Test Sockets & Adapters > Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package > Pitch from 0.50mm to 0.79mm > Through-hole (THT) soldering Test Socket > Clamshell Alu (> 200 contacts) > 
Clamshell Alu (> 200 contacts)
Clamshell Alu (> 200 contacts) 0.50 mm pitch (from 0.50 mm to 0.79 mm) |
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BUJ####-0570-######95# The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket. |