- Test Sockets and Adapters
- Test Sockets for LGA - QFN - MLF - MLP - LCC Package
- Pitch from 1.27mm to upwards
- Through-hole (THT) soldering Test Socket
- TwistLock 1.27 mm pitch (from 1.27 mm upwards)
- FastLock 1.27 mm pitch (from 1.27 mm upwards)
- SpringLock 1.27 mm pitch (from 1.27 mm upwards)
- Open Clamshell Alu (< 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)
- Clamshell Alu (> 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)
- Open Lever Clamshell Alu (< 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)
- ScrewLock 1.27 mm pitch (from 1.27 mm upwards)
- Open QuickLock (< 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)
- QuickLock (> 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)
- Injection Molded Clamshell 1.27 mm pitch (from 1.27 mm upwards)
- ReverseLock 1.27 mm pitch (from 1.27 mm upwards)
- SlimLock 1.27 mm pitch (from 1.27 mm upwards)
- Through-hole (THT) soldering Test Socket
- Pitch from 1.27mm to upwards
- Test Sockets for LGA - QFN - MLF - MLP - LCC Package
Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
Part Number
LPM####-127#-#######5#
Keywords : LPM####-127#-#######5#,Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)
Address
E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland
Contacts
Email : info [ at ] e-tec.com
Phone : +41 32 654 15 50
Fax : +41 32 652 26 93
Contact : Pablo Rodriguez