E-tec Interconnect ZIF-Pro BGA Image Sensor Sockets provide higher reliability thanks the special contacts ensure security of the imager while maintaining in contact.
The sensors can easily be placed into the socket and take away easly, to upgrade process, thanks the special Zero Insertion force system.

We offer any pin-out, configuration and grid side down to 0.50mm pitch

The E-tec Interconnect ZIF-Pro BGA Image Sensor Sockets can be fix to your PCB by the follow technologies :

Through-hole (THT) soldering
Standard Surface mount (SMT) soldering
Solderball Surface mount (SMT) soldering
Solderless Compression Technology


This protect your device from high temperature during the soldering process, cleaning process, shocks, etc..

E-tec Interconnect can provide you a largest line of Image Sensor Sockets for Imaging industry. Our sockets are created for:

Sony, Teledyne, Kodak, Motorola, and all other manufacturer, please send us your request.