Test Sockets & Adapters > Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package > Pitch from 1.00mm to 1.26mm > Through-hole (THT) soldering Test Socket > Clamshell Alu (> 200 contacts) > 
Clamshell Alu (> 200 contacts)
Clamshell Alu (> 200 contacts) 1.00 mm pitch (from 1.00 mm to 1.26 mm) |
|
|
BUJ####-107#-#######5# The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket. |