB2L-58/R
Micro USB 2.0 Connector Type B Single port, SMT 90° right angle. 5-pin with straight ground tabs and without locating pegs. Shielded.
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Micro USB 2.0 Connector Type B Single port, SMT 90° Locating pegs
UNS-B05-SKB2P-58/R
Micro USB 2.0 Connector Type B Single port, SMT 90° right angle. 5-pin with straight ground tabs and locating pegs. Shielded.
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Micro USB 2.0 Connector Type B Single port, SMT 90° Wing Sytle
UNS-B05-SKB21-58/R
Micro USB 2.0 Connector Type B Single port, SMT 90° right angle. 5-pin with wing style ground tabs and locating pegs. Shielded.
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Waterproof Micro USB 2.0 Connector Type B Single port, SMT 90°
UNS-B05-SKB21-58/R
Waterproof IP 67 Micro USB 2.0 Connector Type B Single port, SMT 90° right angle. 5-pin. Shielded.
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USB 3.0 Cable, Plug Type-A to Plug Type-A
USC-xxxx-3AM3AM-A/BU
USB 3.0 Cable, USB 3.0 Plug Type-A to USB 3.0 Plug Type-A. Different lenghts available. Customer specifics cables also possible on request.
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USB 3.0 Cable, Plug Type-A to Socket Type-A
USC-xxxx-3AM3AF-A/BU
USB 3.0 Cable, USB 3.0 Plug Type-A to USB 3.0 Socket Type-A. Different lenghts available. Customer specifics cables also possible on request.
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USB 3.0 Cable, Plug Type-A to Socket Type-B
USC-xxxx-3AM3BM-A/BU
USB 3.0 Cable, USB 3.0 Plug Type-A to USB 3.0 Socket Type-B. Different lenghts available. Customer specifics cables also possible on request.
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USB 3.0 Connector Type A Single port THR 90°, Straight gnd Tabs
USS-BU09-RRAS31-98
USB 3.0 Connector Type A Single port THR 90° right angle with Straight ground Tabs. This USB 3.0 connectors are designed for a high data transfer rate of up to 4.8 Gbps, 10 times faster than USB 2.0. They allow simultaneous "download" and "upload" data transfer, simultaneous and fast charging of multiple devices at high power.
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USB 3.0 Connector Type A Single port THT 90°, Kinked gnd Tabs
USS-BU09-RA31-98
USB 3.0 Connector Type A Single port THT 90° right angle with Kinked ground Tabs. This USB 3.0 connectors are designed for a high data transfer rate of up to 4.8 Gbps, 10 times faster than USB 2.0. They allow simultaneous "download" and "upload" data transfer, simultaneous and fast charging of multiple devices at high power.
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USB 3.0 Connector Type A Single port SMT 90°
USS-BU09-SAS31-98
USB 3.0 Connector Type A Single port SMT 90° right angle. This USB 3.0 connectors are designed for a high data transfer rate of up to 4.8 Gbps, 10 times faster than USB 2.0. They allow simultaneous "download" and "upload" data transfer, simultaneous and fast charging of multiple devices at high power.
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USB 3.0 Connector Type A Single port SMT 90° Embedded
ULS-BU09-SAS31-98
USB 3.0 Connector Type A Single port SMT 90° right angle Embedded Type. The special design will help you to save space on the board. This USB 3.0 connectors are designed for a high data transfer rate of up to 4.8 Gbps, 10 times faster than USB 2.0. They allow simultaneous "download" and "upload" data transfer, simultaneous and fast charging of multiple devices at high power.
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USB 3.0 Connector Type A Single port Top entry, THT Vertical
USS-BU09-TA31-98
USB 3.0 Connector Type A Single port Top Entry THR Vertical. This USB 3.0 connectors are designed for a high data transfer rate of up to 4.8 Gbps, 10 times faster than USB 2.0. They allow simultaneous "download" and "upload" data transfer, simultaneous and fast charging of multiple devices at high power.
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USB 3.0 Connector Type A Single port Upright THT 90°
USS-BU09-VA31-98
USB 3.0 Connector Type A Single port Upright THR 90° right angle. This USB 3.0 connectors are designed for a high data transfer rate of up to 4.8 Gbps, 10 times faster than USB 2.0. They allow simultaneous "download" and "upload" data transfer, simultaneous and fast charging of multiple devices at high power.
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USB 3.1 Cable, Plug Type-C to Plug Type-A
USC-xxxx-31CM31AMBU-00/B
USB 3.1 Cable, USB 3.1 Plug Type-C to USB 3.1 Plug Type-A. Different lenghts available. Customer specifics cables also possible on request.
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USB 3.1 Cable, Plug Type-C to Plug Type-C
USC-xxxx-31CM31CM-00/B
USB 3.1 Cable, USB 3.1 Plug Type-C to USB 3.1 Plug Type-C. Different lenghts available. Customer specifics cables also possible on request.
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USB 3.1 Connector Type C Single port 90° SMT Embedded Type
UNS-B24/M-SC1C130-98/R
USB 3.1 Connector Type C Single port 90° right angle SMT Embedded Type. The special design will help you to save space on the board. The USB 3.1 connectors from E-tec meet the USB 3.1 Type-C requirements at 10 GBit/s and are smaller, thinner and have a lighter design.
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USB 3.1 Connector Type C Single port 90° SMT-THR Hybrid Type
UNS-B24-SRCC130-58/R
USB 3.1 Connector Type C Single port 90° right angle SMT/THR Hybrid Type. The USB 3.1 connectors from E-tec meet the USB 3.1 Type-C requirements at 10 GBit/s and are smaller, thinner and have a lighter design. Gold / Gold Plating
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USB 3.1 Connector Type C Single port 90° SMT-THR Hybrid Type, Tin - Gold Plating
UNS-B24-SRC1C130-98/R
USB 3.1 Connector Type C Single port 90° right angle SMT/THR Hybrid Type. The USB 3.1 connectors from E-tec meet the USB 3.1 Type-C requirements at 10 GBit/s and are smaller, thinner and have a lighter design. Tin / Gold Plating
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USB 3.1 Connector Type C Single port Vertical SMT
UNS-B24/2-UC2C130-98/B
USB 3.1 Connector Type C Single port Vertical SMT Type. The USB 3.1 connectors from E-tec meet the USB 3.1 Type-C requirements at 10 GBit/s and are smaller, thinner and have a lighter design.
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Dual Mixed SCSI Connector D-Sub and SCSI Female THT 90°
CSD-D25xx-6-95-FNx-x
SCSI Connector Dual port Mixed D-Sub & SCSI, THT 90°. Female 25-pin D-Sub with either 50-pin or 68-pin SCSI female at a distance of 20.95mm to each other. Options as latch lock and different threads.
The E-tec SCSI coonnectors are with double-shield metal covers and over-molded covers to provide full protection from EMI and ESD.
SCSI MIni Delta Ribbon connectors are available on request.
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Dual SCSI Connector port Female THT 90°
CSD-xxxx-6-95-FVx-x
SCSI Connector Dual port THT 90° right angle, Female with 50-pin / 50-pin or 68-pin / 68-pin. Spacing between 12.70mm and 14.00mm possible. Also with built-in ferrite filter. Options as latch lock and different threads.
The E-tec SCSI coonnectors are with double-shield metal covers and over-molded covers to provide full protection from EMI and ESD.
SCSI MIni Delta Ribbon connectors are available on request.
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Single SCSI Connector port Female THT 90°
CSF-xxx-Nxxx-95/xx
SCSI Connector Single port THT 90° right angle, Female with 50- or 68-pin. Available in Standard profile or Low profile. Options as latch lock and different threads.
The E-tec SCSI coonnectors are with double-shield metal covers and over-molded covers to provide full protection from EMI and ESD.
SCSI MIni Delta Ribbon connectors are available on request.
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Centronics Connector Female and Male Solder cup
CCx-xxx-S101-55
Centronics Connector Solder Cup for hand soldering of your round cables. The female connector has 14-, 24-, 36-, and 50-contacts and Spring latch system. The male connector has 14-, 24-, 36-, and 50-contacts and bail lock system.
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Centronics Connector Female THT 90° right angle
CCF-xxx-S90x-95/nx
Centronics Connector THT 90° right angle, Female 36- and 50-contacts. Closed body available with Spring latch or Screw lock system.
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Centronics Connector Female and Male IDC Cutting clamp
CCx-xxx-S201-95/xx
Centronics Connector Cutting clamp for attaching yours flat ribbon cables by yourself. The female connector has 36- and 50-contacts and Spring latch system. The male connector has also 36-, and 50-contacts and bail lock system.
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Mini-DIN Dual port THT 90°
MDJ-606-xxxx-95
Mini-DIN Dual port THT 90°, 2x 6-pole over top of each other. Available PC99 type and color code.
Mini DIN Connectors offered by E-tec have either silver or tin plated contacts. They allow a high number of insertion/extraction cycles and always a save connection to the Plug.
For any other types you may looking for and cannot find specified in this catalog, for example Mini DIN connectors with Filter or switch, please contact the nearest E-tec office or Distributor.
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Mini-DIN Low Profile SMT and THT 90° Shielded
MDJ-xxx-RKLx/x-95
Mini-DIN Low Profile SMT & THT 90° Shielded. Only 8.60 depth compared to 13.60mm of the standard type. Available in 4- and 6-pole.
Mini DIN Connectors offered by E-tec have either silver or tin plated contacts. They allow a high number of insertion/extraction cycles and always a save connection to the Plug.
For any other types you may looking for and cannot find specified in this catalog, for example Mini DIN connectors with Filter or switch, please contact the nearest E-tec office or Distributor.
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Mini-DIN plugs connectors
MDP-xxx-MA01-xxx | MDP-xxx-FA01-xxx | MDP-xxx-MQ01-xx
Mini DIN plugs connectors for self-assembly, available with 3- to 9-contacts. Male, Female or Quick Lock versions.
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Mini-DIN THT 90° Shielded
MDJ-xxx-Rxxx-xx
Mini-DIN THT 90° Side shielded or Fully shielded option. Available in 3- to 9-pin.
Mini DIN Connectors offered by E-tec have either silver or tin plated contacts. They allow a high number of insertion/extraction cycles and always a save connection to the Plug.
For any other types you may looking for and cannot find specified in this catalog, for example Mini DIN connectors with Filter or switch, please contact the nearest E-tec office or Distributor.
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Mini-DIN THT 90° Unshielded
MDJ-xxx-RN01-95
Mini-DIN THT 90° unshielded available in 3- to 9-pin.
Mini DIN Connectors offered by E-tec have either silver or tin plated contacts. They allow a high number of insertion/extraction cycles and always a save connection to the Plug.
For any other types you may looking for and cannot find specified in this catalog, for example Mini DIN connectors with Filter or switch, please contact the nearest E-tec office or Distributor.
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Mini-DIN Straight Mounting THT Version
MDJ-xxx-SN01-AGZ
Mini-DIN Straight Mounting connector THT Version. Available in 3-, 4-, 5-, 6- and 8 contacts.
Mini DIN Connectors offered by E-tec have either silver or tin plated contacts. They allow a high number of insertion/extraction cycles and always a save connection to the Plug.
For any other types you may looking for and cannot find specified in this catalog, for example Mini DIN connectors with Filter or switch, please contact the nearest E-tec office or Distributor.
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Mini-DIN Wall Mounting THT Version
MDJ-xxx-SS01-99
Mini-DIN Wall Mounting THT Version connector supplied with the corresponding nut set. Available in 3-, 4-, 5-, 6- and 8 contacts.
Mini DIN Connectors offered by E-tec have either silver or tin plated contacts. They allow a high number of insertion/extraction cycles and always a save connection to the Plug.
For any other types you may looking for and cannot find specified in this catalog, for example Mini DIN connectors with Filter or switch, please contact the nearest E-tec office or Distributor.
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Modular Jack Single port, RJ45 Type 8P8C, THT, 45° Entry, Unshielded, w-o LED, w-o Filter
MJR-188-S1S0-9x/W
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack 45° Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Bottom Entry, Unshielded, w-o LED, w-o Filter
MJB-166-S1S0-9x/S
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Bottom Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Side Entry, Semi-shielded, w-o LED, w-o Filter
MJS-166-S3S0-5x/7SS
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Side Entry Semi-shielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Side Entry, Shielded, w-o LED, w-o Filter
MJS-166-S1S0-9x/9CS
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Side Entry Shielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-166-x1Sx-xx
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Side Entry, Unshielded, w-o LED, w-o Filter Off Center type
MJS-166-SA4S-xx
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Side Entry Unshielded, without LED and without Filter, "Off Center Type". Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Top Entry, Shielded, w-o LED, w-o Filter
MJT-166-SxSx-xx/xCS
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Top Entry Shielded, without LED and without Filter. Different Gold plating options on the contact area. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, THT, Top Entry, Unshielded, w-o LED, w-o Filter
MJT-166-SxSx-xx
Modular Jack Single port RJ12 Type 6P6C, THT PCB Jack Top Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ14 Type 6P4C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-164-xxxx-9x
Modular Jack Single port RJ14 Type 6P4C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, 45° Entry, Shielded, w-o LED, w-o Filter
MJR-188-S1H0-9x/SS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack 45° Entry, Shielded, without LED and without Filter. Different Gold plating options on the contact area. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Bottom Entry, Unshielded, w-o LED, w-o Filter
MJB-188-S1S0-9x/S
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Bottom Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 10P8C PoE, THT, Side Entry Tab up, Shielded, with LED, with Filter 10-100 Mbps, with gnd. latches
MJS-108-MPGLAC-98/74CA
Modular Jack Single port RJ45 Type 10P8C PoE, THT PCB Jack Side Side Entry "Tab up", Shielded, with LED, with Filter 10/100 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 16P8C PoE, THT, Side Entry Tab up, Shielded, with LED, with Filter 10-100-1000 Mbps, with gnd. latches
MJS-168-MGGLZ-96/SNCS
Modular Jack Single port RJ45 Type 16P8C PoE, THT PCB Jack Side Side Entry "Tab up", Shielded, with LED, with Filter 10/100/1000 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P10C, THT, Side Entry Tab up, Shielded, with LED, with Filter 10-100-1000 Mbps, w-o gnd. latches
MJS-180-M3LD0-5xCS
Modular Jack Single port RJ45 Type 8P10C, THT PCB Jack Side Side Entry "Tab up", Shielded, with LED, with Filter 10/100/1000 Mbps, w/o gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P12C, THT, Side Entry , Shielded, with LED, with Filter 10GBit), with gnd. latches
MJS-112-FT0LG-9xZxCB
Modular Jack Single port RJ45 Type 8P12C Embedded design, THT PCB Jack Side Side Entry, Shielded, with LED, with Filter 10 GBit, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P12C, THT, Side Entry Tab down, Shielded, with LED, with Filter 10-100-1000 Mbps, w-o gnd. latches
MJS-1812-KCLLL-98/HCS
Modular Jack Single port RJ45 Type 8P12C, THT PCB Jack Side Side Entry "Tab down", Shielded, with LED, with Filter 10/100 Mbps, w/o gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P12C, THT, Side Entry Tab down, Shielded, with LED, with Filter 10-100-1000 Mbps, with gnd. latches
MJS-1812-MGKLAH-9x/S4CA
Modular Jack Single port RJ45 Type 8P12C, THT PCB Jack Side Side Entry "Tab down", Shielded, with LED, with Filter 10/100 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P6C, THT, Side Entry Tab up, Shielded, with LED, with Filter 10-100 Mbps, with gnd. latches
MJS-186-MCL4-9x/SxCA
Modular Jack Single port RJ45 Type 8P6C, THT PCB Jack Side Side Entry "Tab up", Shielded, with LED, with Filter 10/100 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry Tab down, Shielded, with LED, with Filter 10-100 Mbps, w-o gnd. latches
MJS-188-xxLx-9x/7xCS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Side Entry "Tab down", Shielded, with LED, with Filter 10/100 Mbps, w/o gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry Tab down, Shielded, with LED, with Filter 10-100 Mbps, with gnd. latches
MJS-188-xxLx-9x/7xCx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Side Entry "Tab down", Shielded, with LED, with Filter 10/100 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry Tab down, Shielded, with LED, with Filter 10-100-1000 Mbps, with gnd. latches
MJS-188-MxLxx-xx/7xxx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Side Entry "Tab down", Shielded, with LED, with Filter 10/100 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry Tab up, Shielded, with LED, with Filter 10-100 Mbps, w-o gnd. latches
MJS-188-MxL2x-5x/7xCS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Side Entry "Tab up", Shielded, with LED, with Filter 10/100 Mbps, w/o gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry Tab up, Shielded, with LED, with Filter 10-100 Mbps, with gnd. latches
MJS-188-Mxxxx-9x/xxxx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Side Entry "Tab up", Shielded, with LED, with Filter 10/100 Mbps, with gnd. latches. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry, Shielded, with LED, w-o Filter
MJS-188-xxxxx-xx/xCx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Entry Shielded, with LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry, Unshielded, with LED, w-o Filter
MJS-188-Lxxxx-xx/x
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Entry Unshielded, with LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry, Semi-shielded, w-o LED, w-o Filter
MJS-188-D3M30-5x/0ES
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Entry Semi-shielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry, Shielded, w-o LED, w-o Filter
MJS-188-xxxxx-9x/xCS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Entry Shielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry, Shielded, w-o LED, with Filter 10-100 Mbps
MJS-188-Nxxxx-9x/xCx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Entry Shielded, without LED and with Filter 10/100 Mbps. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-188-xxxxx-xx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Top Entry, Shielded, with LED, w-o Filter
MJT-188-LxSx-9x/1CS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Top Entry Shielded, with LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Top Entry, Shielded, with LED, with Filter 10-100 Mbps
MJT-188-MxSxx-9x/KxCS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Top Entry Shielded, with LED and with Filter 10/100 MPS. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Top Entry, Shielded, w-o LED, w-o Filter
MJT-188-SxSx-xx/xCS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Top Entry Shielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Top Entry, Shielded, w-o LED, with Filter 10-100 Mbps
MJT-188-xxSxx-xx/KCS
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Top Entry Shielded, without LED and with Filter 10/100 MPS. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, THT, Top Entry, Unshielded, w-o LED, w-o Filter
MJT-188-SxSx-xx
Modular Jack Single port RJ45 Type 8P8C, THT PCB Jack Top Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P10C, THT, Side Entry, Shielded, with LED, w-o Filter
MJS-100-S1L0-9x/7CS
Modular Jack Single port RJ50 Type 10P10C, THT PCB Jack Side Entry Shielded, with LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P8C, THT, Side Entry, Semi-shielded, with LED, w-o Filter
MJS-108-x1Mx-9x/xES
Modular Jack Single port RJ50 Type 10P8C, THT PCB Jack Side Entry Semi-shielded, with LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P8C, THT, Side Entry, Unshielded, with LED, w-o Filter
MJS-108-L1S0-9x/x
Modular Jack Single port RJ50 Type 10P8C, THT PCB Jack Side Entry Unshielded, with LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P8C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-108-x0x0-9x
Modular Jack Single port RJ50 Type 10P8C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P8C, THT, Top Entry, Shielded, with LED, with Filter 10-100-1000 Mbps
MJT-108-MxSxx-9x/KxCS
Modular Jack Single port RJ50 Type 10P8C, THT PCB Jack Top Entry Shielded, with LED and with Filter 10/100/1000 MPS. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ9 Type 4P4C, THT, Bottom Entry, Unshielded, w-o LED, w-o Filter
MJB-144-S1S0-9x/S
Modular Jack Single port RJ9 Type 4P4C, THT PCB Jack Bottom Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ9 Type 4P4C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-144-Sxxx-9x/x
Modular Jack Single port RJ9 Type 4P4C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ9 Type 4P4C, THT, Top Entry, Unshielded, w-o LED, w-o Filter
MJT-144-SxSx-9x
Modular Jack Single port RJ9 Type 4P4C, THT PCB Jack Top Entry Unshielded, without LED and without Filter. Different Gold plating options on the contact area. Available in Standard and Low profile. Panel stop option. E-tec offer you many different models and other options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, SMT, Side Entry, Unshielded, w-o LED
MJS-166-xxxx-xx
Modular Jack Single port RJ12 Type 6P6C, SMT PCB Jack Side Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ12 Type 6P6C, SMT, Top Entry, Unshielded, w-o LED
MJT-166-xxSx-xx/x
Modular Jack Single port RJ12 Type 6P6C, SMT PCB Jack Top Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ14 Type 6P4C, SMT, Side Entry, Unshielded, w-o LED
MJS-164-xxxx-9x
Modular Jack Single port RJ14 Type 6P4C, SMT PCB Jack Side Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ14 Type 6P4C, SMT, Top Entry, Unshielded, w-o LED
MJT-164-TxS0-xx/R
Modular Jack Single port RJ14 Type 6P4C, SMT PCB Jack Top Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, SMT, Side Entry, Shielded, with LED
MJS-188-WL3Sx-xx/xCx
Modular Jack Single port RJ45 Type 8P8C, SMT PCB Jack Side Entry Shielded, with LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, SMT, Side Entry, Unshielded, with LED
MJS-188-TL3S0-55/xR
Modular Jack Single port RJ45 Type 8P8C, SMT PCB Jack Side Entry Unshielded, with LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, SMT, Side Entry, Shielded, w-o LED
MJS-188-xxxx-9x/xCS
Modular Jack Single port RJ45 Type 8P8C, SMT PCB Jack Side Entry Shielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, SMT, Side Entry, Unshielded, w-o LED
MJS-188-xxxxx-xx/xx
Modular Jack Single port RJ45 Type 8P8C, SMT PCB Jack Side Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, SMT, Top Entry, Shielded, w-o LED
MJT-188-T4S0-9x/CS
Modular Jack Single port RJ45 Type 8P8C, SMT PCB Jack Top Entry Shielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ45 Type 8P8C, SMT, Top Entry, Unshielded, w-o LED
MJT-188-TxSx-xx/R
Modular Jack Single port RJ45 Type 8P8C, SMT PCB Jack Top Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P10C, SMT, Side Entry, Unshielded, w-o LED
MJS-100-WD3S1-5x/R
Modular Jack Single port RJ50 Type 10P10C, SMT PCB Jack Side Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ50 Type 10P8C, SMT, Side Entry, Unshielded, w-o LED
MJS-108-WD3S1-5x/R
Modular Jack Single port RJ50 Type 10P8C, SMT PCB Jack Side Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ9 Type 4P4C, SMT, Side Entry, Unshielded, w-o LED
MJS-144-Sxxx-xx/x
Modular Jack Single port RJ9 Type 4P4C, SMT PCB Jack Side Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Single port, RJ9 Type 4P4C, SMT, Top Entry, Unshielded, w-o LED
MJT-144-T1S0-9x/R
Modular Jack Single port RJ9 Type 4P4C, SMT PCB Jack Top Entry Unshielded, without LED. Different Gold plating options on the contact area. E-tec offer you many different models and many different options, please check the Technical Datas here down.
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Modular Jack Multi port, RJ11 Type 6P2C, THT, Side Entry, Unshielded, w-o LED
MJS-x62-S3S0-5x
Modular Jack Multi port Side by side RJ11 Type 6P2C, THT PCB Jack Side Entry "Tap up" Unshielded, without LED. Available 3, 4, 6 and 8 ports, without panel stop. Different Gold plating options on the contact area.
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Modular Jack Multi port, RJ12 Type 6P6C, THT, Side Entry, Unshielded, w-o LED
MJS-x66-xxxxx-xx
Modular Jack Multi port Side by side RJ12 Type 6P6C, THT PCB Jack Side Entry "Tap up or Tap down" Unshielded, without LED. Available 4, 6 and 8 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ14 Type 6P4C, THT, Side Entry, Unshielded, w-o LED
MJS-x64-Sxxx-5x
Modular Jack Multi port Side by side RJ14 Type 6P4C, THT PCB Jack Side Entry "Tap up or Tap down" Unshielded, without LED. Available 3, 4, 6 and 8 ports. Different Gold plating options on the contact area. For other option please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, with LED
MJS-x88-xxxx-xx/xxx
Modular Jack Multi port Side by side RJ45 Type 8P8C, THT PCB Jack Side Entry "Tap down or Tap up" Shielded, with LED. Available in 2, 4 and 8 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, with LED with Filter 10-100 Mbps
MJS-288-KxLE-9x/xxCA
Modular Jack Multi port Side by side RJ45 Type 8P8C, THT PCB Jack Side Entry "Tab Down" Shielded, with LED with Filter 10/100 Mbps. Available in 2 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Unshielded, with LED
MJS-488-LLxL0-xx/xx
Modular Jack Multi port Side by side RJ45 Type 8P8C, THT PCB Jack Side Entry "Tap down" Unshielded, with LED. Available in 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, w-o LED
MJS-x88-xxx0-xx/xxx
Modular Jack Multi port Side by side RJ45 Type 8P8C, THT PCB Jack Side Entry "Tap down or Tap up" Shielded, without LED. Available in 2, 4 and 5 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, w-o LED, with Filter 10-100 Mbps
MJS-x88-xxx0-xx/xxx
Modular Jack Multi port Side by side RJ45 Type 8P8C, THT PCB Jack Side Entry Shielded, without LED with Filter 10/100 Mbps. Available in 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Unshielded, w-o LED
MJS-288-D1L0-9x
Modular Jack Multi port Side by side RJ45 Type 8P8C, THT PCB Jack Side Entry "Tap down" Unshielded, without LED. Available in 2 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P8C, THT, Side Entry, Shielded, with LED
MJS-408-L1S0-9x/4xCB
Modular Jack Multi port Side by side RJ50 Type 10P8C, THT PCB Jack Side Entry "Tap up" Shielded, with LED. Available in 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P8C, THT, Side Entry, Shielded, with LED with Filter 10-100-1000 Mbps
MJS-x08-KxLF-9x/xxCA
Modular Jack Multi port Side by side RJ50 Type 10P8C, THT PCB Jack Side Entry "Tab Down" Shielded, with LED with Filter 10/100/1000 Mbps. Available in 2 and 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P8C, THT, Side Entry, Unshielded, with LED
MJS-x08-L1S0-9x/x
Modular Jack Multi port Side by side RJ50 Type 10P8C, THT PCB Jack Side Entry "Tap up" Unshielded, with LED. Available in 2 and 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P10C, THT, Side Entry, Shielded, w-o LED
MJS-400-D0S0-xx
Modular Jack Multi port Side by side RJ50 Type 10P10C, THT PCB Jack Side Entry "Tap down" NON Shielded, without LED. Available in 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P10C, THT, Side Entry, Unshielded, w-o LED
MJS-200-D0S0-5x
Modular Jack Multi port Side by side RJ50 Type 10P10C, THT PCB Jack Side Entry "Tap down" Unshielded, without LED. Available in 2 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P8C, THT, Side Entry, Shielded, w-o LED
MJS-408-D0L0-9x/1CS
Modular Jack Multi port Side by side RJ50 Type 10P8C, THT PCB Jack Side Entry "Tap down" Shielded, without LED. Available in 4 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ50 Type 10P8C, THT, Side Entry, Unshielded, w-o LED
MJS-208-x1xx-xx
Modular Jack Multi port Side by side RJ50 Type 10P8C, THT PCB Jack Side Entry "Tap down" Unshielded, without LED. Available in 2 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ12 Type 6P6C, THT, Side Entry, Shielded, w-o LED, w-o Filter
MJS-xT6x-SxL0-5x
Modular Jack Multi port Over top, RJ12 Type 6P6C, THT PCB Jack Side Entry Shielded, without LED and without Filter. Available 1x2. Different Gold plating options on the contact area. For other option please check the Technical Datas here down.
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Modular Jack Multi port, RJ12 Type 6P6C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-xT6x-SxL0-5x
Modular Jack Multi port Over top, RJ12 Type 6P6C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Available 1x2 and 4x2 ports. Different Gold plating options on the contact area.
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Modular Jack Multi port, RJ14 Type 6P4C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-xT6x-SxLx-5x
Modular Jack Multi port Over top RJ14 Type 6P4C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Available in 4x2 ports. Different Gold plating options on the contact area.For other option please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P13C, THT, Side Entry, Shielded, with LED with Filter 10-100-1000 Mbps
MJS-2T813-CLLAD-56/FQCA
Modular Jack Multi port Over top RJ45 Type 8P13C, THT PCB Jack Side Entry, with LED with Filter 10/100/1000 Mbps. Available in 1x2 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, with LED with Filter 10-100 Mbps
MJS-2T88-C0LB-9xAxCA
Modular Jack Multi port Over top RJ45 Type 8P8C, THT PCB Jack Side Entry, with LED with Filter 10/100 Mbps. Available in 1x2 ports. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, w-o LED, w-o Filter
MJS-xT88-SxL0-xx/xxx
Modular Jack Multi port Over top RJ45 Type 8P8C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Available in 1x2, 2x2, 2x3, 2x4, 4x2 and 2x8 ports. Different Gold plating options on the contact area.For other option please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Shielded, with LED, w-o Filter
MJS-xT88-x3Lx-xx/xxCx
Modular Jack Multi port Over top RJ45 Type 8P8C, THT PCB Jack Side Entry Unshielded, with LED and without Filter. Available in 2x1 and 2x4,ports. Different Gold plating options on the contact area.For other option please check the Technical Datas here down.
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Modular Jack Multi port, RJ45 Type 8P8C, THT, Side Entry, Unshielded, w-o LED, w-o Filter
MJS-xT88-SxL0-xx
Modular Jack Multi port Over top RJ45 Type 8P8C, THT PCB Jack Side Entry Unshielded, without LED and without Filter. Available in 1x2, 2x2, 4x2 and 6x2 ports. Different Gold plating options on the contact area. For other option please check the Technical Datas here down.
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Modular Jack Combo port, RJ45 Type 8P8C - 1x HDMI, THT, Side Entry, Shielded, with LED
MJS-2H88-LKL0-55/L1CS
Modular Jack Combo port Over top 1x RJ45 Type 8P8C / 1x HDMI, THT. Side Entry, with LED, without filter. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Combo port, RJ45 Type 8P6C - 1x USB A 1.1, 2.0 or 3.0, THT, Side Entry, Shielded, with LED, with Filter 10-100 Mbps
MJS-2Ux86-M0L4-9x/NCA
Modular Jack Combo port Over top 1x RJ45 Type 8P6C / 1x UBS A 1.1, 2.0 or 3.0 options, THT. Side Entry, with LED, with filter 10/100 Mbps. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Combo port, RJ45 Type 8P8C - 2x USB A 1.1 or 2.0, THT, Side Entry, Shielded, with LED, with Filter 10-100 Mbps
MJS-3Ux86-xx3x4-xx/xxCx
Modular Jack Combo port Over top 1x RJ45 Type 8P8C / 2x UBS A 1.1 or 2.0 options, THT. Side Entry, with LED, with filter 10/100 Mbps. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Combo port, RJ45 Type 8P8C - 2x USB A 1.x, THT, Side Entry, Shielded, with LED
MJS-3U88-S0L0-9x/ExCS
Modular Jack Combo port Over top 1x RJ45 Type 8P8C / 2x UBS A 1.x, THT. Side Entry, with LED, without filter. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Combo port, RJ45 Type 8P8C - 1x USB A 1.1 or 2.0, THT, Side Entry, Shielded, w-o LED
MJS-2U88-S0L0-9x/HCS
Modular Jack Combo port Over top 1x RJ45 Type 8P8C / 1x UBS A 1.1 or 2.0, THT. Side Entry, without LED, without filter. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Modular Jack Combo port, RJ45 Type 8P8C - 2x USB A 1.0, THT, Side Entry, Shielded, w-o LED
MJS-3U88-S3L0-5x/ECS
Modular Jack Combo port Over top 1x RJ45 Type 8P8C / 2x UBS A 1.0, THT. Side Entry, without LED, without filter. Different Gold plating options on the contact area. For other options please check the Technical Datas here down.
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Changeover Slide Switch SMT Version
DSS-x0x0xxZ
Changeover Slide Switch SMT in soldering technology, available in Vertical or Horizontal version. Also available in Tropical version.
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Changeover Slide Switch THT Version
DSS-x0x0xxZ
Changeover Slide Switch in THT soldering technology, available in Straight and Right angle Version. Also available in Tropical version.
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Rotary Switch SMT Version, 2.54mm pin to pin
DRD-xxx-xMZ
Rotary Switch SMT Version. Whether 3:3 or 1:4 pin-out. Molded-in terminals and fully seealed construction. Small dimensions 10 x 10 x 5mm. Standards 2.54mm pin to pin and 7.62mm DIP space. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Rotary Switch 1:4 Pin-out, THT Right Angle - (2.54mm - DIP 5.08mm) - Horizontal Operation
DRD-xxx-xFZ
Rotary Switch THT Right Angle Version for horizontal operation. Whether 1:4 pin-out. Available in Flat or Shaft Type. Molded-in terminals and fully seealed construction.Small dimensions 10 x 10 x 5mm. SStandards 2.54mm pin to pin and 5.08mm DIP space. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Rotary Switch 1:4 Pin-out, THT Right Angle - (2.54mm grid) - Horizontal Operation
DRD-xxx-xRZ
Rotary Switch THT Right Angle Version for horizontal operation. Whether 1:4 pin-out. Available in Flat or Shaft Type. Molded-in terminals and fully seealed construction.Small dimensions 10 x 10 x 5mm. Standards 2.54mm grid dimension. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Rotary Switch 3:3 Pin-out, THT Right Angle - (2.54mm - DIP 5.08mm) - Horizontal Operation
DRD-xxx-xFZ
Rotary Switch THT Right Angle Version for horizontal operation. Whether 3:3 pin-out. Available in Flat or Shaft Type. Molded-in terminals and fully seealed construction.Small dimensions 10 x 10 x 5mm. Standards 2.54mm pin to pin and 5.08mm DIP space. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Rotary Switch 3:3 Pin-out, THT Right Angle - (2.54mm grid) - Horizontal Operation
DRD-xxx-xRZ
Rotary Switch THT Right Angle Version for horizontal operation. Whether 3:3 pin-out. Available in Flat or Shaft Type. Molded-in terminals and fully seealed construction.Small dimensions 10 x 10 x 5mm. Standards 2.54mm grid dimension. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Rotary Switch 1:4 Pin-out, THT Straight - (2.54mm - DIP 7.62mm) - Vertical Operation
DRD-xxx-xSZ
Rotary Switch THT Straight Version for vertical operation. Whether 1:4 pin-out. Available in Flat or Shaft Type. Molded-in terminals and fully seealed construction.Small dimensions 10 x 10 x 5mm. Standards 2.54mm pin to pin and 7.62mm DIP space. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Rotary Switch 3:3 Pin-out, THT Straight - (2.54mm - DIP 7.62mm) - Vertical Operation
DRD-xxx-xSZ
Rotary Switch THT Straight Version for vertical operation. Whether 3:3 pin-out. Available in Flat or Shaft Type. Molded-in terminals and fully seealed construction.Small dimensions 10 x 10 x 5mm. Standards 2.54mm pin to pin and 7.62mm DIP space. Binary decimal (8 or 10 positions) and hexadecimal (16 positions). Gold plated contacts to ensure low contact resistance. Terminals Tin plated.
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Slide Type DIP-Switch -End Stackable- SMT. Vertical Operation
DSx-1xx-xxZ
The Slide Type DIP-Switch -End Stackable- can be stacked in the 2.54mm grid. Available in Gull Wing orJ-Leg Type SMT Version for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Slide Type DIP-Switch -Half Pitch- SMT. Vertical Operation
DHx-1xx-xxZ
The Slide Type DIP-Switch -Half Pitch- has 1.27mm pitch can be stacked in the 1.27mm grid. Lowest profile DIP Switch with only 1.80mm above PCB. With Low Profile Actuator. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Slide Type DIP-Switch Tri-State, SMT. Vertical Operation
DTx-1xx-xxZ
The Slide Type DIP-Switch Tri-State with three state (1-open-0) setting function, especially suitable for encoding/decoding of tri-state encoder/decoder integrated circuit to obtain more security codes than traditional two-state operation. Example: 9 bits with "tri-state" yield 19,683 codes versus 512 at two-state. SMT Version, for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors, board washing and for use with suction equipment.
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Slide Type DIP-Switch -Auto Inserting- THT Straight. Vertical Operation
DAH-1xx-xxxxZ
OBSOLETE :
The Slide Type DIP-Switch -Auto Inserting- has the same dimensions and design as an IC and can be assembled by any automatic IC mouting machine. THT Straight Version for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Slide Type DIP-Switch -End Stackable- THT Straight. Vertical Operation
DAM-1xx-xxxxZ
The Slide Type DIP-Switch -End Stackable- can be stacked in the 2.54mm grid and has the same dimensions and design as an IC and can be assembled by any automatic IC mouting machine. THT Straight Version for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Slide Type DIP-Switch -Standard profile- THT Straight . Vertical Operation
DDx-xxx-SxZ
Slide Type DIP-Switch -Standard profile 7.70mm height - THT Straight Version for vertical operation. Single and multiposition switch and Standard Actuator. Epoxy sealed bottom to prevent the penetration of flux during wave soldering. On request Gold or Silver plating also Tape seeling to withstand solder vapors and board washing.
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Slide Type DIP-Switch -Standard profile- THT Straight or Right Angle. Vertical or Horizontal Operation
DDG-xxx-SxZ
Slide Type DIP-Switch -Standard profile 7.70mm height - THT available on Straight or Right Angle Version for vertical or horizontal operation. Single and multiposition switch and Standard or Low Profile Actuator. Epoxy sealed bottom to prevent the penetration of flux during wave soldering. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Slide Type DIP-Switch Tri-State, THT Straight. Vertical Operation
DTx-1xx-xxZ
The Slide Type DIP-Switch Tri-State with three state (1-open-0) setting function, especially suitable for encoding/decoding of tri-state encoder/decoder integrated circuit to obtain more security codes than traditional two-state operation. Example: 9 bits with "tri-state" yield 19,683 codes versus 512 at two-state. THT Straight Version, for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors, board washing and for use with suction equipment.
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Selector Slide Type DIP-Switch, SMT. Vertical Operation
DSP-42-xxxxZ
The Selectror Slide Type DIP-Switch has the same side as an IC and can be assembled by any automaitc mounting machine. SMT Version, for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors, board washing.
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Selector Slide Type DIP-Switch, THT Straight. Vertical Operation
DSP-42-xxxxZ
The Selectror Slide Type DIP-Switch has the same side as an IC and can be assembled by any automaitc mounting machine. THT Straight Version, for vertical operation. With Low Profile or Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors, board washing.
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Piano Type DIP-Switch -Low profile- SMT. End Stackable
DPM-1xx-xx1xxZ
Piano Type DIP-Switch -Low profile 5.00mm height - SMT Version. Can be stacked in the 2.54mm grid. Easy setting on closely racked PCB. Available with Low Profile and Extended Actuator. NOT WASHABLE.
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Piano Type DIP-Switch -Low profile- SMT. Not Stackable
DPA-1xx-xxxxZ
Piano Type DIP-Switch -Low profile 5.70mm height - SMT Version. Not Stackable. Easy setting on closely racked PCB. Available with Low Profile and Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Piano Type DIP-Switch -Low profile- THT Straight. End Stackable
DPI-1xx-xx10Z
Piano Type DIP-Switch -Low profile 5.00mm height - THT Straight Version. Can be stacked in the 2.54mm grid. Easy setting on closely racked PCB. Available with Low Profile and Extended Actuator. NOT WASHABLE.
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Piano Type DIP-Switch -Low profile- THT Straight. Not Stackable
DPH-1xx-xxZ
Piano Type DIP-Switch -Low profile 5.65mm height - THT Straight Version. Not Stackable. Easy setting on closely racked PCB. Available with Low Profile and Extended Actuator. Gold plating. On request Tape seeling to withstand solder vapors and board washing.
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Piano Type DIP-Switch -Standard profile- THT Straight.
DPx-xxx-xxZ
Piano Type DIP-Switch -Standard profile 9.70mm height - THT Straight Version. Easy setting on closely racked PCB. Single and multiposition switch. Available with multiposition circuit and Top Side Off or On Actuator. Epoxy sealed bottom to prevent the penetration of flux during wave soldering. On request Gold or Tin plating also Tape seeling to withstand solder vapors and board washing.
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Cap for Tact Switch LED MultiColor (RGB)
TCP-775-81xxx
Cap for Tact Switch LED MultiColor (RGB). The caps are available in black, silver and transparent as well as with different standard markings. Custom markings can also be implemented.
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Tact Switch LED MultiColor (RGB) THT Right Angle Version. With Cap
TLS-76-R/81-xxx/xxxSx/6SZ
Tact Switch LED MultiColor (RGB) with Cap, THT Right Angle Version. This Led Tact Switch can be operated from above and from the side. The RGB LEDs can be controlled at will and thus almost all colors are available. The caps are available in black, silver and transparent as well as with different standard markings. Custom markings can also be implemented. You only need one switch for different colored applications. Suitable for a variety of applications such as Consumer / Gaming / Medical / Network / Automotive and Audio/Video.
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Tact Switch LED MultiColor (RGB) THT Right Angle Version. Without Cap
TLS-76-R/W/xxxSx/6SZ
Tact Switch LED MultiColor (RGB) without Cap, THT Right Angle Version. This Led Tact Switch can be operated from above and from the side. The RGB LEDs can be controlled at will and thus almost all colors are available. The caps are available in black, silver and transparent as well as with different standard markings. Custom markings can also be implemented. You only need one switch for different colored applications. Suitable for a variety of applications such as Consumer / Gaming / Medical / Network / Automotive and Audio/Video.
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Cap for Tact Switch LED MultiColor(RGB)
TCP-775-81xxx
Cap for Tact Switch LED MultiColor (RGB). The caps are available in black, silver and transparent as well as with different standard markings. Custom markings can also be implemented.
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Tact Switch LED MultiColor (RGB) THT Straight Version. With Cap
TLS-76-S/81-xxx/xxxSx/6SZ
Tact Switch LED MultiColor (RGB) with Cap, THT Straight Version. This Led Tact Switch can be operated from above and from the side. The RGB LEDs can be controlled at will and thus almost all colors are available. The caps are available in black, silver and transparent as well as with different standard markings. Custom markings can also be implemented. You only need one switch for different colored applications. Suitable for a variety of applications such as Consumer / Gaming / Medical / Network / Automotive and Audio/Video.
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Tact Switch LED MultiColor (RGB) THT Straight Version. Without Cap
TLS-76-S/W/xxxSx/6SZ
Tact Switch LED MultiColor (RGB) without Cap, THT Straight Version. This Led Tact Switch can be operated from above and from the side. The RGB LEDs can be controlled at will and thus almost all colors are available. The caps are available in black, silver and transparent as well as with different standard markings. Custom markings can also be implemented. You only need one switch for different colored applications. Suitable for a variety of applications such as Consumer / Gaming / Medical / Network / Automotive and Audio/Video.
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Tact Switch SMT Horizontal Version
TSM-6xx-Rxxxx/xSZ
The Tact Switch SMT Horizontal Version, can be operated from top and from the side. You can choose between short ot long strocke and short or long button adapted to your application.
Here down you can find some exemple from our Tact Switch product but is not possible to you here all the varieties from Tact Switch, please contact us directly as we will help you.
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Tact Switch SMT Vertical Version
TSM-xxx-xxxx/xSZ
The Tact Switch SMT Vertical Version, can be operated from top and from the side. You can choose between short ot long strocke and short or long button adapted to your application. Also available the multi-directional switch.
Here down you can find some exemple from our Tact Switch product but is not possible to you here all the varieties from Tact Switch, please contact us directly as we will help you.
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Tact Switch THT Right Angle Version
TSS-602-Rxxxx/xSZ
The Tact Switch THT Right Angle Version, can be operated from top and from the side. You can choose between short ot long strocke and short or long button adapted to your application.
Here down you can find as exemple the 6x6 family from our Tact Switch product but is not possible to you here all the varieties from Tact Switch, please contact us directly as we will help you.
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Tact Switch THT Straigth Version
TSS-602-xxxx/1SZ
The Tact Switch THT Straight Version, can be operated from top and from the side. You can choose between short ot long strocke and short or long button adapted to your application.
Here down you can find as exemple the 6x6 family from our Tact Switch product but is not possible to you here all the varieties from Tact Switch, please contact us directly as we will help you.
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Standard Patchcord Duplex Multi-Mode OM2
FPC-xx/xx-xx/xx-22D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM2 Multimode 50/125 µm, Duplex.
- Jacket Color Orange. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Standard Patchcord Duplex Multi-Mode OM3
FPC-xx/xx-xx/xx-32D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM3 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Duplex Multi-Mode OM4
FPC-xx/xx-xx/xx-42D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM4 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue or Violet. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Duplex Multi-Mode OM5
FPC-xx/xx-xx/xx-52D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM5 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue or Violet. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Simplex Multi-Mode OM2
FPC-xx/xx-xx/xx-22S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM2 Multimode 50/125 µm, Simplex.
- Jacket Color Orange. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Simplex Multi-Mode OM3
FPC-xx/xx-xx/xx-32S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM3 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Simplex Multi-Mode OM4
FPC-xx/xx-xx/xx-42S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM4 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue or Violet. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Simplex Multi-Mode OM5
FPC-xx/xx-xx/xx-52S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM5 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue or Violet. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Duplex Single-Mode OS2
FPC-xx/xx-xx/xx-92D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OS2 Single Mode 9/125 µm, Duplex.
- Jacket Color Yellow. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Standard Patchcord Simplex Single-Mode OS2
FPC-xx/xx-xx/xx-92S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Standard Level Patchcords are a cost-competitive solution that meets all industry standards.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OS2 Single Mode 9/125 µm, Simplex.
- Jacket Color Yellow. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Reduce Bend Sensitivity (RBS) Patchcord Duplex Multi-Mode OM3
RBS-xx/xx-xx/xx-32D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
RBS Patchcords are made with solid trench assisted optical fiber that is designed to reduce optical loss when the cable is bent. They provide the same high quality, mechanical features and optical performance as our standard patch cords with the added capability of maintaining optical performance when bent or flexed.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Features:
- OM3 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Reduce Bend Sensitivity (RBS) Patchcord Duplex Multi-Mode OM4
RBS-xx/xx-xx/xx-42D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
RBS Patchcords are made with solid trench assisted optical fiber that is designed to reduce optical loss when the cable is bent. They provide the same high quality, mechanical features and optical performance as our standard patch cords with the added capability of maintaining optical performance when bent or flexed.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Features:
- OM4 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue or Violet. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Reduce Bend Sensitivity (RBS) Patchcord Simplex Multi-Mode OM3
RBS-xx/xx-xx/xx-32S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
RBS Patchcords are made with solid trench assisted optical fiber that is designed to reduce optical loss when the cable is bent. They provide the same high quality, mechanical features and optical performance as our standard patch cords with the added capability of maintaining optical performance when bent or flexed.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Features:
- OM3 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 2.00mm (available in 0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Reduce Bend Sensitivity (RBS) Patchcord Simplex Multi-Mode OM4
RBS-xx/xx-xx/xx-42S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
RBS Patchcords are made with solid trench assisted optical fiber that is designed to reduce optical loss when the cable is bent. They provide the same high quality, mechanical features and optical performance as our standard patch cords with the added capability of maintaining optical performance when bent or flexed.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Features:
- OM4 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue or Violet. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Reduce Bend Sensitivity (RBS) Patchcord Duplex Single-Mode OS2
RBSx-xx/xx-xx/xx-92D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
RBS Patchcords are made with solid trench assisted optical fiber that is designed to reduce optical loss when the cable is bent. They provide the same high quality, mechanical features and optical performance as our standard patch cords with the added capability of maintaining optical performance when bent or flexed.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option:
Level A1: G.657A1, ordering code RBS1-
Level A2: G.657A2, ordering code RBS2-
Features:
- OS2 Single Mode 9/125 µm, Duplex.
- Jacket Color Yellow. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Reduce Bend Sensitivity (RBS) Patchcord Simplex Single-Mode OS2
RBSx-xx/xx-xx/xx-92S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
RBS Patchcords are made with solid trench assisted optical fiber that is designed to reduce optical loss when the cable is bent. They provide the same high quality, mechanical features and optical performance as our standard patch cords with the added capability of maintaining optical performance when bent or flexed.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option:
Level A1: G.657A1, ordering code RBS1-
Level A2: G.657A2, ordering code RBS2-
Features:
- OS2 Single Mode 9/125 µm, Simplex.
- Jacket Color Yellow. LSNH.
- Outside standard diameter 2.00mm (0.90mm and 3.00mm on request).
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Armored Patchcord Duplex Multi-Mode OM2
APC-xx/xx-xx/xx-22D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM2 Multimode 50/125 µm, Duplex.
- Jacket Color Gray. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Armored Patchcord Duplex Multi-Mode OM3
APC-xx/xx-xx/xx-32D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM3 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Armored Patchcord Duplex Multi-Mode OM4
APC-xx/xx-xx/xx-42D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM4 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
See more ...
Armored Patchcord Duplex Multi-Mode OM5
APC-xx/xx-xx/xx-52D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM5 Multimode 50/125 µm, Duplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Armored Patchcord Simplex Multi-Mode OM2
APC-xx/xx-xx/xx-22S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM2 Multimode 50/125 µm, Simplex.
- Jacket Color Gray. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Armored Patchcord Simplex Multi-Mode OM3
APC-xx/xx-xx/xx-32S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM3 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Armored Patchcord Simplex Multi-Mode OM4
APC-xx/xx-xx/xx-42S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM4 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Armored Patchcord Simplex Multi-Mode OM5
APC-xx/xx-xx/xx-52S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OM5 Multimode 50/125 µm, Simplex.
- Jacket Color Aqua Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Armored Patchcord Duplex Single-Mode OS2
APC-xx/xx-xx/xx-92D-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OS2 Single Mode 9/125 µm, Duplex.
- Jacket Color Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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Armored Patchcord Simplex Single-Mode OS2
APC-xx/xx-xx/xx-92S-xx.xM
E-tec Interconnect offers a complete line of high performance Fiber Optic Patchcords assemblies under a fast delivery service.
The Armored Fiber Patchcords are designed for directly be used in different harsh environment with its stronger protection than standard Patchcords. The stainless-steel tube prevents optical fiber from damage that improves stability of the system and reduces maintenance cost.
Available with a wide variety of connector termination as E2000, SC, FC, ST, LC, MU, MT-RJ, Din, D4. With PC (physical contact), UPC (Ultra physical contact), APC (Angled physical contact) connector polishing.
The Fiber Optic Patchcords can be customized in length and connecter types to suit your requirement. Every connector on the patch cable can be different.
Available as option Premium Level Patchcords with higher performance and custom options.
Features:
- OS2 Single Mode 9/125 µm, Simplex.
- Jacket Color Blue. LSNH.
- Outside standard diameter 3.00mm
- Low insertion abd back reflection loss
- All Patchcords are 100% tested
- Durability 500 mattings
- Operating Temperature -40 to +75 degrees Celsius
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MPO - MTP Cable Assemblies
MPO / MTP Cable Assemblies
MPO / MTP Cable Assemblies
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Single Loose Tube Cable 2 - 24 Fibers
Single Loose Tube Cable 2 - 24 Fibers
Single Loose Tube Cable 2 - 24 Fibers
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Sliding Patch Panel 19U
Sliding Patch Panel 19 U
Sliding Patch Panel 19"U
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Transceivers
Transceivers
Transceivers
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Attenuators
Attenuators
Attenuators
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1 - Patch Cable Cat 5e Shielded
CBL-3-MF-xx.xM-xx
Patch Cable Cat 5e Shielded, SFTP, 350 Mhz. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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2 - Patch Cable Cat 5e Shielded with Color Ring
CBL-3-MF-xx.xM-xx
Patch Cable Cat 5e Shielded, SFTP, 350 Mhz. with Color Ring on the plug. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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3 - Flat Patch Cable Cat 5e Shielded
CBL-3-MF-xx.xM-xx
Flat Patch Cable Cat 5e Shielded, SFTP, 350 Mhz. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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4 - Slim Patch Cable Cat 5e Shielded
CBL-3-MF-xx.xM-xx
Slim Patch Cable Cat 5e Shielded, SFTP, 350 Mhz. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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5 - Crossed 4-Pair Patch Cable Cat 5e Shielded
CBL-3-MF/R-xx.xM-GY/BK
4-Pair crossed Patch Cable Cat 5e Shielded, SFTP. Available in red color with black overmold and on standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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1 - Patch Cable Cat 5e Unshielded
CBL-3-MU-xx.xM-xx
Patch Cable Cat 5e Unshielded, UTP, 350 Mhz. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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2 - Patch Cable Cat 5e Unshielded with Color Ring
CBL-3-MU-xx.xM-xx
Patch Cable Cat 5e Unshielded, UTP, 350 Mhz. with Color Ring on the plug. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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3 - Flat Patch Cable Cat 5e Unshielded
CBL-3-MU-xx.xM-xx
Flat Patch Cable Cat 5e Unshielded, UTP, 350 Mhz. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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4 - Slim Patch Cable Cat 5e Unshielded
CBL-3-MU-xx.xM-xx
Slim Patch Cable Cat 5e Unshielded, UTP, 350 Mhz. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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5 - Special 2-Pair Patch Cable Cat 5e Unshielded
CBL-3-MU-xx.xM-GN-2P/N
2-Pair Patch Cable Cat 5e Unshielded, UTP. Generally used for telephone installations. Available in green colour and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 & 3 meters. Other lenghts on request.
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6 - Crossed 4-Pair Patch Cable Cat 5e Unshielded
CBL-3-MU/R-xx.xM-RD/BK/N
4-Pair crossed Patch Cable Cat 5e Unshielded, UTP. Available in red color with black overmold and on standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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1 - Patch Cable Cat 6 Shielded
CBL-6-MF-xx.xM-xx/LN
Patch Cable Cat 6 Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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2 - Patch Cable Cat 6 Shielded with Color Ring
CBL-6-MF-xx.xM-xx/LN
Patch Cable Cat 6 Shielded, SFTP, with Color Ring on the plug. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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3 - Flat Patch Cable Cat 6 Shielded
CBL-6-MF-xx.xM-xx/LN
Flat Patch Cable Cat 6 Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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4 - Slim Patch Cable Cat 6 Shielded
CBL-6-MF-xx.xM-xx/LN
Slim Patch Cable Cat 6 Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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1 - Patch Cable Cat 6 Unshielded
CBL-6-MU-xx.xM-xx/N
Patch Cable Cat 6 Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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2 - Patch Cable Cat 6 Unshielded with Color Ring
CBL-6-MU-xx.xM-xx/N
Patch Cable Cat 6 Unshielded, UTP, with Color Ring on the plug. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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3 - Flat Patch Cable Cat 6 Unshielded
CBL-6-MU-xx.xM-xx/N
Flat Patch Cable Cat 6 Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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4 - Slim Patch Cable Cat 6 Unshielded
CBL-6-MU-xx.xM-xx/N
Slim Patch Cable Cat 6 Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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5 - Crossed 4-Pair Patch Cable Cat 6 Unshielded
CBL-6-MU/R-xx.xM-RD/BK/N
4-Pair crossed Patch Cable Cat 6 Unshielded, UTP. Available in red color with black overmold and on standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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1 - Patch Cable Cat 6a Shielded
CBL-6a-MF-xx.xM-xx/LN
Patch Cable Cat 6a Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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2 - Patch Cable Cat 6a Shielded with Color Ring
CBL-6a-MF-xx.xM-xx/LN
Patch Cable Cat 6a Shielded, SFTP, with Color Ring on the plug. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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3 - Flat Patch Cable Cat 6a Shielded
CBL-6a-MF-xx.xM-xx/LN
Flat Patch Cable Cat 6a Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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4 - Slim Patch Cable Cat 6a Shielded
CBL-6a-MF-xx.xM-xx/LN
Slim Patch Cable Cat 6a Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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1 - Patch Cable Cat 6a Unshielded
CBL-6a-MU-xx.xM-xx/N
Patch Cable Cat 6a Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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2 - Patch Cable Cat 6a Unshielded with Color Ring
CBL-6a-MU-xx.xM-xx/N
Patch Cable Cat 6a Unshielded, UTP, with Color Ring on the plug. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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3 - Flat Patch Cable Cat 6a Unshielded
CBL-6a-MU-xx.xM-xx/N
Flat Patch Cable Cat 6a Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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4 - Slim Patch Cable Cat 6a Unshielded
CBL-6a-MU-xx.xM-xx/N
Slim Patch Cable Cat 6a Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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Patch Cable Cat 7 Shielded
CBL-7-MF-xx.xM-xx/LN
Patch Cable Cat 7 Shielded, SFTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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Patch Cable Cat 7 Unshielded
CBL-7-MU-xx.xM-xx/N
Patch Cable Cat 7 Unshielded, UTP. Available in different range of colours and with standard cable lengths : 0.3 / 0.6 / 1 / 1.5 / 2 / 3 / 5 / 7 / 10 & 20 meters. Other lenghts on request.
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1 - Bulk Cable Cat 5e Shielded, Stranded, 2 Pairs
CBL-3-SS-2P-3-GY
Bulk Cable Cat 5e Shielded, Stranded, 2 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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2 - Bulk Cable Cat 5e Shielded, Solid, 4 Pairs 100 Mhz
CBL-3-FM-4P-3-GY
Bulk Cable Cat 5e Shielded, Solid, 4 Pairs, 100 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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3 - Bulk Cable Cat 5e Shielded, Stranded, 4 Pairs
CBL-3-FS-4P-3-GY
Bulk Cable Cat 5e Shielded, Stranded, 4 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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4 - Bulk Cable Cat 5e Shielded, Solid, 4 Pairs 350 Mhz
CBL-3-SM-4P-3-GY
Bulk Cable Cat 5e Shielded, Solid, 4 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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1 - Bulk Cable Cat 5e Unshielded, Solid, 2 Pairs
CBL-3-UM-2P-3-GY
Bulk Cable Cat 5e Unshielded, Solid, 2 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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2 - Bulk Cable Cat 5e Unshielded, Solid, 4 Pairs
CBL-3-UM-4P-3-GY
Bulk Cable Cat 5e Unshielded, Solid, 4 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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3 - Bulk Cable Cat 5e Unshielded, Stranded, 4 Pairs
CBL-3-US-2P-3-GY
Bulk Cable Cat 5e Unshielded, Stranded, 4 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey. Other Colours and lenghts on request
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1 - Bulk Cable Cat 6 Unshielded, Solid, 4 Pairs
CBL-6-UM-4P-3-xx
Bulk Cable Cat 6 Unshielded, Solid, 4 Pairs, 350 Mhz, Box 305 Meters. Standard color Grey and Green. Other Colours and lenghts on request
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1U Universal Dual plate patch panel 12-Ports (Empty)
PLK-D-12-1U-0-M
Empty 12 - Ports Universal 1U Dual plate patch panel for vertical or horizontal keystone jacks and optical adapters
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1U Universal Dual plate patch panel 16-Ports (Empty)
PLK-D-16-1U-0-M
Empty 16 - Ports Universal 1U Dual plate patch panel for vertical or horizontal keystone jacks and optical adapters
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1U Vertical patch panel 24-Ports Cat 5e shielded
PLV-5-F-24-D-0-1
1U Vertical patch panel 24-Ports Cat 5e shielded. With dual Type Jack. Black
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1U Horizontal patch panel 24-Ports Cat 5e unshielded
PLH-5-U-24-D-0-0-M
1U Horizontal patch panel 24-Ports Cat 5e unshielded. W/O Dust cover. Black
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1U Vertical patch panel 24-Ports Cat 6 shielded
PLV-6-F-24-D-0-1
1U Vertical patch panel 24-Ports Cat 6 shielded. With dual Type Jack. Black
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1U Horizontal patch panel 24-Ports Cat 6 unshielded
PLH-6-U-24-D-0-0-M
1U Horizontal patch panel 24-Ports Cat 6 unshielded. W/O Dust cover. Black
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Cable Management Bar
Cable Management Bar Code
Cable Management Bar
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Inline Coupler Slim RJ-45 Cat 6 unshielded
ILC-6-U-KT-S-B
Inline Coupler Slim RJ-45 Cat 6 unshielded. Black Color
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Keystone Jack Slim Horizontal Cat 5e unshielded
KSJ-5-H-U-D-1-W
Keystone Jack Slim Horizontal Cat 5e unshielded. Dual. White Color
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Keystone Jack Slim Vertical Cat 6 shielded
KSJ-6-V-S-D-1-M
Keystone Jack Slim Vertical Cat 6 shielded. Dual. Metal Color
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Wall Socket RJ45
Wall Socket RJ45 Code
Wall Socket RJ45
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Media Converter
Media Converter CODE
Media Converter
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Transceivers
Transceivers CODE
Transceivers
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Color Rings for Patch Cables
Color Rings CODE
Color Rings for Patch Cables
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Gigabit Transceiver
Transceivers
Gigabit Transceiver
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Media Converter BaseT 10Gb
Media Converter BaseT 10Gb
Media Converter BaseT 10Gb
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Patch Panel Universal 19 U Fiber
Patch Panel 19 U Fiber
Patch Panel Universal 19" U Fiber
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Lockable Wall Boxes Fiber Optic
Lockable Wall Boxes Fiber Optic
Lockable Wall Boxes Fiber Optic
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E2000 UPC Single Mode Female - Female adapter
E2000 UPC Single Mode Female - Female adapter
E2000 UPC Single Mode Female - Female adapter
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Cable Management Bar
Cable Management Bar
Cable Management Bar
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Splice Sleeve (30mm, 40mm or 60mm)
Splice Sleeve (30mm, 40mm or 60mm)
Splice Sleeve (30mm, 40mm or 60mm)
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Burn-in Socket Solderless Open Top for BGA Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
BPT-xxx-04-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40mm up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for BGA Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
MPS-xxx-04-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40mm up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket Solderless Open Top for BGA Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
BPT-xxx-05-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for BGA Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
MPS-xxx-05-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket Solderless Open Top for BGA Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
BPT-xxx-08-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.80 up to 0.99mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for BGA Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
MPS-xxx-08-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.80 up to 0.99mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket Solderless Open Top for BGA Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
BPT-xxx-10-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for BGA Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
MPS-xxx-10-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket Solderless Open Top for BGA Package 1.27 mm pitch (from 1.27 mm to upwards)
BPT-xxx-12-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for BGA Package 1.27 mm pitch (from 1.27 mm to upwards)
MPS-xxx-12-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
MPS-xxx-04-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40mm up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for eMMC Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
MPS-xxx-05-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
MPS-xxx-08-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.80 up to 0.99mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
MPS-xxx-10-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for eMMC Package 1.27 mm pitch (from 1.27 mm to upwards)
MPS-xxx-12-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for LGA Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
MPS-xxx-04-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40mm up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for LGA Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
MPS-xxx-05-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Open Top for LGA Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
MPS-xxx-08-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.80 up to 0.99mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Open Top for LGA Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
MPS-xxx-10-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Open Top for LGA Package 1.27 mm pitch (from 1.27 mm to upwards)
MPS-xxx-12-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Clamshell for QFN Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QMC-xxx-04-xx.x/xx
Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
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Burn-in Socket THT Open Top for QFN Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
QOT-xxx-04-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40mm up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Clamshell for QFN Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QMC-xxx-05-xx.x/xx
Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
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Burn-in Socket THT Open Top for QFN Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
QOT-xxx-05-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Clamshell for QFN Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QMC-xxx-08-xx.x/xx
Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
See more ...
Burn-in Socket THT Open Top for QFN Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
QOT-xxx-08-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.80 up to 0.99mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Clamshell for QFN Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QMC-xxx-10-xx.x/xx
Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
See more ...
Burn-in Socket THT Open Top for QFN Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
QOT-xxx-10-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Clamshell for QFN Package 1.27 mm pitch (from 1.27 mm to upwards)
QMC-xxx-12-xx.x/xx
Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
See more ...
Burn-in Socket THT Open Top for QFN Package 1.27 mm pitch (from 1.27 mm to upwards)
QOT-xxx-12-xx.x/xx
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for SOP Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
OTZ-xxx-04-xx.x/xx.x/xx.x
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40mm up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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Burn-in Socket THT Open Top for SOP Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
OTZ-xxx-05-xx.x/xx.x/xx.x
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Open Top for SOP Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
OTZ-xxx-08-xx.x/xx.x/xx.x
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.80 up to 0.99mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Open Top for SOP Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
OTZ-xxx-10-xx.x/xx.x/xx.x
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket THT Open Top for SOP Package 1.27 mm pitch (from 1.27 mm to upwards)
OTZ-xxx-12-xx.x/xx.x/xx.x
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
See more ...
Burn-in Socket for CGA - PGA - PGI Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)
OTM-
Burn-in Sockets for CGA / PGA / PGI Package only available on Test Socket versions.
Please click - DIRECT LINK - to have directs access to the Test Socket
Thanks for your understanding
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Burn-in Socket for CGA - PGA - PGI Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)
OTM-
Burn-in Sockets for CGA / PGA / PGI Package only available on Test Socket versions.
Please click - DIRECT LINK - to have directs access to the Test Socket
Thanks for your understanding
See more ...
Burn-in Socket for CGA - PGA - PGI Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)
OTM-
Burn-in Sockets for CGA / PGA / PGI Package only available on Test Socket versions.
Please click - DIRECT LINK - to have directs access to the Test Socket
Thanks for your understanding
See more ...
Burn-in Socket for CGA - PGA - PGI Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)
OTM-
Burn-in Sockets for CGA / PGA / PGI Package only available on Test Socket versions.
Please click - DIRECT LINK - to have directs access to the Test Socket
Thanks for your understanding
See more ...
Burn-in Socket for CGA - PGA - PGI Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
OTM-
Burn-in Sockets for CGA / PGA / PGI Package only available on Test Socket versions.
Please click - DIRECT LINK - to have directs access to the Test Socket
Thanks for your understanding
See more ...
Burn-in Socket for CGA - PGA - PGI Package 1.27 mm pitch (from 1.27 mm to upwards)
OTM-
Burn-in Sockets for CGA / PGA / PGI Package only available on Test Socket versions.
Please click - DIRECT LINK - to have directs access to the Test Socket
Thanks for your understanding
See more ...